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| Фото | Парт. № производителя | Наличие | Количество | Техническая документация | Серия | Упаковка | Состояние продукта | Тип | Состав | Диаметр | Точка плавления | Тип флюса | Сечение провода | Тип сетки | Процесс | Форма | Срок хранения | Начало срока годности | Температура хранения/охлаждения |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
|
WC96L2031ESAC 305 NO CLEAN 8 OZ .031 DIA. |
2,005 |
|
Техническая документация |
- | Spool | Active | Wire Solder | Sn96.5Ag3Cu0.5 (96.5/3/0.5) | 0.031" (0.79mm) | 423 ~ 424°F (217 ~ 218°C) | No-Clean | 20 AWG, 22 SWG | - | Lead Free | Spool, 8 oz (227g), 1/2 lb | 24 Months | Date of Manufacture | 50°F ~ 104°F (10°C ~ 40°C) |
|
RCBLF22701062PBLF 227 ROSIN FLUX 1 LB. 062 DIA |
2,923 |
|
Техническая документация |
- | Spool | Active | Wire Solder | BLF 227 (99.17Sn/.8Cu/.03Ni) | 0.062" (1.57mm) | 440°F (227°C) | Rosin Activated (RA) | 14 AWG, 16 SWG | - | Lead Free | Spool, 1 lb (453.59g) | 24 Months | Date of Manufacture | 50°F ~ 104°F (10°C ~ 40°C) |
|
RC96L2020CQPJSAC 305 ROSIN FLUX 8 OZ. .020 DI |
3,604 |
|
Техническая документация |
- | Spool | Active | Wire Solder | Sn96.5Ag3Cu0.5 (96.5/3/0.5) | 0.020" (0.51mm) | 423 ~ 424°F (217 ~ 218°C) | Rosin Activated (RA) | 24 AWG, 25 SWG | - | Lead Free | Spool, 8 oz (227g), 1/2 lb | 24 Months | Date of Manufacture | 50°F ~ 104°F (10°C ~ 40°C) |
|
SW SN63 .062 1#SN63PB37 .062 DIA 1 lb. Spool |
100 |
|
Техническая документация |
- | Tape & Box (TB) | Active | Wire Solder | Sn63Pb37 (63/37) | 0.062" (1.57mm) | 361°F (183°C) | - | 14 AWG | - | Leaded | Spool, 1 lb (454 g) | - | Date of Manufacture | Room Temperature |
|
CCBLF22701031PBLF 227 NO CLEAN FLUX 1 LB. 031D |
4,250 |
|
Техническая документация |
- | Spool | Active | Wire Solder | BLF 227 (99.17Sn/.8Cu/.03Ni) | 0.031" (0.79mm) | 440°F (227°C) | No-Clean | 20 AWG, 22 SWG | - | Lead Free | Spool, 1 lb (453.59g) | 24 Months | Date of Manufacture | 50°F ~ 104°F (10°C ~ 40°C) |
|
RCBLF22701031PBLF 227 ROSIN FLUX 1 LB. 031DIA |
1,440 |
|
Техническая документация |
- | Spool | Active | Wire Solder | BLF 227 (99.17Sn/.8Cu/.03Ni) | 0.031" (0.79mm) | 440°F (227°C) | Rosin Activated (RA) | 20 AWG, 22 SWG | - | Lead Free | Spool, 1 lb (453.59g) | 24 Months | Date of Manufacture | 50°F ~ 104°F (10°C ~ 40°C) |
|
JPAGSC0501PSIL CAN 5 BRAZING ALLOY |
1,449 |
|
Техническая документация |
- | Tube | Active | Brazing Rod | 5% Ag 89% Cu, 6% Phos | - | 1190/1495°F (1190/1495°F) | - | - | - | Lead Free | Tube, 1 lb (454g) | - | - | 50°F ~ 104°F (10°C ~ 40°C) |
|
RCBLF22701020PBLF227 ROSIN FLUX 1 LB. .020 DIA |
1,924 |
|
Техническая документация |
- | Spool | Active | Wire Solder | BLF 227 (99.17Sn/.8Cu/.03Ni) | 0.020" (0.51mm) | 440°F (227°C) | Rosin Activated (RA) | 24 AWG, 25 SWG | - | Lead Free | Spool, 1 lb (453.59g) | 24 Months | Date of Manufacture | 50°F ~ 104°F (10°C ~ 40°C) |
|
|
SW SN60 .062 1#Sn60Pb40 .062 dia 1 lb. spool |
100 |
|
Техническая документация |
- | Tape & Box (TB) | Active | Wire Solder | Sn60Pb40 (60/40) | 0.062" (1.57mm) | 361°F (183°C) | - | 14 AWG | - | Leaded | Spool, 1 lb (454 g) | - | Date of Manufacture | Room Temperature |
|
|
SW SN60 .125 1#60% TIN, 40% LEAD, SOLID WIRE WA |
100 |
|
Техническая документация |
