Фото | Парт. № производителя | Наличие | Количество | Техническая документация | Серия | Упаковка | Состояние продукта | Тип разъема | Тип контакта | Шаг - Сопряжение | Количество положений | Количество рядов | Расстояние между рядами - Сопряжение | Количество загруженных позиций | Стиль | Защита | Тип крепления | Оконечная нагрузка | Тип крепления | Длина контакта - Сопряжение | Длина контакта - Пост | Общая длина контакта | Высота изоляции | Форма контакта | Отделка контакта - Сопряжение | Толщина отделки контакта - Сопряжение | Отделка контакта - Пост | Материал контакта | Материал изоляции | Особенности | Рабочая температура | Номинальный ток (Ампер) |
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SLY 10 SMD 040 46 Z0.5 MM |
2,067 |
|
![]() Техническая документация |
SLY 10 SMD 040 | Bulk | Active | Header | Male Pin | 0.079" (2.00mm) | 46 | 2 | 0.079" (2.00mm) | All | Board to Board or Cable | Unshrouded | Surface Mount | Solder | Push-Pull | 0.157" (4.00mm) | 0.268" (6.80mm) | - | 0.059" (1.50mm) | Circular | Tin | 157.5 ~ 236.2µin (4.00 ~ 6.00µm) | Tin | Copper Tin | Polyamide (PA46), Nylon 4/6, Glass Filled | - | -40°C ~ 163°C | 3A |
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SLV W 6 092 14 GONE ROW, 0.4 MMFOR INT |
2,585 |
|
![]() Техническая документация |
SLV W 6 092 | Bulk | Active | Header | Male Pin | 0.050" (1.27mm) | 14 | 1 | - | All | Board to Board or Cable | Unshrouded | Through Hole | Solder | Push-Pull | 0.118" (3.00mm) | 0.098" (2.50mm) | 0.579" (14.70mm) | 0.067" (1.70mm) | Square | Gold | 7.87µin (0.200µm) | Gold | Copper Zinc | Polyamide (PA46), Nylon 4/6, Glass Filled | Sandwich | -40°C ~ 163°C | 1.5A |
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SLV W 6 117 11 ZONE ROW, 0.4 MMFOR INT |
1,726 |
|
![]() Техническая документация |
SLV W 6 117 | Bulk | Active | Header | Male Pin | 0.050" (1.27mm) | 11 | 1 | - | All | Board to Board or Cable | Unshrouded | Through Hole | Solder | Push-Pull | 0.118" (3.00mm) | 0.098" (2.50mm) | 0.677" (17.20mm) | 0.067" (1.70mm) | Square | Tin | 157.5 ~ 236.2µin (4.00 ~ 6.00µm) | Tin | Copper Zinc | Polyamide (PA46), Nylon 4/6, Glass Filled | Sandwich | -40°C ~ 163°C | 1.5A |
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SLY 10 SMD 040 50 Z0.5 MM |
3,874 |
|
![]() Техническая документация |
SLY 10 SMD 040 | Bulk | Active | Header | Male Pin | 0.079" (2.00mm) | 50 | 2 | 0.079" (2.00mm) | All | Board to Board or Cable | Unshrouded | Surface Mount | Solder | Push-Pull | 0.157" (4.00mm) | 0.268" (6.80mm) | - | 0.059" (1.50mm) | Circular | Tin | 157.5 ~ 236.2µin (4.00 ~ 6.00µm) | Tin | Copper Tin | Polyamide (PA46), Nylon 4/6, Glass Filled | - | -40°C ~ 163°C | 3A |
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SLV W 6 092 13 ZONE ROW, 0.4 MMFOR INT |
1,194 |
|
![]() Техническая документация |
SLV W 6 092 | Bulk | Active | Header | Male Pin | 0.050" (1.27mm) | 13 | 1 | - | All | Board to Board or Cable | Unshrouded | Through Hole | Solder | Push-Pull | 0.118" (3.00mm) | 0.098" (2.50mm) | 0.579" (14.70mm) | 0.067" (1.70mm) | Square | Tin | 157.5 ~ 236.2µin (4.00 ~ 6.00µm) | Tin | Copper Zinc | Polyamide (PA46), Nylon 4/6, Glass Filled | Sandwich | -40°C ~ 163°C | 1.5A |
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SLV W 8 092 50 GTWO ROWS, 0.4 MM; PITCH 1. |
1,347 |
|
![]() Техническая документация |
SLV W 8 092 | Bulk | Active | Header | Male Pin | 0.050" (1.27mm) | 50 | 2 | 0.100" (2.54mm) | All | Board to Board or Cable | Unshrouded | Through Hole | Solder | Push-Pull | 0.118" (3.00mm) | 0.098" (2.50mm) | 0.579" (14.70mm) | 0.067" (1.70mm) | Square | Gold | 7.87µin (0.200µm) | Gold | Copper Zinc | Polyamide (PA46), Nylon 4/6, Glass Filled | Sandwich | -40°C ~ 163°C | 1.5A |
