Фото | Парт. № производителя | Наличие | Количество | Техническая документация | Серия | Упаковка | Состояние продукта | Тип разъема | Тип контакта | Шаг - Сопряжение | Количество положений | Количество рядов | Расстояние между рядами - Сопряжение | Количество загруженных позиций | Стиль | Защита | Тип крепления | Оконечная нагрузка | Тип крепления | Длина контакта - Сопряжение | Длина контакта - Пост | Общая длина контакта | Высота изоляции | Форма контакта | Отделка контакта - Сопряжение | Толщина отделки контакта - Сопряжение | Отделка контакта - Пост | Материал контакта | Материал изоляции | Особенности | Рабочая температура | Номинальный ток (Ампер) |
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SLY 1 085 36 G0.5 MM, STRAIGHT |
4,900 |
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![]() Техническая документация |
SLY 1 085 | - | Active | Header | Male Pin | 0.079" (2.00mm) | 36 | 1 | - | All | Board to Board or Cable | Unshrouded | Through Hole | Solder | Push-Pull | 0.157" (4.00mm) | 0.118" (3.00mm) | 0.335" (8.50mm) | 0.059" (1.50mm) | Square | Gold | 7.87µin (0.200µm) | Gold | Copper Tin | Polyamide (PA46), Nylon 4/6, Glass Filled | - | -40°C ~ 163°C | 3A |
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SLV W 8 117 62 ZTWO ROWS, 0.4 MM; PITCH 1. |
2,125 |
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![]() Техническая документация |
SLV W 8 117 | Bulk | Active | Header | Male Pin | 0.050" (1.27mm) | 62 | 2 | 0.100" (2.54mm) | All | Board to Board or Cable | Unshrouded | Through Hole | Solder | Push-Pull | 0.118" (3.00mm) | 0.098" (2.50mm) | 0.677" (17.20mm) | 0.067" (1.70mm) | Square | Tin | 157.5 ~ 236.2µin (4.00 ~ 6.00µm) | Tin | Copper Zinc | Polyamide (PA46), Nylon 4/6, Glass Filled | Sandwich | -40°C ~ 163°C | 1.5A |
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SL 6 415 12 G0.635 MM"S" SE |
2,929 |
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![]() Техническая документация |
SL 6 415 | Bulk | Active | Header | Male Pin | 0.100" (2.54mm) | 12 | 2 | 0.100" (2.54mm) | All | Board to Board or Cable | Unshrouded | Through Hole | Solder | Push-Pull | 0.236" (6.00mm) | 0.130" (3.30mm) | 2.000" (50.80mm) | 0.110" (2.80mm) | Square | Gold | 7.87µin (0.200µm) | Tin | Copper Tin | Polyamide (PA46), Nylon 4/6, Glass Filled | Sandwich | -40°C ~ 163°C | 3A |
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SLV W 8 092 44 GTWO ROWS, 0.4 MM; PITCH 1. |
3,268 |
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![]() Техническая документация |
SLV W 8 092 | Bulk | Active | Header | Male Pin | 0.050" (1.27mm) | 44 | 2 | 0.100" (2.54mm) | All | Board to Board or Cable | Unshrouded | Through Hole | Solder | Push-Pull | 0.118" (3.00mm) | 0.098" (2.50mm) | 0.579" (14.70mm) | 0.067" (1.70mm) | Square | Gold | 7.87µin (0.200µm) | Gold | Copper Zinc | Polyamide (PA46), Nylon 4/6, Glass Filled | Sandwich | -40°C ~ 163°C | 1.5A |
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SL 5 415 22 GONE ROW, 0.635 MM |
2,553 |
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![]() Техническая документация |
SL 5 415 | Bulk | Active | Header | Male Pin | 0.100" (2.54mm) | 22 | 1 | - | All | Board to Board or Cable | Unshrouded | Through Hole | Solder | Push-Pull | 0.236" (6.00mm) | 0.130" (3.30mm) | 2.000" (50.80mm) | 0.110" (2.80mm) | Square | Gold | 7.87µin (0.200µm) | Tin | Copper Tin | Polyamide (PA46), Nylon 4/6, Glass Filled | Sandwich | -40°C ~ 163°C | 3A |
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SLV W 8 117 36 ZTWO ROWS, 0.4 MM; PITCH 1. |
1,962 |
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![]() Техническая документация |
