Фото | Парт. № производителя | Наличие | Количество | Техническая документация | Серия | Упаковка | Состояние продукта | Тип разъема | Тип контакта | Шаг - Сопряжение | Количество положений | Количество рядов | Расстояние между рядами - Сопряжение | Количество загруженных позиций | Стиль | Защита | Тип крепления | Оконечная нагрузка | Тип крепления | Длина контакта - Сопряжение | Длина контакта - Пост | Общая длина контакта | Высота изоляции | Форма контакта | Отделка контакта - Сопряжение | Толщина отделки контакта - Сопряжение | Отделка контакта - Пост | Материал контакта | Материал изоляции | Особенности | Рабочая температура | Номинальный ток (Ампер) |
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SL 3 152 1 GMALE HEADER 0.635 MM, DIMENSIO |
4,612 |
|
![]() Техническая документация |
SL 3 152 | - | Active | Header | Male Pin | 0.100" (2.54mm) | 1 | 1 | - | All | Board to Board or Cable | Unshrouded | Through Hole | Solder | Push-Pull | 0.228" (5.80mm) | 0.598" (15.20mm) | - | 0.110" (2.80mm) | Square | Gold | 7.87µin (0.200µm) | Gold | Copper Tin | Polyamide (PA46), Nylon 4/6, Glass Filled | - | -40°C ~ 163°C | 3A |
|
SLV W 7 092 28 GTWO ROWS, 0.4 MM; PITCH 1. |
1,434 |
|
![]() Техническая документация |
SLV W 7 092 | Bulk | Active | Header | Male Pin | 0.050" (1.27mm) | 28 | 2 | 0.050" (1.27mm) | All | Board to Board or Cable | Unshrouded | Through Hole | Solder | Push-Pull | 0.118" (3.00mm) | 0.098" (2.50mm) | 0.579" (14.70mm) | 0.067" (1.70mm) | Square | Gold | 7.87µin (0.200µm) | Gold | Copper Zinc | Polyamide (PA46), Nylon 4/6, Glass Filled | Sandwich | -40°C ~ 163°C | 1.5A |
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SLV W 8 117 10 GTWO ROWS, 0.4 MM; PITCH 1. |
4,338 |
|
![]() Техническая документация |
SLV W 8 117 | Bulk | Active | Header | Male Pin | 0.050" (1.27mm) | 10 | 2 | 0.100" (2.54mm) | All | Board to Board or Cable | Unshrouded | Through Hole | Solder | Push-Pull | 0.118" (3.00mm) | 0.098" (2.50mm) | 0.677" (17.20mm) | 0.067" (1.70mm) | Square | Gold | 7.87µin (0.200µm) | Gold | Copper Zinc | Polyamide (PA46), Nylon 4/6, Glass Filled | Sandwich | -40°C ~ 163°C | 1.5A |
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SLV W 7 117 50 ZTWO ROWS, 0.4 MM; PITCH 1. |
4,386 |
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![]() Техническая документация |
SLV W 7 117 | Bulk | Active | Header | Male Pin | 0.050" (1.27mm) | 50 | 2 | 0.050" (1.27mm) | All | Board to Board or Cable | Unshrouded | Through Hole | Solder | Push-Pull | 0.118" (3.00mm) | 0.098" (2.50mm) | 0.677" (17.20mm) | 0.067" (1.70mm) | Square | Tin | 157.5 ~ 236.2µin (4.00 ~ 6.00µm) | Tin | Copper Zinc | Polyamide (PA46), Nylon 4/6, Glass Filled | Sandwich | -40°C ~ 163°C | 1.5A |
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SL 6 147 58 Z0.635 MM"S" SE |
3,918 |
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![]() Техническая документация |
SL 6 147 | Bulk | Active | Header | Male Pin | 0.100" (2.54mm) | 58 | 2 | 0.100" (2.54mm) | All | Board to Board or Cable | Unshrouded | Through Hole | Solder | Push-Pull | 0.236" (6.00mm) | 0.130" (3.30mm) | 0.945" (24.00mm) | 0.110" (2.80mm) | Square | Tin | 157.5 ~ 236.2µin (4.00 ~ 6.00µm) | Tin | Copper Tin | Polyamide (PA46), Nylon 4/6, Glass Filled | Sandwich | -40°C ~ 163°C | 3A |
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SL 6 147 62 G0.635 MM"S" SE |
1,431 |
|
![]() Техническая документация |
SL 6 147 | Bulk | Active | Header | Male Pin | 0.100" (2.54mm) | 62 | 2 | 0.100" (2.54mm) | All | Board to Board or Cable | Unshrouded | Through Hole | Solder | Push-Pull | 0.236" (6.00mm) | 0.130" (3.30mm) | 0.945" (24.00mm) | 0.110" (2.80mm) | Square | Gold | 7.87µin (0.200µm) | Gold | Copper Tin | Polyamide (PA46), Nylon 4/6, Glass Filled | Sandwich | -40°C ~ 163°C | 3A |