- | Tape & Box (TB) | Active | - | - | - | - | - | - | - | - | - | - | - | - |
|
|
SW SN97CU3 .12597% Tin, 3% Copper, .125 dia on |
100 |
|
Техническая документация |
- | Tape & Box (TB) | Active | - | - | - | - | - | - | - | - | - | - | - | - |
|
CCBLF22701062BLF 227 NO CLEAN 1 LB. 062 CORE |
100 |
|
Техническая документация |
- | Spool | Active | Wire Solder | BLF 227 (99.17Sn/.8Cu/.03Ni) | 0.062" (1.57mm) | 440°F (227°C) | No-Clean | 14 AWG, 16 SWG | - | Lead Free | Spool, 1 lb (453.59g) | 24 Months | Date of Manufacture | 50°F ~ 104°F (10°C ~ 40°C) |
|
WC9601062PSACSAC 305 WATER SOLUBLE FLUX 1 LB. |
4,275 |
|
Техническая документация |
- | Spool | Active | Wire Solder | Sn96.5Ag3Cu0.5 (96.5/3/0.5) | 0.062" (1.57mm) | 423 ~ 424°F (217 ~ 218°C) | Water Soluble | 14 AWG, 16 SWG | - | Lead Free | Spool, 1 lb (453.59g) | 24 Months | Date of Manufacture | 50°F ~ 104°F (10°C ~ 40°C) |
|
|
CC9601031PAG3SAC 305 NO CLEAN 1 LB. .031 DIA |
2,603 |
|
Техническая документация |
- | Spool | Active | Wire Solder | Sn96.5Ag3Cu0.5 (96.5/3/0.5) | 0.031" (0.79mm) | 423 ~ 424°F (217 ~ 218°C) | No-Clean | 20 AWG, 22 SWG | - | Lead Free | Spool, 1 lb (453.59g) | 24 Months | Date of Manufacture | 50°F ~ 104°F (10°C ~ 40°C) |
|
|
WC9601031PSAC 305 WATER SOLUBLE FLUX 1 LB. |
3,189 |
|
Техническая документация |
- | Spool | Active | Wire Solder | Sn96.5Ag3Cu0.5 (96.5/3/0.5) | 0.031" (0.79mm) | 423 ~ 424°F (217 ~ 218°C) | Water Soluble | 20 AWG, 22 SWG | - | Lead Free | Spool, 1 lb (453.59g) | 24 Months | Date of Manufacture | 50°F ~ 104°F (10°C ~ 40°C) |
|
|
CWSnCu0.7Ni RA3% .062 1#CW SnCu0.7Ni WRAP 3% 0.062 1# SP |
100 |
|
Техническая документация |
- | Tape & Box (TB) | Active | Wire Solder | Sn99.244Cu0.7 (Ni0.05/Ge0.006) | 0.062" (1.57mm) | 441°F (227°C) | Rosin Activated (RA) | 14 AWG | - | Lead Free | Spool, 1 lb (454 g) | 60 Months | Date of Manufacture | Room Temperature |
|
|
CWSnCu0.7Ni NCCW2.2% .062 1#CW SnCu0.7Ni NCCW 2.2% 0.062 1# |
100 |
|
Техническая документация |
- | Tape & Box (TB) | Active | Wire Solder | Sn99.244Cu0.7 (Ni0.05/Ge0.006) | 0.062" (1.57mm) | 441°F (227°C) | No-Clean | 14 AWG | - | Lead Free | Spool, 1 lb (454 g) | 60 Months | Date of Manufacture | Room Temperature |
|
|
CWSnCu0.7Ni RMA3% .062 1#CW SnCu0.7Ni WRMAP 3% 0.062 1# S |
100 |
|
Техническая документация |
- | Tape & Box (TB) | Active | Wire Solder | Sn99.244Cu0.7 (Ni0.05/Ge0.006) | 0.062" (1.57mm) | 441°F (227°C) | Rosin Mildly Activated (RMA) | 14 AWG | - | Lead Free | Spool, 1 lb (454 g) | 60 Months | Date of Manufacture | Room Temperature |
|
|
CWSnCu0.7Ni RA3% .032 1#CW SnCu0.7Ni WRAP 3% 0.032 1# SP |
100 |
|
Техническая документация |
- | Tape & Box (TB) | Active | Wire Solder | Sn99.244Cu0.7 (Ni0.05/Ge0.006) | 0.032" (0.81mm) | 441°F (227°C) | Rosin Activated (RA) | 20 AWG | - | Lead Free | Spool, 1 lb (454 g) | 60 Months | Date of Manufacture | Room Temperature |
|
|
CWSnCu0.7Ni RMA3% .032 1#CW SnCu0.7Ni WRMAP 3% 0.032 1# S |
100 |
|
Техническая документация |
- | Tape & Box (TB) | Active | Wire Solder | Sn99.244Cu0.7 (Ni0.05/Ge0.006) | 0.032" (0.81mm) | 441°F (227°C) | Rosin Mildly Activated (RMA) | 20 AWG | - | Lead Free | Spool, 1 lb (454 g) | 60 Months | Date of Manufacture | Room Temperature |
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