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SLV W 4 KA 060 4 ZGRID 1.27 X1.27 MM; SUITABLE FO |
2,156 |
|
![]() Техническая документация |
SLV W 4 KA 060 | Bulk | Active | Header | Male Pin | 0.050" (1.27mm) | 4 | 2 | 0.050" (1.27mm) | All | Board to Board or Cable | Unshrouded | Through Hole | Solder | Push-Pull | 0.236" (6.00mm) | 0.098" (2.50mm) | - | 0.067" (1.70mm) | Square | Tin | 157.5 ~ 236.2µin (4.00 ~ 6.00µm) | Tin | Copper Zinc | Polyamide (PA46), Nylon 4/6, Glass Filled | - | -40°C ~ 163°C | 1.5A |
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SL 6 097 58 Z0.635 MM"S" SE |
1,737 |
|
![]() Техническая документация |
SL 6 097 | Bulk | Active | Header | Male Pin | 0.100" (2.54mm) | 58 | 2 | 0.100" (2.54mm) | All | Board to Board or Cable | Unshrouded | Through Hole | Solder | Push-Pull | 0.236" (6.00mm) | 0.130" (3.30mm) | 0.748" (19.00mm) | 0.110" (2.80mm) | Square | Tin | 157.5 ~ 236.2µin (4.00 ~ 6.00µm) | Tin | Copper Tin | Polyamide (PA46), Nylon 4/6, Glass Filled | Sandwich | -40°C ~ 163°C | 3A |
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SLV W 4 KA 060 12 GGRID 1.27 X1.27 MM; SUITABLE FO |
1,219 |
|
![]() Техническая документация |
SLV W 4 KA 060 | Bulk | Active | Header | Male Pin | 0.050" (1.27mm) | 12 | 2 | 0.050" (1.27mm) | All | Board to Board or Cable | Unshrouded | Through Hole | Solder | Push-Pull | 0.236" (6.00mm) | 0.098" (2.50mm) | - | 0.067" (1.70mm) | Square | Gold | 7.87µin (0.200µm) | Gold | Copper Zinc | Polyamide (PA46), Nylon 4/6, Glass Filled | - | -40°C ~ 163°C | 1.5A |
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SL 6 071 16 Z0.635 MM"S" SE |
3,885 |
|
![]() Техническая документация |
SL 6 071 | Bulk | Active | Header | Male Pin | 0.100" (2.54mm) | 16 | 2 | 0.100" (2.54mm) | All | Board to Board or Cable | Unshrouded | Through Hole | Solder | Push-Pull | 0.236" (6.00mm) | 0.130" (3.30mm) | 0.646" (16.40mm) | 0.110" (2.80mm) | Square | Tin | 157.5 ~ 236.2µin (4.00 ~ 6.00µm) | Tin | Copper Tin | Polyamide (PA46), Nylon 4/6, Glass Filled | Sandwich | -40°C ~ 163°C | 3A |
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SLY 1 139 32 S0.5 MM, STRAIGHT |
2,766 |
|
![]() Техническая документация |
SLY 1 139 | Tube | Active | Header | Male Pin | 0.079" (2.00mm) | 32 | 1 | - | All | Board to Board or Cable | Unshrouded | Through Hole | Solder | Push-Pull | 0.370" (9.40mm) | 0.118" (3.00mm) | 0.547" (13.90mm) | 0.059" (1.50mm) | Square | Gold | 7.87µin (0.200µm) | Tin | Copper Tin | Polyamide (PA46), Nylon 4/6, Glass Filled | - | -40°C ~ 163°C | 3A |
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SL 6 156 14 Z0.635 MM"S" SE |
1,177 |
|
![]() Техническая документация |
SL 6 156 | Tube | Active | Header | Male Pin | 0.100" (2.54mm) | 14 | 2 | 0.100" (2.54mm) | All | Board to Board or Cable | Unshrouded | Through Hole | Solder | Push-Pull | 0.236" (6.00mm) | 0.130" (3.30mm) | 0.980" (24.90mm) | 0.110" (2.80mm) | Square | Gold | 7.87µin (0.200µm) | Tin | Copper Tin | Polyamide (PA46), Nylon 4/6, Glass Filled | Sandwich | -40°C ~ 163°C | 3A |
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SLY 11 SMD 133 31 GONE ROW, 0.5 MM, SUITABLE FOR |
4,588 |
|
![]() Техническая документация |
SLY 11 SMD 133 | Bulk | Active | Header | Male Pin | 0.079" (2.00mm) | 31 | 1 | - | All | Board to Board or Cable | Unshrouded | Surface Mount | Solder | Push-Pull | 0.142" (3.60mm) | - | - | 0.059" (1.50mm) | Square | Gold | 7.87µin (0.200µm) | Gold | Copper Tin | Polyamide (PA46), Nylon 4/6, Glass Filled | - | -40°C ~ 163°C | 3A |
