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Разъемы, штыревые контакты
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SLY 8 SMD 062 36 Z0.5 MM |
3,520 |
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Техническая документация |
SLY 8 SMD 062 | Bulk | Active | Header | Male Pin | 0.079" (2.00mm) | 36 | 2 | 0.079" (2.00mm) | All | Board to Board or Cable | Unshrouded | Surface Mount | Solder | Push-Pull | 0.244" (6.20mm) | - | 0.323" (8.20mm) | 0.059" (1.50mm) | Circular | Tin | 157.5 ~ 236.2µin (4.00 ~ 6.00µm) | Tin | Copper Tin | Polyamide (PA46), Nylon 4/6, Glass Filled | - | -40°C ~ 163°C | 3A |
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SL LP 3 069 28 ZLOW PROFILE, ANGLED, 0.635 MM |
1,631 |
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Техническая документация |
SL LP 3 069 | Bulk | Active | Header | Male Pin | 0.100" (2.54mm) | 28 | 1 | - | All | Board to Board or Cable | Unshrouded | Through Hole | Solder | Push-Pull | 0.272" (6.90mm) | 0.118" (3.00mm) | - | 0.067" (1.70mm) | Square | Tin | 157.5 ~ 236.2µin (4.00 ~ 6.00µm) | Tin | Copper Tin | Polyamide (PA46), Nylon 4/6, Glass Filled | Low Profile | -40°C ~ 163°C | 3A |
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SL LP 7 SMD 055 35 S0.635 MM, LOW PROFILE IN SMD-T |
4,593 |
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Техническая документация |
SL LP 7 SMD 055 | Bulk | Active | Header | Male Pin | 0.100" (2.54mm) | 35 | 1 | - | All | Board to Board or Cable | Unshrouded | Surface Mount | Solder | Push-Pull | 0.217" (5.50mm) | 0.150" (3.80mm) | 0.433" (11.00mm) | 0.067" (1.70mm) | Square | Gold | 7.87µin (0.200µm) | Tin | Copper Tin | Polyamide (PA46), Nylon 4/6, Glass Filled | - | -40°C ~ 163°C | 3A |
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SLY 8 SMD 062 4 G B SM0.5 MM |
1,072 |
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Техническая документация |
SLY 8 SMD 062 | Tube | Active | Header | Male Pin | 0.079" (2.00mm) | 4 | 2 | 0.079" (2.00mm) | All | Board to Board or Cable | Unshrouded | Surface Mount | Solder | Push-Pull | 0.244" (6.20mm) | - | 0.323" (8.20mm) | 0.059" (1.50mm) | Circular | Gold | 7.87µin (0.200µm) | Gold | Copper Tin | Polyamide (PA46), Nylon 4/6, Glass Filled | - | -40°C ~ 163°C | 3A |
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SL LP 5 SMD 038 14 S0.635 MM, LOW PROFILE |
2,582 |
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Техническая документация |
SL LP 5 SMD 038 | Bulk | Active | Header | Male Pin | 0.100" (2.54mm) | 14 | 1 | - | All | Board to Board or Cable | Unshrouded | Surface Mount | Solder | Push-Pull | 0.150" (3.80mm) | - | - | 0.067" (1.70mm) | Square | Gold | 7.87µin (0.200µm) | Tin | Copper Tin | Polyamide (PA46), Nylon 4/6, Glass Filled | - | -40°C ~ 163°C | 3A |
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SL LP 7 SMD 040 8 G0.635 MM, LOW PROFILE IN SMD-T |
4,694 |
|
Техническая документация |
SL LP 7 SMD 040 | Bulk | Active | Header | Male Pin | 0.100" (2.54mm) | 8 | 1 | - | All | Board to Board or Cable | Unshrouded | Surface Mount | Solder | Push-Pull | 0.157" (4.00mm) | 0.150" (3.80mm) | 0.374" (9.50mm) | 0.067" (1.70mm) | Square | Gold | 7.87µin (0.200µm) | Gold | Copper Tin | Polyamide (PA46), Nylon 4/6, Glass Filled | - | -40°C ~ 163°C | 3A |
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SLY 8 SMD 062 54 G B SM0.5 MM |
2,727 |
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Техническая документация |
