| Фото | Парт. № производителя | Наличие | Количество | Техническая документация | Серия | Упаковка | Состояние продукта | Тип | Количество положений или контактов (сетка) | Шаг - Сопряжение | Отделка контакта - Сопряжение | Толщина отделки контакта - Сопряжение | Материал контакта - Сопряжение | Тип крепления | Особенности | Оконечная нагрузка | Шаг - Пост | Отделка контакта - Пост | Толщина отделки контакта - Пост | Материал контакта - Пост | Материал корпуса | Рабочая температура | 
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
                 
                   
                
                 | 
				
                    181-PLS18040-12ZIF PGA LIST SOCKET 181PIN GOLD  |  
                4,960 | 
                
                     | 
                 
                 
                
                  Техническая документация  | 
                  	
	
                
                PLS | - | Active | PGA, ZIF (ZIP) | - | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Through Hole | Closed Frame | Solder | 0.100" (2.54mm) | Tin | 200.0µin (5.08µm) | Beryllium Copper | Polyphenylene Sulfide (PPS) | - | 
                 
                   
                
                 | 
				
                    181-PLS15006-12CONN SOCKET PGA ZIF GOLD  |  
                4,836 | 
                
                     | 
                 
                 
                
                  Техническая документация  | 
                  	
	
                
                PLS | Bulk | Active | PGA, ZIF (ZIP) | - | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Through Hole | Closed Frame | Solder | 0.100" (2.54mm) | Tin | 200.0µin (5.08µm) | Beryllium Copper | Polyphenylene Sulfide (PPS) | -65°C ~ 125°C | 
                 
                   
                
                 | 
				
                    181-PLS15033-12CONN SOCKET PGA ZIF GOLD  |  
                4,301 | 
                
                     | 
                 
                 
                
                  Техническая документация  | 
                  	
	
                
                PLS | Bulk | Active | PGA, ZIF (ZIP) | - | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Through Hole | Closed Frame | Solder | 0.100" (2.54mm) | Tin | 200.0µin (5.08µm) | Beryllium Copper | Polyphenylene Sulfide (PPS) | -65°C ~ 125°C | 
                 
                   
                
                 | 
				
                    181-PRS15006-12CONN SOCKET PGA ZIF GOLD  |  
                1,995 | 
                
                     | 
                 
                 
                
                  Техническая документация  | 
                  	
	
                
                PRS | Bulk | Active | PGA, ZIF (ZIP) | - | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Through Hole | Closed Frame | Solder | 0.100" (2.54mm) | Tin | 200.0µin (5.08µm) | Beryllium Copper | Polyphenylene Sulfide (PPS) | -65°C ~ 125°C | 
                 
                   
                
                 | 
				
                    181-PRS15033-12CONN SOCKET PGA ZIF GOLD  |  
                4,075 | 
                
                     | 
                 
                 
                
                  Техническая документация  | 
                  	
	
                
                PRS | Bulk | Active | PGA, ZIF (ZIP) | - | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Through Hole | Closed Frame | Solder | 0.100" (2.54mm) | Tin | 200.0µin (5.08µm) | Beryllium Copper | Polyphenylene Sulfide (PPS) | -65°C ~ 125°C | 
                 
                   
                
                 | 
				
                    550-10-361-18-101135PGA SOLDER TAIL  |  
                1,391 | 
                
                     | 
                 
                 
                
                  Техническая документация  | 
                  	
	
                
                550 | Bulk | Active | PGA | 361 (18 x 18) | 0.050" (1.27mm) | Gold | 10.0µin (0.25µm) | Beryllium Copper | Through Hole | Open Frame | Solder | 0.050" (1.27mm) | Gold | 10.0µin (0.25µm) | Brass | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled | -55°C ~ 125°C | 
                 
                   
                
                 | 
				
                    28-3574-18CONN IC DIP SOCKET ZIF 28POS GLD  |  
                1,728 | 
                
                     | 
                 
                 
                
                  Техническая документация  | 
                  	
	
                
                57 | Bulk | Active | DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing | 28 (2 x 14) | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Beryllium Copper | Through Hole | Closed Frame | Solder | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Beryllium Copper | Polyphenylene Sulfide (PPS), Glass Filled | - | 
                 
                   
                
                 | 
				
                    28-6572-18CONN IC DIP SOCKET ZIF 28POS TIN  |  
                3,468 | 
                
                     | 
                 
                 
                
                  Техническая документация  | 
                  	
	
                
                57 | Bulk | Active | DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing | 28 (2 x 14) | 0.100" (2.54mm) | Tin | 200.0µin (5.08µm) | Beryllium Copper | Through Hole | Closed Frame | Solder | 0.100" (2.54mm) | Tin | 200.0µin (5.08µm) | Beryllium Copper | Polyphenylene Sulfide (PPS), Glass Filled | - | 
                 
                   
                
                 | 
				
                    28-6573-18CONN IC DIP SOCKET ZIF 28POS TIN  |  
                3,157 | 
                
                     | 
                 
                 
                
                  Техническая документация  | 
                  	
	
                
                57 | Bulk | Active | DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing | 28 (2 x 14) | 0.100" (2.54mm) | Tin | 200.0µin (5.08µm) | Beryllium Copper | Through Hole | Closed Frame | Solder | 0.100" (2.54mm) | Tin | 200.0µin (5.08µm) | Beryllium Copper | Polyphenylene Sulfide (PPS), Glass Filled | - | 
                 
                   
                
                 | 
				
                    28-6574-18CONN IC DIP SOCKET ZIF 28POS TIN  |  
                4,380 | 
                
                     | 
                 
                 
                
                  Техническая документация  | 
                  	
	
                
