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| Фото | Парт. № производителя | Наличие | Количество | Техническая документация | Серия | Упаковка | Состояние продукта | Тип | Состав | Диаметр | Точка плавления | Тип флюса | Сечение провода | Тип сетки | Процесс | Форма | Срок хранения | Начало срока годности | Температура хранения/охлаждения |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
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EXB-SN96.5AG3.5SOLDER BAR SN96.5/AG3.5 1LB (454 |
2,442 |
|
Техническая документация |
CHIPQUIK® | Bulk | Active | Bar Solder | Sn96.5Ag3.5 (96.5/3.5) | - | 430°F (221°C) | - | - | - | Leaded | Bar, 1 lb (453.59g) | - | - | - |
|
|
WW100GE.020 1LBGERMANIUM DOPED SOLDER WIRE SN/C |
3,149 |
|
Техническая документация |
CHIPQUIK® | Bulk | Active | Wire Solder | Sn99.244Cu0.7Ni0.05Ge0.006 (99.244/0.7/0.05/0.006) | 0.020" (0.51mm) | 441°F (227°C) | No-Clean | - | - | - | Spool | 60 Months | - | - |
|
HV0006HVTOOLS ALL PURPOSE SOLDER |
588 |
|
Техническая документация |
- | Box | Active | Wire Solder | - | - | - | - | - | - | - | Spool, 3.53 oz (100g) | - | - | - |
|
WBCANFIELD6040Canfield 60/40 Solder 1 Lb Roll |
3,057 |
|
Техническая документация |
- | Bag | Active | Wire Solder | Sn60Pb40 (60/40) | 0.125" (3.18mm) | 363°F (184°C) | Rosin Activated (RA) | - | - | Leaded | Spool, 1 lb (453.592g) | - | - | - |
|
|
44-0595-0000SOLDER BAR E-BAR 1.66LB |
128 |
|
Техническая документация |
- | Bulk | Active | Bar Solder | Pb95Sn5 (95/5) | - | 574 ~ 597°F (301 ~ 314°C) | - | - | - | Leaded | Bar, 1.66 lbs (750g) | - | - | - |
|
RC96L2031EAG3SAC 305 ROSIN FLUX 8 OZ. .031 DI |
3,219 |
|
Техническая документация |
- | Spool | Active | Wire Solder | Sn96.5Ag3Cu0.5 (96.5/3/0.5) | 0.031" (0.79mm) | 423 ~ 424°F (217 ~ 218°C) | Rosin Activated (RA) | 20 AWG, 22 SWG | - | Lead Free | Spool, 8 oz (227g), 1/2 lb | 24 Months | Date of Manufacture | 50°F ~ 104°F (10°C ~ 40°C) |
|
|
SW SN50 .062 1#SN50PB50 .062 DIA 1 LB. SPOOL - |
1,728 |
|
Техническая документация |
- | Tape & Box (TB) | Active | Wire Solder | Sn50Pb50 (50/50) | 0.062" (1.57mm) | 361°F (183°C) | - | 14 AWG | - | Leaded | Spool, 1 lb (454 g) | - | Date of Manufacture | Room Temperature |
|
|
SW SN50 .032 1#SN50PB50 .032 dia 1 lb. spool |
3,505 |
|
Техническая документация |
- | Tape & Box (TB) | Active | Wire Solder | Sn50Pb50 (50/50) | 0.032" (0.81mm) | 361°F (183°C) | - | 20 AWG | - | Leaded | Spool, 1 lb (454 g) | - | Date of Manufacture | Room Temperature |
|
|
SW SN50 .015 1#Sn50Pb50 .015 dia 1# SPL |
2,938 |
|
Техническая документация |
- | Tape & Box (TB) | Active | Wire Solder | Sn50Pb50 (50/50) | 0.015" (0.38mm) | 194 ~ 842°F (90 ~ 450°C) | - | - | - | Leaded | Spool, 1 lb (453.59g) | - | - | - |
|
CWSN60WRAP3 .032SN60PB40 WRAP3 .032 DIA 1# SPL |
2,922 |
|
Техническая документация |
- | Box | Active | Wire Solder | Sn60Pb40 (60/40) | 0.032" (0.81mm) | 361°F (183°C) | Rosin Activated (RA) | 20 AWG | - | Leaded | Spool, 1 lb (454 g) | 60 Months | Date of Manufacture | Room Temperature |
|
|
CWSN63WRMAP3 .062SN63PB37 WRMAP3 .062 DIA 1# SPL |
