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| Фото | Парт. № производителя | Наличие | Количество | Техническая документация | Серия | Упаковка | Состояние продукта | Тип | Состав | Диаметр | Точка плавления | Тип флюса | Сечение провода | Тип сетки | Процесс | Форма | Срок хранения | Начало срока годности | Температура хранения/охлаждения |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
|
SMD291SNL10SOLDER PASTE NO-CLEAN 10CC SYR |
3,894 |
|
Техническая документация |
- | Dispenser | Active | Solder Paste | Sn96.5Ag3Cu0.5 (96.5/3/0.5) | - | 423 ~ 428°F (217 ~ 220°C) | No-Clean | - | 3 | Lead Free | Syringe, 1.23 oz (35g), 10cc | 6 Months | Date of Manufacture | 37°F ~ 46°F (3°C ~ 8°C) |
|
TS391LT10THERMALLY STABLE SOLDER PASTE NO |
3,326 |
|
Техническая документация |
- | Bulk | Active | Solder Paste | Bi57.6Sn42Ag0.4 (57.6/42/0.4) | - | 281°F (138°C) | No-Clean | - | 4 | Lead Free | Syringe, 1.23 oz (35g), 10cc | 12 Months | Date of Manufacture | 68°F ~ 77°F (20°C ~ 25°C) |
|
397952HMP 366 3% .022DIA. 23AWG |
2,965 |
|
Техническая документация |
366 | Bulk | Active | Wire Solder | Pb93.5Sn5Ag1.5 (93.5/5/1.5) | 0.022" (0.56mm) | 565 ~ 574°F (296 ~ 301°C) | Rosin Activated (RA) | 23 AWG, 24 SWG | - | Leaded | Spool, 8.8 oz (250g) | - | - | - |
|
SMDIN66.3BI33.7INDIUM/BISMUTH SOLDER WIRE (IN66 |
2,182 |
|
Техническая документация |
CHIPQUIK® | Bulk | Active | Wire Solder | In66.3Bi33.7 (66.3/33.7) | 0.031" (0.79mm) | 162°F (72°C) | - | - | - | Lead Free | Spool | 60 Months | Date of Manufacture | - |
|
SMDSWLF.031 4OZSLD WIRE NO-CLEAN 96.5/3/.5 4OZ. |
4,721 |
|
Техническая документация |
- | Spool | Active | Wire Solder | Sn96.5Ag3Cu0.5 (96.5/3/0.5) | 0.031" (0.79mm) | 423 ~ 428°F (217 ~ 220°C) | No-Clean, Water Soluble | 20 AWG, 22 SWG | - | Lead Free | Spool, 4 oz (113.40g) | - | - | - |
|
38684463/37 400 2% .015DIA 27AWG |
1,154 |
|
Техническая документация |
C400 | Bulk | Active | Wire Solder | Sn63Pb37 (63/37) | 0.015" (0.38mm) | 361°F (183°C) | No-Clean | 27 AWG, 28 SWG | - | Leaded | Spool, 8.8 oz (250g) | - | - | 59°F ~ 86°F (15°C ~ 30°C) |
|
SMDLTLFP10T5SOLDER PASTE LOW TEMP LF T5 10CC |
2,185 |
|
Техническая документация |
- | Dispenser | Active | Solder Paste | Bi57.6Sn42Ag0.4 (57.6/42/0.4) | - | 281°F (138°C) | No-Clean | - | 5 | Lead Free | Syringe, 1.23 oz (35g), 10cc | 6 Months | Date of Manufacture | 37°F ~ 46°F (3°C ~ 8°C) |
|
38926160/40 370 3% .015DIA 27AWG |
2,503 |
|
Техническая документация |
370 | Bulk | Active | Wire Solder | Sn60Pb40 (60/40) | 0.015" (0.38mm) | 361 ~ 374°F (183 ~ 190°C) | Rosin Activated (RA) | 27 AWG, 28 SWG | - | Leaded | Spool, 8.8 oz (250g) | - | - | - |
|
4860P-35GLEADED NO CLEAN SOLDER PASTE |
4,109 |
|
Техническая документация |
4860 | Dispenser | Active | Solder Paste | Sn63Pb37 (63/37) | - | 361°F (183°C) | No-Clean | - | 3 | Leaded | Syringe, 1.23 oz (35g), 10cc | 24 Months | Date of Manufacture | 39°F ~ 50°F (4°C ~ 10°C) |
|
SMDSWLTLFP32SOLDER WIRE LOW TEMP 42/57/1 32' |
3,296 |
|
Техническая документация |