SLV W 8 117 | Bulk | Active | Header | Male Pin | 0.050" (1.27mm) | 36 | 2 | 0.100" (2.54mm) | All | Board to Board or Cable | Unshrouded | Through Hole | Solder | Push-Pull | 0.118" (3.00mm) | 0.098" (2.50mm) | 0.677" (17.20mm) | 0.067" (1.70mm) | Square | Tin | 157.5 ~ 236.2µin (4.00 ~ 6.00µm) | Tin | Copper Zinc | Polyamide (PA46), Nylon 4/6, Glass Filled | Sandwich | -40°C ~ 163°C | 1.5A |
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SL 6 156 40 G0.635 MM"S" SE |
1,150 |
|
![]() Техническая документация |
SL 6 156 | - | Active | Header | Male Pin | 0.100" (2.54mm) | 40 | 2 | 0.100" (2.54mm) | All | Board to Board or Cable | Unshrouded | Through Hole | Solder | Push-Pull | 0.236" (6.00mm) | 0.130" (3.30mm) | 0.980" (24.90mm) | 0.110" (2.80mm) | Square | Gold | 7.87µin (0.200µm) | Tin | Copper Tin | Polyamide (PA46), Nylon 4/6, Glass Filled | Sandwich | -40°C ~ 163°C | 3A |
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SLY 11 SMD 051 6 GONE ROW, 0.5 MM, SUITABLE FOR |
2,866 |
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![]() Техническая документация |
SLY 11 SMD 051 | - | Active | Header | Male Pin | 0.079" (2.00mm) | 6 | 1 | - | All | Board to Board or Cable | Unshrouded | Surface Mount | Solder | Push-Pull | 0.142" (3.60mm) | - | - | 0.059" (1.50mm) | Square | Gold | 7.87µin (0.200µm) | Gold | Copper Tin | Polyamide (PA46), Nylon 4/6, Glass Filled | - | -40°C ~ 163°C | 3A |
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SLV W 7 117 30 ZTWO ROWS, 0.4 MM; PITCH 1. |
1,882 |
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![]() Техническая документация |
SLV W 7 117 | Bulk | Active | Header | Male Pin | 0.050" (1.27mm) | 30 | 2 | 0.050" (1.27mm) | All | Board to Board or Cable | Unshrouded | Through Hole | Solder | Push-Pull | 0.118" (3.00mm) | 0.098" (2.50mm) | 0.677" (17.20mm) | 0.067" (1.70mm) | Square | Tin | 157.5 ~ 236.2µin (4.00 ~ 6.00µm) | Tin | Copper Zinc | Polyamide (PA46), Nylon 4/6, Glass Filled | Sandwich | -40°C ~ 163°C | 1.5A |
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SL 6 237 56 G0.635 MM"S" SE |
3,812 |
|
![]() Техническая документация |
SL 6 237 | Bulk | Active | Header | Male Pin | 0.100" (2.54mm) | 56 | 2 | 0.100" (2.54mm) | All | Board to Board or Cable | Unshrouded | Through Hole | Solder | Push-Pull | 0.236" (6.00mm) | 0.130" (3.30mm) | 1.299" (33.00mm) | 0.110" (2.80mm) | Square | Gold | 7.87µin (0.200µm) | Gold | Copper Tin | Polyamide (PA46), Nylon 4/6, Glass Filled | Sandwich | -40°C ~ 163°C | 3A |
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SLV W 6 092 30 ZONE ROW, 0.4 MMFOR INT |
4,415 |
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![]() Техническая документация |
SLV W 6 092 | Bulk | Active | Header | Male Pin | 0.050" (1.27mm) | 30 | 1 | - | All | Board to Board or Cable | Unshrouded | Through Hole | Solder | Push-Pull | 0.118" (3.00mm) | 0.098" (2.50mm) | 0.579" (14.70mm) | 0.067" (1.70mm) | Square | Tin | 157.5 ~ 236.2µin (4.00 ~ 6.00µm) | Tin | Copper Zinc | Polyamide (PA46), Nylon 4/6, Glass Filled | Sandwich | -40°C ~ 163°C | 1.5A |
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SL 6 415 18 Z0.635 MM"S" SE |
1,638 |
|
![]() Техническая документация |
SL 6 415 | Bulk | Active | Header | Male Pin | 0.100" (2.54mm) | 18 | 2 | 0.100" (2.54mm) | All | Board to Board or Cable | Unshrouded | Through Hole | Solder | Push-Pull | 0.236" (6.00mm) | 0.130" (3.30mm) | 2.000" (50.80mm) | 0.110" (2.80mm) | Square | Gold | 7.87µin (0.200µm) | Tin | Copper Tin | Polyamide (PA46), Nylon 4/6, Glass Filled | Sandwich | -40°C ~ 163°C | 3A |
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SLV W 4 KA 060 6 ZGRID 1.27 X1.27 MM; SUITABLE FO |
1,945 |
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![]() Техническая документация |