2,949 |
|
Техническая документация |
- | Box | Active | Wire Solder | Sn63Pb37 (63/37) | 0.062" (1.57mm) | 361°F (183°C) | Rosin Mildly Activated (RMA) | 14 AWG | - | Leaded | Spool, 1 lb (454 g) | 60 Months | Date of Manufacture | Room Temperature |
|
CC96L2031ESAC 305 NO CLEAN FLUX 8 OZ .031 |
3,893 |
|
Техническая документация |
- | Spool | Active | Wire Solder | Sn96.5Ag3Cu0.5 (96.5/3/0.5) | 0.031" (0.79mm) | 423 ~ 424°F (217 ~ 218°C) | No-Clean | 20 AWG, 22 SWG | - | Lead Free | Spool, 1 lb (454 g) | 24 Months | Date of Manufacture | 50°F ~ 104°F (10°C ~ 40°C) |
|
WCBLF22701062BLF227 WATER SOLUBLE 1 LB. .062 |
3,034 |
|
Техническая документация |
- | Spool | Active | Wire Solder | BLF 227 (99.17Sn/.8Cu/.03Ni) | 0.062" (1.57mm) | 440°F (227°C) | Water Soluble | 14 AWG, 16 SWG | - | Lead Free | Spool, 1 lb (453.59g) | 24 Months | Date of Manufacture | 50°F ~ 104°F (10°C ~ 40°C) |
|
CWSN60 NCCW2.2 .015SN60PB40 NCCW2.2% .015 1# SPL |
100 |
|
Техническая документация |
- | Box | Active | Wire Solder | Sn60Pb40 (60/40) | 0.015" (0.38mm) | 361°F (183°C) | No-Clean | 27 AWG | - | Leaded | Spool, 1 lb (454 g) | 60 Months | Date of Manufacture | Room Temperature |
|
CWSN63 NCCW2.2 .015SN63PB37 NCCW2.2% .015 1# SPL |
3,173 |
|
Техническая документация |
- | Box | Active | Wire Solder | Sn63Pb37 (63/37) | 0.015" (0.38mm) | 361°F (183°C) | No-Clean | 27 AWG | - | Leaded | Spool, 1 lb (454 g) | 60 Months | Date of Manufacture | Room Temperature |
|
WC96L2020PSAC 305 WATER SOLUBLE FLUX 8 OZ |
2,182 |
|
Техническая документация |
- | Spool | Active | Wire Solder | Sn96.5Ag3Cu0.5 (96.5/3/0.5) | 0.020" (0.51mm) | 423 ~ 424°F (217 ~ 218°C) | Water Soluble | 24 AWG, 25 SWG | - | Lead Free | Spool, 8 oz (227g), 1/2 lb | 24 Months | Date of Manufacture | 50°F ~ 104°F (10°C ~ 40°C) |
|
CC96L2020ESACSAC305 NO CLEAN FLUX 8 OZ .020 D |
1,244 |
|
Техническая документация |
- | Spool | Active | Wire Solder | Sn96.5Ag3Cu0.5 (96.5/3/0.5) | 0.020" (0.51mm) | 423 ~ 424°F (217 ~ 218°C) | No-Clean | 24 AWG, 25 SWG | - | Lead Free | Spool, 8 oz (227g), 1/2 lb | 24 Months | Date of Manufacture | 50°F ~ 104°F (10°C ~ 40°C) |
|
WCBLF22701031BLF 227 WATER SOLUBLE FLUX 1 LB |
4,729 |
|
Техническая документация |
- | Spool | Active | Wire Solder | BLF 227 (99.17Sn/.8Cu/.03Ni) | 0.031" (0.79mm) | 440°F (227°C) | Water Soluble | 20 AWG, 22 SWG | - | Lead Free | Spool, 1 lb (453.59g) | 24 Months | Date of Manufacture | 50°F ~ 104°F (10°C ~ 40°C) |
|
CWSN60WRMAP3 .06260/40 WRMAP3 .062 DIA 1# SPL |
2,149 |
|
Техническая документация |
- | Box | Active | Wire Solder | Sn60Pb40 (60/40) | 0.062" (1.57mm) | 361°F (183°C) | Rosin Mildly Activated (RMA) | 14 AWG | - | Leaded | Spool, 1 lb (454 g) | 60 Months | Date of Manufacture | Room Temperature |
|
CWSN63 NCCW2 .032SN63PB37 NO CLEAN CORE WIRE 1# S |
2,055 |
|
Техническая документация |
- | Box | Active | Wire Solder | Sn63Pb37 (63/37) | 0.032" (0.81mm) | 361°F (183°C) | No-Clean | 20 AWG | - | Leaded | Spool, 1 lb (454 g) | 60 Months | Date of Manufacture | Room Temperature |
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