Фото | Парт. № производителя | Наличие | Количество | Техническая документация | Серия | Упаковка | Состояние продукта | Тип разъема | Тип контакта | Шаг - Сопряжение | Количество положений | Количество рядов | Расстояние между рядами - Сопряжение | Количество загруженных позиций | Стиль | Защита | Тип крепления | Оконечная нагрузка | Тип крепления | Длина контакта - Сопряжение | Длина контакта - Пост | Общая длина контакта | Высота изоляции | Форма контакта | Отделка контакта - Сопряжение | Толщина отделки контакта - Сопряжение | Отделка контакта - Пост | Материал контакта | Материал изоляции | Особенности | Рабочая температура | Номинальный ток (Ампер) |
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
|
SLY 4 035 26 Z0.5 MM, ANGLED |
3,264 |
|
![]() Техническая документация |
SLY 4 035 | Bulk | Active | Header | Male Pin | 0.079" (2.00mm) | 26 | 2 | 0.079" (2.00mm) | All | Board to Board or Cable | Unshrouded | Through Hole | Solder | Push-Pull | 0.138" (3.50mm) | 0.110" (2.80mm) | - | 0.059" (1.50mm) | Square | Tin | 157.5 ~ 236.2µin (4.00 ~ 6.00µm) | Tin | Copper Tin | Polyamide (PA46), Nylon 4/6, Glass Filled | - | -40°C ~ 163°C | 3A |
![]() |
SL LP 6 SMD 051 8 G B SM0.635 MM, LOW PROFILE IN SMD-T |
1,921 |
|
![]() Техническая документация |
SL LP 6 SMD 051 | Tube | Active | Header | Male Pin | 0.100" (2.54mm) | 8 | 2 | 0.100" (2.54mm) | All | Board to Board or Cable | Unshrouded | Surface Mount | Solder | Push-Pull | 0.201" (5.10mm) | - | - | 0.067" (1.70mm) | Square | Gold | 7.87µin (0.200µm) | Gold | Copper Tin | Polyamide (PA46), Nylon 4/6, Glass Filled | - | -40°C ~ 163°C | 3A |
|
SLY 4 035 10 G0.5 MM, ANGLED |
2,816 |
|
![]() Техническая документация |
SLY 4 035 | Bulk | Active | Header | Male Pin | 0.079" (2.00mm) | 10 | 2 | 0.079" (2.00mm) | All | Board to Board or Cable | Unshrouded | Through Hole | Solder | Push-Pull | 0.138" (3.50mm) | 0.110" (2.80mm) | - | 0.059" (1.50mm) | Square | Gold | 7.87µin (0.200µm) | Gold | Copper Tin | Polyamide (PA46), Nylon 4/6, Glass Filled | - | -40°C ~ 163°C | 3A |
![]() |
SL LP 6 SMD 051 6 G SM PS0.635 MM, LOW PROFILE IN SMD-T |
3,315 |
|
![]() Техническая документация |
SL LP 6 SMD 051 | Bulk | Active | Header | Male Pin | 0.100" (2.54mm) | 6 | 2 | 0.100" (2.54mm) | All | Board to Board or Cable | Unshrouded | Surface Mount | Solder | Push-Pull | 0.201" (5.10mm) | - | - | 0.067" (1.70mm) | Square | Gold | 7.87µin (0.200µm) | Gold | Copper Tin | Polyamide (PA46), Nylon 4/6, Glass Filled | - | -40°C ~ 163°C | 3A |
|
SL LP 3 069 34 SLOW PROFILE, ANGLED, 0.635 MM |
3,129 |
|
![]() Техническая документация |
SL LP 3 069 | Tube | Active | Header | Male Pin | 0.100" (2.54mm) | 34 | 1 | - | All | Board to Board or Cable | Unshrouded | Through Hole | Solder | Push-Pull | 0.272" (6.90mm) | 0.118" (3.00mm) | - | 0.067" (1.70mm) | Square | Gold | 7.87µin (0.200µm) | Tin | Copper Tin | Polyamide (PA46), Nylon 4/6, Glass Filled | Low Profile | -40°C ~ 163°C | 3A |
![]() |
SL LP 6 SMD 051 6 S B TR PS0.635 MM, LOW PROFILE IN SMD-T |
4,700 |
|
![]() Техническая документация |