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SLV W 8 092 24 GTWO ROWS, 0.4 MM; PITCH 1. |
2,403 |
|
![]() Техническая документация |
SLV W 8 092 | Bulk | Active | Header | Male Pin | 0.050" (1.27mm) | 24 | 2 | 0.100" (2.54mm) | All | Board to Board or Cable | Unshrouded | Through Hole | Solder | Push-Pull | 0.118" (3.00mm) | 0.098" (2.50mm) | 0.579" (14.70mm) | 0.067" (1.70mm) | Square | Gold | 7.87µin (0.200µm) | Gold | Copper Zinc | Polyamide (PA46), Nylon 4/6, Glass Filled | Sandwich | -40°C ~ 163°C | 1.5A |
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SL 6 121 70 Z0.635 MM"S" SE |
2,723 |
|
![]() Техническая документация |
SL 6 121 | Bulk | Active | Header | Male Pin | 0.100" (2.54mm) | 70 | 2 | 0.100" (2.54mm) | All | Board to Board or Cable | Unshrouded | Through Hole | Solder | Push-Pull | 0.236" (6.00mm) | 0.130" (3.30mm) | 0.845" (21.40mm) | 0.110" (2.80mm) | Square | Tin | 157.5 ~ 236.2µin (4.00 ~ 6.00µm) | Tin | Copper Tin | Polyamide (PA46), Nylon 4/6, Glass Filled | Sandwich | -40°C ~ 163°C | 3A |
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SL 5 415 4 GONE ROW, 0.635 MM |
1,407 |
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![]() Техническая документация |
SL 5 415 | Bulk | Active | Header | Male Pin | 0.100" (2.54mm) | 4 | 1 | - | All | Board to Board or Cable | Unshrouded | Through Hole | Solder | Push-Pull | 0.236" (6.00mm) | 0.130" (3.30mm) | 2.000" (50.80mm) | 0.110" (2.80mm) | Square | Gold | 7.87µin (0.200µm) | Tin | Copper Tin | Polyamide (PA46), Nylon 4/6, Glass Filled | Sandwich | -40°C ~ 163°C | 3A |
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SL 6 415 30 G0.635 MM"S" SE |
1,865 |
|
![]() Техническая документация |
SL 6 415 | Bulk | Active | Header | Male Pin | 0.100" (2.54mm) | 30 | 2 | 0.100" (2.54mm) | All | Board to Board or Cable | Unshrouded | Through Hole | Solder | Push-Pull | 0.236" (6.00mm) | 0.130" (3.30mm) | 2.000" (50.80mm) | 0.110" (2.80mm) | Square | Gold | 7.87µin (0.200µm) | Tin | Copper Tin | Polyamide (PA46), Nylon 4/6, Glass Filled | Sandwich | -40°C ~ 163°C | 3A |
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SL 6 147 66 G0.635 MM"S" SE |
4,107 |
|
![]() Техническая документация |
SL 6 147 | Bulk | Active | Header | Male Pin | 0.100" (2.54mm) | 66 | 2 | 0.100" (2.54mm) | All | Board to Board or Cable | Unshrouded | Through Hole | Solder | Push-Pull | 0.236" (6.00mm) | 0.130" (3.30mm) | 0.945" (24.00mm) | 0.110" (2.80mm) | Square | Gold | 7.87µin (0.200µm) | Gold | Copper Tin | Polyamide (PA46), Nylon 4/6, Glass Filled | Sandwich | -40°C ~ 163°C | 3A |
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SLY 1 139 35 Z0.5 MM, STRAIGHT |
1,937 |
|
![]() Техническая документация |
SLY 1 139 | Bulk | Active | Header | Male Pin | 0.079" (2.00mm) | 35 | 1 | - | All | Board to Board or Cable | Unshrouded | Through Hole | Solder | Push-Pull | 0.370" (9.40mm) | 0.118" (3.00mm) | 0.547" (13.90mm) | 0.059" (1.50mm) | Square | Tin | 157.5 ~ 236.2µin (4.00 ~ 6.00µm) | Tin | Copper Tin | Polyamide (PA46), Nylon 4/6, Glass Filled | - | -40°C ~ 163°C | 3A |
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SL 6 415 2 Z0.635 MM"S" SE |
4,367 |
|
![]() Техническая документация |
SL 6 415 | Bulk | Active | Header | Male Pin | 0.100" (2.54mm) | 2 | 2 | 0.100" (2.54mm) | All | Board to Board or Cable | Unshrouded | Through Hole | Solder | Push-Pull | 0.236" (6.00mm) | 0.130" (3.30mm) | 2.000" (50.80mm) | 0.110" (2.80mm) | Square | Gold | 7.87µin (0.200µm) | Tin | Copper Tin | Polyamide (PA46), Nylon 4/6, Glass Filled | Sandwich | -40°C ~ 163°C | 3A |