SLY 8 SMD 062 | Bulk | Active | Header | Male Pin | 0.079" (2.00mm) | 54 | 2 | 0.079" (2.00mm) | All | Board to Board or Cable | Unshrouded | Surface Mount | Solder | Push-Pull | 0.244" (6.20mm) | - | 0.323" (8.20mm) | 0.059" (1.50mm) | Circular | Gold | 7.87µin (0.200µm) | Gold | Copper Tin | Polyamide (PA46), Nylon 4/6, Glass Filled | - | -40°C ~ 163°C | 3A |
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SL LP 4 069 20 SLOW PROFILE, ANGLED, 0.635 MM |
2,551 |
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Техническая документация |
SL LP 4 069 | Bulk | Active | Header | Male Pin | 0.100" (2.54mm) | 20 | 2 | 0.100" (2.54mm) | All | Board to Board or Cable | Unshrouded | Through Hole | Solder | Push-Pull | 0.272" (6.90mm) | 0.118" (3.00mm) | - | 0.067" (1.70mm) | Square | Gold | 7.87µin (0.200µm) | Tin | Copper Tin | Polyamide (PA46), Nylon 4/6, Glass Filled | Low Profile | -40°C ~ 163°C | 3A |
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SL LP 6 SMD 066 50 Z SM0.635 MM, LOW PROFILE IN SMD-T |
3,574 |
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Техническая документация |
SL LP 6 SMD 066 | Bulk | Active | Header | Male Pin | 0.100" (2.54mm) | 50 | 2 | 0.100" (2.54mm) | All | Board to Board or Cable | Unshrouded | Surface Mount | Solder | Push-Pull | 0.260" (6.60mm) | - | - | 0.067" (1.70mm) | Square | Tin | 157.5 ~ 236.2µin (4.00 ~ 6.00µm) | Tin | Copper Tin | Polyamide (PA46), Nylon 4/6, Glass Filled | - | -40°C ~ 163°C | 3A |
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SLY 9 SMD 055 26 S0.5 MM |
1,218 |
|
Техническая документация |
SLY 9 SMD 055 | Tube | Active | Header | Male Pin | 0.079" (2.00mm) | 26 | 1 | - | All | Board to Board or Cable | Unshrouded | Surface Mount | Solder | Push-Pull | 0.217" (5.50mm) | 0.130" (3.30mm) | 0.406" (10.30mm) | 0.059" (1.50mm) | Circular | Gold | 7.87µin (0.200µm) | Tin | Copper Tin | Polyamide (PA46), Nylon 4/6, Glass Filled | - | -40°C ~ 163°C | 3A |
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SL LP 3 041 32 SLOW PROFILE, ANGLED, 0.635 MM |
2,369 |
|
Техническая документация |
SL LP 3 041 | Bulk | Active | Header | Male Pin | 0.100" (2.54mm) | 32 | 1 | - | All | Board to Board or Cable | Unshrouded | Through Hole | Solder | Push-Pull | 0.161" (4.10mm) | 0.118" (3.00mm) | - | 0.067" (1.70mm) | Square | Gold | 7.87µin (0.200µm) | Tin | Copper Tin | Polyamide (PA46), Nylon 4/6, Glass Filled | Low Profile | -40°C ~ 163°C | 3A |
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SL LP 7 SMD 040 11 S0.635 MM, LOW PROFILE IN SMD-T |
3,189 |
|
Техническая документация |
SL LP 7 SMD 040 | Bulk | Active | Header | Male Pin | 0.100" (2.54mm) | 11 | 1 | - | All | Board to Board or Cable | Unshrouded | Surface Mount | Solder | Push-Pull | 0.157" (4.00mm) | 0.150" (3.80mm) | 0.374" (9.50mm) | 0.067" (1.70mm) | Square | Gold | 7.87µin (0.200µm) | Tin | Copper Tin | Polyamide (PA46), Nylon 4/6, Glass Filled | - | -40°C ~ 163°C | 3A |
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SLY 9 SMD 055 28 G B SM0.5 MM |
3,842 |
|
Техническая документация |
SLY 9 SMD 055 | Tube | Active | Header | Male Pin | 0.079" (2.00mm) | 28 | 1 | - | All | Board to Board or Cable | Unshrouded | Surface Mount | Solder | Push-Pull | 0.217" (5.50mm) | 0.130" (3.30mm) | 0.406" (10.30mm) | 0.059" (1.50mm) | Circular | Gold | 7.87µin (0.200µm) | Gold | Copper Tin | Polyamide (PA46), Nylon 4/6, Glass Filled | - | -40°C ~ 163°C | 3A |
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SL LP 7 SMD 055 20 S0.635 MM, LOW PROFILE IN SMD-T |
4,643 |
|