                57 | Bulk | Active | DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing | 28 (2 x 14) | 0.100" (2.54mm) | Tin | 200.0µin (5.08µm) | Beryllium Copper | Through Hole | Closed Frame | Solder | 0.100" (2.54mm) | Tin | 200.0µin (5.08µm) | Beryllium Copper | Polyphenylene Sulfide (PPS), Glass Filled | - | 
                 
                   
                
                 | 
				
                    256-PLS16001-12CONN SOCKET PGA ZIF GOLD  |  
                3,432 | 
                
                     | 
                 
                 
                
                  Техническая документация  | 
                  	
	
                
                PLS | Bulk | Active | PGA, ZIF (ZIP) | - | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Through Hole | Closed Frame | Solder | 0.100" (2.54mm) | Tin | 200.0µin (5.08µm) | Beryllium Copper | Polyphenylene Sulfide (PPS) | -65°C ~ 125°C | 
                 
                   
                
                 | 
				
                    HLS-1320-G-2.100" SCREW MACHINE SOCKET ARRAY  |  
                3,021 | 
                
                     | 
                 
                 
                
                  Техническая документация  | 
                  	
	
                
                HLS | Bulk | Active | SIP | 260 (13 x 20) | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | - | Through Hole | Closed Frame | Solder | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | - | Thermoplastic | -55°C ~ 140°C | 
                 
                   
                
                 | 
				
                    229-PGM16015-10TCONN SOCKET PGA TIN  |  
                3,809 | 
                
                     | 
                 
                 
                
                  Техническая документация  | 
                  	
	
                
                PGM | Bulk | Active | PGA | - | 0.100" (2.54mm) | Tin | 200.0µin (5.08µm) | Beryllium Copper | Through Hole | - | Solder | 0.100" (2.54mm) | Tin | 200.0µin (5.08µm) | Brass | Polyamide (PA46), Nylon 4/6, Glass Filled | -55°C ~ 105°C | 
                 
                   
                
                 | 
				
                    156-PLS16011-12CONN SOCKET PGA ZIF GOLD  |  
                4,980 | 
                
                     | 
                 
                 
                
                  Техническая документация  | 
                  	
	
                
                PLS | Bulk | Active | PGA, ZIF (ZIP) | - | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Through Hole | Closed Frame | Solder | 0.100" (2.54mm) | Tin | 200.0µin (5.08µm) | Beryllium Copper | Polyphenylene Sulfide (PPS) | -65°C ~ 125°C | 
                 
                   
                
                 | 
				
                    156-PRS16011-12CONN SOCKET PGA ZIF GOLD  |  
                4,476 | 
                
                     | 
                 
                 
                
                  Техническая документация  | 
                  	
	
                
                PRS | Bulk | Active | PGA, ZIF (ZIP) | - | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Through Hole | Closed Frame | Solder | 0.100" (2.54mm) | Tin | 200.0µin (5.08µm) | Beryllium Copper | Polyphenylene Sulfide (PPS) | -65°C ~ 125°C | 
                 
                   
                
                 | 
				
                    24-3574-18CONN IC DIP SOCKET ZIF 24POS TIN  |  
                2,439 | 
                
                     | 
                 
                 
                
                  Техническая документация  | 
                  	
	
                
                57 | Bulk | Active | DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing | 24 (2 x 12) | 0.100" (2.54mm) | Tin | 200.0µin (5.08µm) | Beryllium Copper | Through Hole | Closed Frame | Solder | 0.100" (2.54mm) | Tin | 200.0µin (5.08µm) | Beryllium Copper | Polyphenylene Sulfide (PPS), Glass Filled | - | 
                 
                   
                
                 | 
				
                    36-6551-18CONN IC DIP SOCKET ZIF 36POS  |  
                1,766 | 
                
                     | 
                 
                 
                
                  Техническая документация  | 
                  	
	
                
                55 | Bulk | Active | DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing | 36 (2 x 18) | 0.100" (2.54mm) | Nickel Boron | 50.0µin (1.27µm) | Beryllium Nickel | Through Hole | Closed Frame | Solder | 0.100" (2.54mm) | Nickel Boron | 50.0µin (1.27µm) | Beryllium Nickel | Polyetheretherketone (PEEK), Glass Filled | -55°C ~ 250°C | 
                 
                   
                
                 | 
				
                    28-3575-18CONN IC DIP SOCKET ZIF 28POS GLD  |  
                4,515 | 
                
                     | 
                 
                 
                
                  Техническая документация  | 
                  	
	
                
                57 | Bulk | Active | DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing | 28 (2 x 14) | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Beryllium Copper | Through Hole | Closed Frame | Solder | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Beryllium Copper | Polyphenylene Sulfide (PPS), Glass Filled | - | 
                 
                   
                
                 | 
				
                    28-6575-18CONN IC DIP SOCKET ZIF 28POS TIN  |  
                4,277 | 
                
                     | 
                 
                 
                
                  Техническая документация  | 
                  	
	
                
                57 | Bulk | Active | DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing | 28 (2 x 14) | 0.100" (2.54mm) | Tin | 200.0µin (5.08µm) | Beryllium Copper | Through Hole | Closed Frame | Solder | 0.100" (2.54mm) | Tin | 200.0µin (5.08µm) | Beryllium Copper | Polyphenylene Sulfide (PPS), Glass Filled | - | 
| 
                 
                   | 
				
                    200-6319-9UN-1900CONN SOCKET PGA ZIF 361POS GOLD  |  
                2,843 | 
                
                     | 
                 
                 
                
                  Техническая документация  | 
                  	
	
                
                Textool™ | Bulk | Obsolete | PGA, ZIF (ZIP) | 361 (19 x 19) | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Through Hole | - | Solder | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Polyethersulfone (PES) | -55°C ~ 150°C |