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| Фото | Парт. № производителя | Наличие | Количество | Техническая документация | Серия | Упаковка | Состояние продукта | Тип | Количество положений или контактов (сетка) | Шаг - Сопряжение | Отделка контакта - Сопряжение | Толщина отделки контакта - Сопряжение | Материал контакта - Сопряжение | Тип крепления | Особенности | Оконечная нагрузка | Шаг - Пост | Отделка контакта - Пост | Толщина отделки контакта - Пост | Материал контакта - Пост | Материал корпуса | Рабочая температура |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
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APH-1732-G-TAPH-1732-G-T |
2,905 |
|
Техническая документация |
* | - | Active | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - |
|
|
APO-640-G-T.100" LOW PROFILE SCREW MACHINE |
2,836 |
|
Техническая документация |
APO | Bulk | Active | DIP, 0.6" (15.24mm) Row Spacing | 40 (2 x 20) | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Phosphor Bronze | Through Hole | Open Frame | Solder | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Phosphor Bronze | Polybutylene Terephthalate (PBT), Glass Filled | - |
|
|
HLS-0316-G-32.100" SCREW MACHINE SOCKET ARRAY |
4,466 |
|
Техническая документация |
HLS | Tube | Active | SIP | 48 (3 x 16) | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | - | Through Hole | Closed Frame | Solder | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | - | Thermoplastic | -55°C ~ 140°C |
|
714-43-260-31-018000CONN IC DIP SOCKET 60POS GOLD |
4,821 |
|
Техническая документация |
714 | Bulk | Active | DIP, 0.1" (2.54mm) Row Spacing | 60 (2 x 30) | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Through Hole | Carrier, Closed Frame | Solder | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | Brass Alloy | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester | -55°C ~ 125°C |
|
|
APH-0924-G-TAPH-0924-G-T |
1,709 |
|
Техническая документация |
* | - | Active | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - |
|
|
APH-1424-G-TAPH-1424-G-T |
1,080 |
|
Техническая документация |
* | - | Active | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - |
|
|
APH-1924-G-TAPH-1924-G-T |
3,274 |
|
Техническая документация |
* | - | Active | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - |
|
|
APH-1524-G-TAPH-1524-G-T |
4,132 |
|
Техническая документация |
* | - | Active | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - |
|
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APH-0624-G-TAPH-0624-G-T |
1,838 |
|
Техническая документация |
* | - | Active | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - |
|
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APH-1224-G-TAPH-1224-G-T |
3,794 |
|
Техническая документация |
* | - | Active | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - |
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APH-0424-G-TAPH-0424-G-T |
4,457 |
|
Техническая документация |
* | - | Active | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - |
|
|
APH-0324-G-TAPH-0324-G-T |
1,903 |
|
Техническая документация |
* | - | Active | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - |
|
|
546-87-304-14-051147CONN SOCKET PGA 304POS GOLD |
3,144 |
|
Техническая документация |
546 | Bulk | Active | PGA | 304 (14 x 14) | 0.050" (1.27mm) | Gold | Flash | Beryllium Copper | Through Hole | Open Frame | Press-Fit | 0.100" (2.54mm) | Tin | - | Bronze | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled | -55°C ~ 125°C |
|
|
HLS-0420-G-2.100" SCREW MACHINE SOCKET ARRAY |
1,014 |
|
Техническая документация |
HLS | Bulk | Active | SIP | 80 (4 x 20) | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | - | Through Hole | Closed Frame | Solder | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | - | Thermoplastic | -55°C ~ 140°C |
|
|
HLS-0512-T-18.100" SCREW MACHINE SOCKET ARRAY |
2,638 |
|
Техническая документация |
HLS | Bulk | Active | SIP | 60 (5 x 12) | 0.100" (2.54mm) | Tin | - | - | Through Hole | Closed Frame | Solder | 0.100" (2.54mm) | - | - | - | Thermoplastic | -55°C ~ 140°C |
|
|
40-C182-21CONN IC DIP SOCKET 40POS GOLD |
1,147 |
|
Техническая документация |
EJECT-A-DIP™ | Bulk | Active | DIP, 0.6" (15.24mm) Row Spacing | 40 (2 x 20) | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Beryllium Copper | Surface Mount | Closed Frame | Solder | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Brass | Polyamide (PA46), Nylon 4/6, Glass Filled | -55°C ~ 125°C |
|
|
40-C182-31CONN IC DIP SOCKET 40POS GOLD |
4,821 |
|
Техническая документация |
EJECT-A-DIP™ | Bulk | Active | DIP, 0.6" (15.24mm) Row Spacing | 40 (2 x 20) | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Beryllium Copper | Surface Mount | Closed Frame | Solder | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Brass | Polyamide (PA46), Nylon 4/6, Glass Filled | -55°C ~ 125°C |
|
|
40-C212-21CONN IC DIP SOCKET 40POS GOLD |
3,665 |
|
Техническая документация |
EJECT-A-DIP™ | Bulk | Active | DIP, 0.6" (15.24mm) Row Spacing | 40 (2 x 20) | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Beryllium Copper | Through Hole | Closed Frame | Wire Wrap | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Brass | Polyamide (PA46), Nylon 4/6, Glass Filled | -55°C ~ 125°C |
|
|
40-C212-31CONN IC DIP SOCKET 40POS GOLD |
2,863 |
|
Техническая документация |
EJECT-A-DIP™ | Bulk | Active | DIP, 0.6" (15.24mm) Row Spacing | 40 (2 x 20) | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Beryllium Copper | Through Hole | Closed Frame | Wire Wrap | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Brass | Polyamide (PA46), Nylon 4/6, Glass Filled | -55°C ~ 125°C |
|
|
40-C300-31CONN IC DIP SOCKET 40POS GOLD |
2,322 |
|
Техническая документация |
EJECT-A-DIP™ | Bulk | Active | DIP, 0.6" (15.24mm) Row Spacing | 40 (2 x 20) | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Beryllium Copper | Through Hole | Closed Frame | Wire Wrap | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Brass | Polyamide (PA46), Nylon 4/6, Glass Filled | -55°C ~ 125°C |
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