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SL 6 315 22 Z0.635 MM"S" SE |
2,409 |
|
![]() Техническая документация |
SL 6 315 | Bulk | Active | Header | Male Pin | 0.100" (2.54mm) | 22 | 2 | 0.100" (2.54mm) | All | Board to Board or Cable | Unshrouded | Through Hole | Solder | Push-Pull | 0.236" (6.00mm) | 0.130" (3.30mm) | 1.606" (40.80mm) | 0.110" (2.80mm) | Square | Gold | 7.87µin (0.200µm) | Tin | Copper Tin | Polyamide (PA46), Nylon 4/6, Glass Filled | Sandwich | -40°C ~ 163°C | 3A |
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SLY 11 SMD 133 28 SONE ROW, 0.5 MM, SUITABLE FOR |
1,280 |
|
![]() Техническая документация |
SLY 11 SMD 133 | Bulk | Active | Header | Male Pin | 0.079" (2.00mm) | 28 | 1 | - | All | Board to Board or Cable | Unshrouded | Surface Mount | Solder | Push-Pull | 0.142" (3.60mm) | - | - | 0.059" (1.50mm) | Square | Gold | 7.87µin (0.200µm) | Tin | Copper Tin | Polyamide (PA46), Nylon 4/6, Glass Filled | - | -40°C ~ 163°C | 3A |
|
SL 6 097 40 S0.635 MM"S" SE |
2,173 |
|
![]() Техническая документация |
SL 6 097 | Bulk | Active | Header | Male Pin | 0.100" (2.54mm) | 40 | 2 | 0.100" (2.54mm) | All | Board to Board or Cable | Unshrouded | Through Hole | Solder | Push-Pull | 0.236" (6.00mm) | 0.130" (3.30mm) | 0.748" (19.00mm) | 0.110" (2.80mm) | Square | Gold | 7.87µin (0.200µm) | Tin | Copper Tin | Polyamide (PA46), Nylon 4/6, Glass Filled | Sandwich | -40°C ~ 163°C | 3A |
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SLY 12 SMD 092 4 STWO ROWS, 0.5 MM, SUITABLE FOR |
2,026 |
|
![]() Техническая документация |
SLY 12 SMD 092 | Bulk | Active | Header | Male Pin | 0.079" (2.00mm) | 4 | 2 | 0.079" (2.00mm) | All | Board to Board or Cable | Unshrouded | Surface Mount | Solder | Push-Pull | 0.142" (3.60mm) | - | - | 0.059" (1.50mm) | Square | Gold | 7.87µin (0.200µm) | Tin | Copper Tin | Polyamide (PA46), Nylon 4/6, Glass Filled | - | -40°C ~ 163°C | 3A |
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SL 6 237 52 Z0.635 MM"S" SE |
2,610 |
|
![]() Техническая документация |
SL 6 237 | Bulk | Active | Header | Male Pin | 0.100" (2.54mm) | 52 | 2 | 0.100" (2.54mm) | All | Board to Board or Cable | Unshrouded | Through Hole | Solder | Push-Pull | 0.236" (6.00mm) | 0.130" (3.30mm) | 1.299" (33.00mm) | 0.110" (2.80mm) | Square | Tin | 157.5 ~ 236.2µin (4.00 ~ 6.00µm) | Tin | Copper Tin | Polyamide (PA46), Nylon 4/6, Glass Filled | Sandwich | -40°C ~ 163°C | 3A |
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SLV W 7 117 52 GTWO ROWS, 0.4 MM; PITCH 1. |
1,976 |
|
![]() Техническая документация |
SLV W 7 117 | Bulk | Active | Header | Male Pin | 0.050" (1.27mm) | 52 | 2 | 0.050" (1.27mm) | All | Board to Board or Cable | Unshrouded | Through Hole | Solder | Push-Pull | 0.118" (3.00mm) | 0.098" (2.50mm) | 0.677" (17.20mm) | 0.067" (1.70mm) | Square | Gold | 7.87µin (0.200µm) | Gold | Copper Zinc | Polyamide (PA46), Nylon 4/6, Glass Filled | Sandwich | -40°C ~ 163°C | 1.5A |
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SL 6 121 32 G0.635 MM"S" SE |
1,047 |
|
![]() Техническая документация |
SL 6 121 | Bulk | Active | Header | Male Pin | 0.100" (2.54mm) | 32 | 2 | 0.100" (2.54mm) | All | Board to Board or Cable | Unshrouded | Through Hole | Solder | Push-Pull | 0.236" (6.00mm) | 0.130" (3.30mm) | 0.845" (21.40mm) | 0.110" (2.80mm) | Square | Gold | 7.87µin (0.200µm) | Gold | Copper Tin | Polyamide (PA46), Nylon 4/6, Glass Filled | Sandwich | -40°C ~ 163°C | 3A |