SL LP 6 SMD 051 | Tape & Reel (TR) | Active | Header | Male Pin | 0.100" (2.54mm) | 6 | 2 | 0.100" (2.54mm) | All | Board to Board or Cable | Unshrouded | Surface Mount | Solder | Push-Pull | 0.201" (5.10mm) | - | - | 0.067" (1.70mm) | Square | Gold | 7.87µin (0.200µm) | Tin | Copper Tin | Polyamide (PA46), Nylon 4/6, Glass Filled | - | -40°C ~ 163°C | 3A |
|
SL 4 025 60 SMALE HEADER 0.635 MM, DIMENSIO |
1,113 |
|
![]() Техническая документация |
SL 4 025 | - | Active | Header | Male Pin | 0.100" (2.54mm) | 60 | 2 | 0.100" (2.54mm) | All | Board to Board or Cable | Unshrouded | Through Hole | Solder | Push-Pull | 0.228" (5.80mm) | 0.118" (3.00mm) | - | 0.110" (2.80mm) | Square | Gold | 7.87µin (0.200µm) | Tin | Copper Tin | Polyamide (PA46), Nylon 4/6, Glass Filled | - | -40°C ~ 163°C | 3A |
|
SLY 8 SMD 062 72 Z0.5 MM |
2,465 |
|
![]() Техническая документация |
SLY 8 SMD 062 | Bulk | Active | Header | Male Pin | 0.079" (2.00mm) | 72 | 2 | 0.079" (2.00mm) | All | Board to Board or Cable | Unshrouded | Surface Mount | Solder | Push-Pull | 0.244" (6.20mm) | - | 0.323" (8.20mm) | 0.059" (1.50mm) | Circular | Tin | 157.5 ~ 236.2µin (4.00 ~ 6.00µm) | Tin | Copper Tin | Polyamide (PA46), Nylon 4/6, Glass Filled | - | -40°C ~ 163°C | 3A |
|
SL 5 071 13 GONE ROW, 0.635 MM |
3,989 |
|
![]() Техническая документация |
SL 5 071 | - | Active | Header | Male Pin | 0.100" (2.54mm) | 13 | 1 | - | All | Board to Board or Cable | Unshrouded | Through Hole | Solder | Push-Pull | 0.236" (6.00mm) | 0.130" (3.30mm) | 0.646" (16.40mm) | 0.110" (2.80mm) | Square | Gold | 7.87µin (0.200µm) | Gold | Copper Tin | Polyamide (PA46), Nylon 4/6, Glass Filled | Sandwich | -40°C ~ 163°C | 3A |
![]() |
SL LP 6 SMD 051 62 Z PS0.635 MM, LOW PROFILE IN SMD-T |
3,549 |
|
![]() Техническая документация |
SL LP 6 SMD 051 | - | Active | Header | Male Pin | 0.100" (2.54mm) | 62 | 2 | 0.100" (2.54mm) | All | Board to Board or Cable | Unshrouded | Surface Mount | Solder | Push-Pull | 0.201" (5.10mm) | - | - | 0.067" (1.70mm) | Square | Tin | 157.5 ~ 236.2µin (4.00 ~ 6.00µm) | Tin | Copper Tin | Polyamide (PA46), Nylon 4/6, Glass Filled | - | -40°C ~ 163°C | 3A |
|
SL 3 207 9 SMALE HEADER 0.635 MM, DIMENSIO |
4,777 |
|
![]() Техническая документация |
SL 3 207 | - | Active | Header | Male Pin | 0.100" (2.54mm) | 9 | 1 | - | All | Board to Board or Cable | Unshrouded | Through Hole | Solder | Push-Pull | 0.228" (5.80mm) | 0.815" (20.70mm) | - | 0.110" (2.80mm) | Square | Gold | 7.87µin (0.200µm) | Tin | Copper Tin | Polyamide (PA46), Nylon 4/6, Glass Filled | - | -40°C ~ 163°C | 3A |
|
SL LP 7 SMD 055 35 G0.635 MM, LOW PROFILE IN SMD-T |
4,241 |
|
![]() Техническая документация |
SL LP 7 SMD 055 | - | Active | Header | Male Pin | 0.100" (2.54mm) | 35 | 1 | - | All | Board to Board or Cable | Unshrouded | Surface Mount | Solder | Push-Pull | 0.217" (5.50mm) | 0.150" (3.80mm) | 0.433" (11.00mm) | 0.067" (1.70mm) | Square | Gold | 7.87µin (0.200µm) | Gold | Copper Tin | Polyamide (PA46), Nylon 4/6, Glass Filled | - | -40°C ~ 163°C | 3A |
|
SL 4 152 30 GMALE HEADER 0.635 MM, DIMENSIO |
1,874 |
|
![]() Техническая документация |
SL 4 152 | - | Active | Header | Male Pin | 0.100" (2.54mm) | 30 | 2 | 0.100" (2.54mm) | All | Board to Board or Cable | Unshrouded | Through Hole | Solder | Push-Pull | 0.228" (5.80mm) | 0.598" (15.20mm) | - | 0.110" (2.80mm) | Square | Gold | 7.87µin (0.200µm) | Gold | Copper Tin | Polyamide (PA46), Nylon 4/6, Glass Filled | - | -40°C ~ 163°C | 3A |
