| Фото | Парт. № производителя | Наличие | Количество | Техническая документация | Серия | Упаковка | Состояние продукта | Тип | Количество положений или контактов (сетка) | Шаг - Сопряжение | Отделка контакта - Сопряжение | Толщина отделки контакта - Сопряжение | Материал контакта - Сопряжение | Тип крепления | Особенности | Оконечная нагрузка | Шаг - Пост | Отделка контакта - Пост | Толщина отделки контакта - Пост | Материал контакта - Пост | Материал корпуса | Рабочая температура | 
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
|   | 2-210735-5CONN SOCKET SIP 25POS TIN-LEAD | 2,768 |  |   Техническая документация | - | Bulk | Obsolete | SIP | 25 (1 x 25) | 0.100" (2.54mm) | Tin-Lead | - | Beryllium Copper | Through Hole | - | Solder | 0.100" (2.54mm) | Tin-Lead | - | - | Thermoplastic | - | 
|   | 8080-1G45CONN TRANSIST TO-3 3POS TIN | 2,098 |  |   Техническая документация | 8060 | Bulk | Obsolete | Transistor, TO-3 | 3 (Oval) | - | Tin | - | Beryllium Copper | Chassis Mount | Closed Frame | Solder | - | Tin | - | Beryllium Copper | Polytetrafluoroethylene (PTFE) | -55°C ~ 125°C | 
|   | 820-AG10D-ESCONN IC DIP SOCKET 20POS GOLD | 1,188 |  |   Техническая документация | 800 | Tube | Obsolete | DIP, 0.3" (7.62mm) Row Spacing | 20 (2 x 10) | 0.100" (2.54mm) | Gold | 25.0µin (0.63µm) | Copper Alloy | Through Hole | Open Frame | Solder | 0.100" (2.54mm) | - | - | - | Polyester | -55°C ~ 105°C | 
|   | 5-1437542-2CONN IC DIP SOCKET 28POS GOLD | 2,643 |  |   Техническая документация | 700 | - | Obsolete | DIP, 0.6" (15.24mm) Row Spacing | 28 (2 x 14) | 0.100" (2.54mm) | Gold | 20.0µin (0.51µm) | Beryllium Copper | Through Hole | Carrier, Closed Frame | Solder | 0.100" (2.54mm) | Gold | 20.0µin (0.51µm) | Beryllium Copper | Aluminum Alloy | -55°C ~ 125°C | 
|   | 643647-6CONN SOCKET SIP 15POS TIN | 4,653 |  |   Техническая документация | Diplomate DL | Tray | Active | SIP | 15 (1 x 15) | 0.100" (2.54mm) | Tin | - | Beryllium Copper | Through Hole | Closed Frame | Solder | 0.100" (2.54mm) | Tin | - | Beryllium Copper | Thermoplastic, Glass Filled | -55°C ~ 105°C | 
|   | 9-1437530-4CONN SOCKET SIP 11POS | 2,339 |  |   Техническая документация | 500 | Bulk | Obsolete | SIP | 11 (1 x 11) | 0.100" (2.54mm) | - | - | Beryllium Copper | Through Hole | - | Solder | 0.100" (2.54mm) | - | - | Beryllium Copper | Thermoplastic | - | 
|   | 824-AG32DCONN IC DIP SOCKET 24POS TINLEAD | 4,733 |  |   Техническая документация | 800 | Tube | Obsolete | DIP, 0.3" (7.62mm) Row Spacing | 24 (2 x 12) | 0.100" (2.54mm) | Tin-Lead | 80.0µin (2.03µm) | Copper Alloy | Through Hole | Open Frame | Solder | 0.100" (2.54mm) | Tin-Lead | - | Copper Alloy | Polyester | -55°C ~ 105°C | 
|   | 1-390261-5CONN IC DIP SOCKET 18POS TIN | 3,648 |  |   Техническая документация | - | Tube | Obsolete | DIP, 0.3" (7.62mm) Row Spacing | 18 (2 x 9) | 0.100" (2.54mm) | Tin | 60.0µin (1.52µm) | Phosphor Bronze | Through Hole | Open Frame | Solder | 0.100" (2.54mm) | Tin | 60.0µin (1.52µm) | Phosphor Bronze | - | -40°C ~ 105°C | 
|   | 8080-1G17CONN TRANSIST TO-3 3POS TIN | 3,044 |  |   Техническая документация | 8060 | Bulk | Obsolete | Transistor, TO-3 | 3 (Oval) | - | Tin | - | Beryllium Copper | Chassis Mount | Closed Frame | Solder | - | Tin | - | Beryllium Copper | Polytetrafluoroethylene (PTFE) | -55°C ~ 125°C | 
|   | 8080-1G25CONN TRANSIST TO-3 3POS GOLD | 3,277 |  |   Техническая документация | 8060 | Bulk | Obsolete | Transistor, TO-3 | 3 (Oval) | - | Gold | - | Beryllium Copper | Chassis Mount | Closed Frame | Solder | - | Gold | - | Beryllium Copper | Polytetrafluoroethylene (PTFE) | -55°C ~ 125°C | 