- | Bulk | Active | Wire Solder | Bi57Sn42Ag1 (57/42/1) | 0.030" (0.76mm) | 280°F (138°C) | - | 21 AWG, 22 SWG | - | Lead Free | - | - | - | - |
|
SMD291SNL10T5SOLDER PASTE LF T5 10CC |
2,507 |
|
Техническая документация |
- | Dispenser | Active | Solder Paste | Sn96.5Ag3Cu0.5 (96.5/3/0.5) | - | 423 ~ 428°F (217 ~ 220°C) | No-Clean | - | 5 | Lead Free | Syringe, 1.23 oz (35g), 10cc | 6 Months | Date of Manufacture | 37°F ~ 46°F (3°C ~ 8°C) |
|
4900P-25GLEAD FREE NO CLEAN SOLDER PASTE |
100 |
|
Техническая документация |
4900 | Bulk | Active | Solder Paste | Sn96.2Ag2.8Cu0.4 (96.2/2.8/0.4) | - | 423 ~ 430°F (217 ~ 221°C) | No-Clean | - | - | Lead Free | Syringe, 0.88 oz (25g) | 24 Months | Date of Manufacture | 39°F ~ 50°F (4°C ~ 10°C) |
|
SMD291AX250T3SOLDER PASTE SN63/PB37 250G |
2,892 |
|
Техническая документация |
- | Bulk | Active | Solder Paste | Sn63Pb37 (63/37) | - | 361°F (183°C) | No-Clean | - | 3 | Leaded | Jar, 8.8 oz (250g) | 12 Months | Date of Manufacture | 37°F ~ 46°F (3°C ~ 8°C) |
|
4875-227GSOLDER NO-CLEAN 60/40 1/2 LB |
1,958 |
|
Техническая документация |
4870 | Spool | Active | Wire Solder | Sn60Pb40 (60/40) | 0.032" (0.81mm) | 361 ~ 376°F (183 ~ 191°C) | No-Clean | 20 AWG, 21 SWG | - | Leaded | Spool, 8 oz (227g), 1/2 lb | 60 Months | Date of Manufacture | 50°F ~ 86°F (10°C ~ 30°C) |
|
70-1708-0520SOLDERPASTE WATER SOL SYR 35GM |
3,973 |
|
Техническая документация |
R500 | Dispenser | Active | Solder Paste | Sn63Pb37 (63/37) | - | 361°F (183°C) | Water Soluble | - | 3 | Leaded | Syringe, 1.23 oz (35g), 10cc | 6 Months | Date of Manufacture | 32°F ~ 50°F (0°C ~ 10°C) |
|
BARSN99.3CU0.7SOLDER BAR SN99.3/CU0.7 1LB SUPE |
3,911 |
|
Техническая документация |
Super Low Dross™ | Bulk | Active | Bar Solder | Sn99.3Cu0.7 (99.3/0.7) | - | 441°F (227°C) | - | - | - | Lead Free | Bar, 1 lb (454g) | - | - | - |
|
395439HMP 366 3% .050DIA 16AWG |
1,564 |
|
Техническая документация |
366 | Bulk | Active | Wire Solder | Pb93.5Sn5Ag1.5 (93.5/5/1.5) | 0.050" (1.27mm) | 565 ~ 574°F (296 ~ 301°C) | Rosin Activated (RA) | 16 AWG, 18 SWG | - | Leaded | Spool, 17.64 oz (500g) | - | - | - |
|
395437HMP 366 3% .028DIA 21AWG |
1,304 |
|
Техническая документация |
366 | Bulk | Active | Wire Solder | Pb93.5Sn5Ag1.5 (93.5/5/1.5) | 0.028" (0.71mm) | 565 ~ 574°F (296 ~ 301°C) | Rosin Activated (RA) | 21 AWG, 22 SWG | - | Leaded | Spool, 17.64 oz (500g) | - | - | - |
|
38682760/40 370 3% .032DIA 20AWG |
2,519 |
|
Техническая документация |
370 | Bulk | Active | Wire Solder | Sn60Pb40 (60/40) | 0.032" (0.81mm) | 361 ~ 374°F (183 ~ 190°C) | Rosin Activated (RA) | 20 AWG, 21 SWG | - | Leaded | Spool, 17.64 oz (500g) | - | - | - |
|
SMD291SNL250T3SOLDER PASTE SAC305 250G T3 |
4,329 |
|
Техническая документация |
- | Bulk | Active | Solder Paste | Sn96.5Ag3Cu0.5 (96.5/3/0.5) | - | 423 ~ 428°F (217 ~ 220°C) | No-Clean | - | 3 | Lead Free | Jar, 8.8 oz (250g) | 6 Months | Date of Manufacture | 37°F ~ 46°F (3°C ~ 8°C) |
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