Техническая документация |
SL LP 7 SMD 055 | Bulk | Active | Header | Male Pin | 0.100" (2.54mm) | 20 | 1 | - | All | Board to Board or Cable | Unshrouded | Surface Mount | Solder | Push-Pull | 0.217" (5.50mm) | 0.150" (3.80mm) | 0.433" (11.00mm) | 0.067" (1.70mm) | Square | Gold | 7.87µin (0.200µm) | Tin | Copper Tin | Polyamide (PA46), Nylon 4/6, Glass Filled | - | -40°C ~ 163°C | 3A |
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SLY 5 040 37 GONE ROW, 0.5 MM, SUITABLE FOR |
2,690 |
|
Техническая документация |
SLY 5 040 | Bulk | Active | Header | Male Pin | 0.079" (2.00mm) | 37 | 1 | - | All | Board to Board or Cable | Unshrouded | Through Hole | Solder | Push-Pull | 0.142" (3.60mm) | 0.110" (2.80mm) | 0.409" (10.40mm) | 0.059" (1.50mm) | Square | Gold | 7.87µin (0.200µm) | Gold | Copper Tin | Polyamide (PA46), Nylon 4/6, Glass Filled | - | -40°C ~ 163°C | 3A |
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SLY 8 SMD 062 70 G0.5 MM |
2,519 |
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Техническая документация |
SLY 8 SMD 062 | Tube | Active | Header | Male Pin | 0.079" (2.00mm) | 70 | 2 | 0.079" (2.00mm) | All | Board to Board or Cable | Unshrouded | Surface Mount | Solder | Push-Pull | 0.244" (6.20mm) | - | 0.323" (8.20mm) | 0.059" (1.50mm) | Circular | Gold | 7.87µin (0.200µm) | Gold | Copper Tin | Polyamide (PA46), Nylon 4/6, Glass Filled | - | -40°C ~ 163°C | 3A |
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SL LP 6 SMD 066 48 S SM0.635 MM, LOW PROFILE IN SMD-T |
3,527 |
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Техническая документация |
SL LP 6 SMD 066 | Tube | Active | Header | Male Pin | 0.100" (2.54mm) | 48 | 2 | 0.100" (2.54mm) | All | Board to Board or Cable | Unshrouded | Surface Mount | Solder | Push-Pull | 0.260" (6.60mm) | - | - | 0.067" (1.70mm) | Square | Gold | 7.87µin (0.200µm) | Tin | Copper Tin | Polyamide (PA46), Nylon 4/6, Glass Filled | - | -40°C ~ 163°C | 3A |
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SL LP 4 069 40 ZLOW PROFILE, ANGLED, 0.635 MM |
1,078 |
|
Техническая документация |
SL LP 4 069 | Tube | Active | Header | Male Pin | 0.100" (2.54mm) | 40 | 2 | 0.100" (2.54mm) | All | Board to Board or Cable | Unshrouded | Through Hole | Solder | Push-Pull | 0.272" (6.90mm) | 0.118" (3.00mm) | - | 0.067" (1.70mm) | Square | Tin | 157.5 ~ 236.2µin (4.00 ~ 6.00µm) | Tin | Copper Tin | Polyamide (PA46), Nylon 4/6, Glass Filled | Low Profile | -40°C ~ 163°C | 3A |
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SLY 8 SMD 062 38 G SM0.5 MM |
1,808 |
|
Техническая документация |
SLY 8 SMD 062 | Tube | Active | Header | Male Pin | 0.079" (2.00mm) | 38 | 2 | 0.079" (2.00mm) | All | Board to Board or Cable | Unshrouded | Surface Mount | Solder | Push-Pull | 0.244" (6.20mm) | - | 0.323" (8.20mm) | 0.059" (1.50mm) | Circular | Gold | 7.87µin (0.200µm) | Gold | Copper Tin | Polyamide (PA46), Nylon 4/6, Glass Filled | - | -40°C ~ 163°C | 3A |
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SL LP 6 SMD 066 32 Z SM0.635 MM, LOW PROFILE IN SMD-T |
4,809 |
|
Техническая документация |
SL LP 6 SMD 066 | Bulk | Active | Header | Male Pin | 0.100" (2.54mm) | 32 | 2 | 0.100" (2.54mm) | All | Board to Board or Cable | Unshrouded | Surface Mount | Solder | Push-Pull | 0.260" (6.60mm) | - | - | 0.067" (1.70mm) | Square | Tin | 157.5 ~ 236.2µin (4.00 ~ 6.00µm) | Tin | Copper Tin | Polyamide (PA46), Nylon 4/6, Glass Filled | - | -40°C ~ 163°C | 3A |
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