|  | 8059-2G8CONN TRANSIST TO-5 8POS GOLD | 2,252 |  |   Техническая документация | 8058 | Bulk | Obsolete | Transistor, TO-5 | 8 (Round) | - | Gold | - | Beryllium Copper | Through Hole | Closed Frame | Solder | - | Gold | - | Brass | Polytetrafluoroethylene (PTFE) | -55°C ~ 125°C | 
|   | 1825094-4CONN IC DIP SOCKET 16POS GOLD | 4,429 |  |   Техническая документация | Diplomate DL | Tube | Obsolete | DIP, 0.3" (7.62mm) Row Spacing | 16 (2 x 8) | 0.100" (2.54mm) | Gold | 15.0µin (0.38µm) | Phosphor Bronze | Through Hole | Closed Frame | Solder | 0.100" (2.54mm) | Gold | 15.0µin (0.38µm) | Phosphor Bronze | Thermoplastic, Glass Filled | -55°C ~ 125°C | 
|  | 1825109-3CONN IC DIP SOCKET 40POS GOLD | 2,389 |  |   Техническая документация | Diplomate DL | Tube | Obsolete | DIP, 0.6" (15.24mm) Row Spacing | 40 (2 x 20) | 0.100" (2.54mm) | Gold | 15.0µin (0.38µm) | Phosphor Bronze | Through Hole | Open Frame | Solder | 0.100" (2.54mm) | Gold | 15.0µin (0.38µm) | Phosphor Bronze | Thermoplastic, Glass Filled | -55°C ~ 125°C | 
|   | 1825276-2CONN IC DIP SOCKET 32POS GOLD | 1,657 |  |   Техническая документация | Diplomate DL | Tube | Obsolete | DIP, 0.6" (15.24mm) Row Spacing | 32 (2 x 16) | 0.100" (2.54mm) | Gold | 15.0µin (0.38µm) | Phosphor Bronze | Through Hole | Open Frame | Solder | 0.100" (2.54mm) | Gold | 15.0µin (0.38µm) | Phosphor Bronze | Thermoplastic, Glass Filled | -55°C ~ 125°C | 
|  | 2-821949-4CONN SOCKET PQFP 100POS TIN-LEAD | 4,122 |  |   Техническая документация | - | Tube | Obsolete | QFP | 100 (4 x 25) | 0.050" (1.27mm) | Tin-Lead | 200.0µin (5.08µm) | Phosphor Bronze | Through Hole | Closed Frame | Solder | 0.050" (1.27mm) | Tin-Lead | 200.0µin (5.08µm) | Phosphor Bronze | Liquid Crystal Polymer (LCP) | - | 
|   | SIP1X06-014BLFCONN SOCKET SIP 6POS TIN | 2,637 |  |   Техническая документация | SIP1x | Bulk | Obsolete | SIP | 6 (1 x 6) | 0.100" (2.54mm) | Tin | 150.0µin (3.81µm) | Beryllium Copper | Through Hole | Closed Frame | Solder | 0.100" (2.54mm) | Tin | 200.0µin (5.08µm) | Brass | Polyphenylene Sulfide (PPS), Glass Filled | - | 
|   | SIP1X05-014BLFCONN SOCKET SIP 5POS TIN | 3,822 |  |   Техническая документация | SIP1x | Bulk | Obsolete | SIP | 5 (1 x 5) | 0.100" (2.54mm) | Tin | 150.0µin (3.81µm) | Beryllium Copper | Through Hole | Closed Frame | Solder | 0.100" (2.54mm) | Tin | 200.0µin (5.08µm) | Brass | Polyphenylene Sulfide (PPS), Glass Filled | - | 
|   | SIP1X08-011BLFCONN SOCKET SIP 8POS GOLD | 2,198 |  |   Техническая документация | SIP1x | Bulk | Obsolete | SIP | 8 (1 x 8) | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Beryllium Copper | Through Hole | Closed Frame | Solder | 0.100" (2.54mm) | Tin | 200.0µin (5.08µm) | Brass | Polyphenylene Sulfide (PPS), Glass Filled | - | 
|   | SIP1X07-014BLFCONN SOCKET SIP 7POS TIN | 2,527 |  |   Техническая документация | SIP1x | Bulk | Obsolete | SIP | 7 (1 x 7) | 0.100" (2.54mm) | Tin | 150.0µin (3.81µm) | Beryllium Copper | Through Hole | Closed Frame | Solder | 0.100" (2.54mm) | Tin | 200.0µin (5.08µm) | Brass | Polyphenylene Sulfide (PPS), Glass Filled | - | 
|   | SIP1X06-011BLFCONN SOCKET SIP 6POS GOLD | 1,039 |  |   Техническая документация | SIP1x | Bulk | Obsolete | SIP | 6 (1 x 6) | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Beryllium Copper | Through Hole | Closed Frame | Solder | 0.100" (2.54mm) | Tin | 200.0µin (5.08µm) | Brass | Polyphenylene Sulfide (PPS), Glass Filled | - |