|
SL LP 7 SMD 030 14 Z0.635 MM, LOW PROFILE IN SMD-T |
3,647 |
|
![]() Техническая документация |
SL LP 7 SMD 030 | Tube | Active | Header | Male Pin | 0.100" (2.54mm) | 14 | 1 | - | All | Board to Board or Cable | Unshrouded | Surface Mount | Solder | Push-Pull | 0.118" (3.00mm) | 0.130" (3.30mm) | 0.315" (8.00mm) | 0.067" (1.70mm) | Square | Tin | 157.5 ~ 236.2µin (4.00 ~ 6.00µm) | Tin | Copper Tin | Polyamide (PA46), Nylon 4/6, Glass Filled | - | -40°C ~ 163°C | 3A |
|
SL 4 101 6 GMALE HEADER 0.635 MM, DIMENSIO |
3,612 |
|
![]() Техническая документация |
SL 4 101 | - | Active | Header | Male Pin | 0.100" (2.54mm) | 6 | 2 | 0.100" (2.54mm) | All | Board to Board or Cable | Unshrouded | Through Hole | Solder | Push-Pull | 0.228" (5.80mm) | 0.398" (10.10mm) | - | 0.110" (2.80mm) | Square | Gold | 7.87µin (0.200µm) | Gold | Copper Tin | Polyamide (PA46), Nylon 4/6, Glass Filled | - | -40°C ~ 163°C | 3A |
|
SL LP 6 SMD 066 56 G B TR0.635 MM, LOW PROFILE IN SMD-T |
2,121 |
|
![]() Техническая документация |
SL LP 6 SMD 066 | Tape & Reel (TR) | Active | Header | Male Pin | 0.100" (2.54mm) | 56 | 2 | 0.100" (2.54mm) | All | Board to Board or Cable | Unshrouded | Surface Mount | Solder | Push-Pull | 0.260" (6.60mm) | - | - | 0.067" (1.70mm) | Square | Gold | 7.87µin (0.200µm) | Gold | Copper Tin | Polyamide (PA46), Nylon 4/6, Glass Filled | - | -40°C ~ 163°C | 3A |
|
SL 3 207 8 ZMALE HEADER 0.635 MM, DIMENSIO |
2,770 |
|
![]() Техническая документация |
SL 3 207 | - | Active | Header | Male Pin | 0.100" (2.54mm) | 8 | 1 | - | All | Board to Board or Cable | Unshrouded | Through Hole | Solder | Push-Pull | 0.228" (5.80mm) | 0.815" (20.70mm) | - | 0.110" (2.80mm) | Square | Tin | 157.5 ~ 236.2µin (4.00 ~ 6.00µm) | Tin | Copper Tin | Polyamide (PA46), Nylon 4/6, Glass Filled | - | -40°C ~ 163°C | 3A |
|
SL LP 6 SMD 066 34 G B SM PS0.635 MM, LOW PROFILE IN SMD-T |
2,485 |
|
![]() Техническая документация |
SL LP 6 SMD 066 | Bulk | Active | Header | Male Pin | 0.100" (2.54mm) | 34 | 2 | 0.100" (2.54mm) | All | Board to Board or Cable | Unshrouded | Surface Mount | Solder | Push-Pull | 0.260" (6.60mm) | - | - | 0.067" (1.70mm) | Square | Gold | 7.87µin (0.200µm) | Gold | Copper Tin | Polyamide (PA46), Nylon 4/6, Glass Filled | - | -40°C ~ 163°C | 3A |
|
SL 6 071 50 G0.635 MM"S" SE |
3,117 |
|
![]() Техническая документация |
SL 6 071 | Bulk | Active | Header | Male Pin | 0.100" (2.54mm) | 50 | 2 | 0.100" (2.54mm) | All | Board to Board or Cable | Unshrouded | Through Hole | Solder | Push-Pull | 0.236" (6.00mm) | 0.130" (3.30mm) | 0.646" (16.40mm) | 0.110" (2.80mm) | Square | Gold | 7.87µin (0.200µm) | Gold | Copper Tin | Polyamide (PA46), Nylon 4/6, Glass Filled | Sandwich | -40°C ~ 163°C | 3A |
|
SL LP 6 SMD 066 58 S SM0.635 MM, LOW PROFILE IN SMD-T |
3,131 |
|
![]() Техническая документация |
SL LP 6 SMD 066 | Bulk | Active | Header | Male Pin | 0.100" (2.54mm) | 58 | 2 | 0.100" (2.54mm) | All | Board to Board or Cable | Unshrouded | Surface Mount | Solder | Push-Pull | 0.260" (6.60mm) | - | - | 0.067" (1.70mm) | Square | Gold | 7.87µin (0.200µm) | Tin | Copper Tin | Polyamide (PA46), Nylon 4/6, Glass Filled | - | -40°C ~ 163°C | 3A |