SLV W 4 KA 060 | - | Active | Header | Male Pin | 0.050" (1.27mm) | 6 | 2 | 0.050" (1.27mm) | All | Board to Board or Cable | Unshrouded | Through Hole | Solder | Push-Pull | 0.236" (6.00mm) | 0.098" (2.50mm) | - | 0.067" (1.70mm) | Square | Tin | 157.5 ~ 236.2µin (4.00 ~ 6.00µm) | Tin | Copper Zinc | Polyamide (PA46), Nylon 4/6, Glass Filled | - | -40°C ~ 163°C | 1.5A |
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SL 6 360 54 G0.635 MM"S" SE |
3,811 |
|
![]() Техническая документация |
SL 6 360 | Bulk | Active | Header | Male Pin | 0.100" (2.54mm) | 54 | 2 | 0.100" (2.54mm) | All | Board to Board or Cable | Unshrouded | Through Hole | Solder | Push-Pull | 0.236" (6.00mm) | 0.130" (3.30mm) | 1.783" (45.30mm) | 0.110" (2.80mm) | Square | Gold | 7.87µin (0.200µm) | Tin | Copper Tin | Polyamide (PA46), Nylon 4/6, Glass Filled | Sandwich | -40°C ~ 163°C | 3A |
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SLV W 6 117 31 ZONE ROW, 0.4 MMFOR INT |
4,223 |
|
![]() Техническая документация |
SLV W 6 117 | Bulk | Active | Header | Male Pin | 0.050" (1.27mm) | 31 | 1 | - | All | Board to Board or Cable | Unshrouded | Through Hole | Solder | Push-Pull | 0.118" (3.00mm) | 0.098" (2.50mm) | 0.677" (17.20mm) | 0.067" (1.70mm) | Square | Tin | 157.5 ~ 236.2µin (4.00 ~ 6.00µm) | Tin | Copper Zinc | Polyamide (PA46), Nylon 4/6, Glass Filled | Sandwich | -40°C ~ 163°C | 1.5A |
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SLY 11 SMD 133 6 ZONE ROW, 0.5 MM, SUITABLE FOR |
4,682 |
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![]() Техническая документация |
SLY 11 SMD 133 | Bulk | Active | Header | Male Pin | 0.079" (2.00mm) | 6 | 1 | - | All | Board to Board or Cable | Unshrouded | Surface Mount | Solder | Push-Pull | 0.142" (3.60mm) | - | - | 0.059" (1.50mm) | Square | Tin | 157.5 ~ 236.2µin (4.00 ~ 6.00µm) | Tin | Copper Tin | Polyamide (PA46), Nylon 4/6, Glass Filled | - | -40°C ~ 163°C | 3A |
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SLV W 4 KA 060 56 ZGRID 1.27 X1.27 MM; SUITABLE FO |
1,741 |
|
![]() Техническая документация |
SLV W 4 KA 060 | - | Active | Header | Male Pin | 0.050" (1.27mm) | 56 | 2 | 0.050" (1.27mm) | All | Board to Board or Cable | Unshrouded | Through Hole | Solder | Push-Pull | 0.236" (6.00mm) | 0.098" (2.50mm) | - | 0.067" (1.70mm) | Square | Tin | 157.5 ~ 236.2µin (4.00 ~ 6.00µm) | Tin | Copper Zinc | Polyamide (PA46), Nylon 4/6, Glass Filled | - | -40°C ~ 163°C | 1.5A |
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SL 6 156 8 Z0.635 MM"S" SE |
1,662 |
|
![]() Техническая документация |
SL 6 156 | - | Active | Header | Male Pin | 0.100" (2.54mm) | 8 | 2 | 0.100" (2.54mm) | All | Board to Board or Cable | Unshrouded | Through Hole | Solder | Push-Pull | 0.236" (6.00mm) | 0.130" (3.30mm) | 0.980" (24.90mm) | 0.110" (2.80mm) | Square | Gold | 7.87µin (0.200µm) | Tin | Copper Tin | Polyamide (PA46), Nylon 4/6, Glass Filled | Sandwich | -40°C ~ 163°C | 3A |
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SLY 11 SMD 133 30 GONE ROW, 0.5 MM, SUITABLE FOR |
2,084 |
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![]() Техническая документация |
SLY 11 SMD 133 | Tube | Active | Header | Male Pin | 0.079" (2.00mm) | 30 | 1 | - | All | Board to Board or Cable | Unshrouded | Surface Mount | Solder | Push-Pull | 0.142" (3.60mm) | - | - | 0.059" (1.50mm) | Square | Gold | 7.87µin (0.200µm) | Gold | Copper Tin | Polyamide (PA46), Nylon 4/6, Glass Filled | - | -40°C ~ 163°C | 3A |
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SL 6 121 36 S0.635 MM"S" SE |
4,435 |
|
![]() Техническая документация |
SL 6 121 | - | Active | Header | Male Pin | 0.100" (2.54mm) | 36 | 2 | 0.100" (2.54mm) | All | Board to Board or Cable | Unshrouded | Through Hole | Solder | Push-Pull | 0.236" (6.00mm) | 0.130" (3.30mm) | 0.845" (21.40mm) | 0.110" (2.80mm) | Square | Gold | 7.87µin (0.200µm) | Tin | Copper Tin | Polyamide (PA46), Nylon 4/6, Glass Filled | Sandwich | -40°C ~ 163°C | 3A |