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SLV W 7 092 66 GTWO ROWS, 0.4 MM; PITCH 1. |
3,025 |
|
![]() Техническая документация |
SLV W 7 092 | Bulk | Active | Header | Male Pin | 0.050" (1.27mm) | 66 | 2 | 0.050" (1.27mm) | All | Board to Board or Cable | Unshrouded | Through Hole | Solder | Push-Pull | 0.118" (3.00mm) | 0.098" (2.50mm) | 0.579" (14.70mm) | 0.067" (1.70mm) | Square | Gold | 7.87µin (0.200µm) | Gold | Copper Zinc | Polyamide (PA46), Nylon 4/6, Glass Filled | Sandwich | -40°C ~ 163°C | 1.5A |
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SLV W 8 117 48 GTWO ROWS, 0.4 MM; PITCH 1. |
1,025 |
|
![]() Техническая документация |
SLV W 8 117 | Bulk | Active | Header | Male Pin | 0.050" (1.27mm) | 48 | 2 | 0.100" (2.54mm) | All | Board to Board or Cable | Unshrouded | Through Hole | Solder | Push-Pull | 0.118" (3.00mm) | 0.098" (2.50mm) | 0.677" (17.20mm) | 0.067" (1.70mm) | Square | Gold | 7.87µin (0.200µm) | Gold | Copper Zinc | Polyamide (PA46), Nylon 4/6, Glass Filled | Sandwich | -40°C ~ 163°C | 1.5A |
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SLV W 7 092 40 GTWO ROWS, 0.4 MM; PITCH 1. |
3,051 |
|
![]() Техническая документация |
SLV W 7 092 | Bulk | Active | Header | Male Pin | 0.050" (1.27mm) | 40 | 2 | 0.050" (1.27mm) | All | Board to Board or Cable | Unshrouded | Through Hole | Solder | Push-Pull | 0.118" (3.00mm) | 0.098" (2.50mm) | 0.579" (14.70mm) | 0.067" (1.70mm) | Square | Gold | 7.87µin (0.200µm) | Gold | Copper Zinc | Polyamide (PA46), Nylon 4/6, Glass Filled | Sandwich | -40°C ~ 163°C | 1.5A |
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SL 5 415 32 ZONE ROW, 0.635 MM |
3,180 |
|
![]() Техническая документация |
SL 5 415 | Bulk | Active | Header | Male Pin | 0.100" (2.54mm) | 32 | 1 | - | All | Board to Board or Cable | Unshrouded | Through Hole | Solder | Push-Pull | 0.236" (6.00mm) | 0.130" (3.30mm) | 2.000" (50.80mm) | 0.110" (2.80mm) | Square | Gold | 7.87µin (0.200µm) | Tin | Copper Tin | Polyamide (PA46), Nylon 4/6, Glass Filled | Sandwich | -40°C ~ 163°C | 3A |
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SLV W 8 117 32 GTWO ROWS, 0.4 MM; PITCH 1. |
1,749 |
|
![]() Техническая документация |
SLV W 8 117 | Bulk | Active | Header | Male Pin | 0.050" (1.27mm) | 32 | 2 | 0.100" (2.54mm) | All | Board to Board or Cable | Unshrouded | Through Hole | Solder | Push-Pull | 0.118" (3.00mm) | 0.098" (2.50mm) | 0.677" (17.20mm) | 0.067" (1.70mm) | Square | Gold | 7.87µin (0.200µm) | Gold | Copper Zinc | Polyamide (PA46), Nylon 4/6, Glass Filled | Sandwich | -40°C ~ 163°C | 1.5A |
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SL 5 525 12 GONE ROW, 0.635 MM |
2,202 |
|
![]() Техническая документация |
SL 5 525 | Tube | Active | Header | Male Pin | 0.100" (2.54mm) | 12 | 1 | - | All | Board to Board or Cable | Unshrouded | Through Hole | Solder | Push-Pull | 0.236" (6.00mm) | 0.130" (3.30mm) | 2.421" (61.50mm) | 0.110" (2.80mm) | Square | Gold | 7.87µin (0.200µm) | Tin | Copper Tin | Polyamide (PA46), Nylon 4/6, Glass Filled | Sandwich | -40°C ~ 163°C | 3A |
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SLY 11 SMD 092 33 GONE ROW, 0.5 MM, SUITABLE FOR |
4,767 |
|
![]() Техническая документация |
SLY 11 SMD 092 | Bulk | Active | Header | Male Pin | 0.079" (2.00mm) | 33 | 1 | - | All | Board to Board or Cable | Unshrouded | Surface Mount | Solder | Push-Pull | 0.142" (3.60mm) | - | - | 0.059" (1.50mm) | Square | Gold | 7.87µin (0.200µm) | Gold | Copper Tin | Polyamide (PA46), Nylon 4/6, Glass Filled | - | -40°C ~ 163°C | 3A |