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Разъемы, штыревые контакты
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SL 5 223 31 GONE ROW, 0.635 MM |
4,907 |
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Техническая документация |
SL 5 223 | Tube | Active | Header | Male Pin | 0.100" (2.54mm) | 31 | 1 | - | All | Board to Board or Cable | Unshrouded | Through Hole | Solder | Push-Pull | 0.236" (6.00mm) | 0.130" (3.30mm) | 1.244" (31.60mm) | 0.110" (2.80mm) | Square | Gold | 7.87µin (0.200µm) | Gold | Copper Tin | Polyamide (PA46), Nylon 4/6, Glass Filled | Sandwich | -40°C ~ 163°C | 3A |
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SL 5 197 24 GONE ROW, 0.635 MM |
2,207 |
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Техническая документация |
SL 5 197 | Bulk | Active | Header | Male Pin | 0.100" (2.54mm) | 24 | 1 | - | All | Board to Board or Cable | Unshrouded | Through Hole | Solder | Push-Pull | 0.236" (6.00mm) | 0.130" (3.30mm) | 1.142" (29.00mm) | 0.110" (2.80mm) | Square | Gold | 7.87µin (0.200µm) | Gold | Copper Tin | Polyamide (PA46), Nylon 4/6, Glass Filled | Sandwich | -40°C ~ 163°C | 3A |
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SL 5 223 13 ZONE ROW, 0.635 MM |
3,317 |
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Техническая документация |
SL 5 223 | Bulk | Active | Header | Male Pin | 0.100" (2.54mm) | 13 | 1 | - | All | Board to Board or Cable | Unshrouded | Through Hole | Solder | Push-Pull | 0.236" (6.00mm) | 0.130" (3.30mm) | 1.244" (31.60mm) | 0.110" (2.80mm) | Square | Tin | 157.5 ~ 236.2µin (4.00 ~ 6.00µm) | Tin | Copper Tin | Polyamide (PA46), Nylon 4/6, Glass Filled | Sandwich | -40°C ~ 163°C | 3A |
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SLV W 4 KA 060 52 GGRID 1.27 X1.27 MM; SUITABLE FO |
4,961 |
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Техническая документация |
SLV W 4 KA 060 | Tube | Active | Header | Male Pin | 0.050" (1.27mm) | 52 | 2 | 0.050" (1.27mm) | All | Board to Board or Cable | Unshrouded | Through Hole | Solder | Push-Pull | 0.236" (6.00mm) | 0.098" (2.50mm) | - | 0.067" (1.70mm) | Square | Gold | 7.87µin (0.200µm) | Gold | Copper Zinc | Polyamide (PA46), Nylon 4/6, Glass Filled | - | -40°C ~ 163°C | 1.5A |
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SL LP 5 SMD 051 17 Z SM0.635 MM, LOW PROFILE |
1,858 |
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Техническая документация |
SL LP 5 SMD 051 | Bulk | Active | Header | Male Pin | 0.100" (2.54mm) | 17 | 1 | - | All | Board to Board or Cable | Unshrouded | Surface Mount | Solder | Push-Pull | 0.201" (5.10mm) | - | - | 0.067" (1.70mm) | Square | Tin | 157.5 ~ 236.2µin (4.00 ~ 6.00µm) | Tin | Copper Tin | Polyamide (PA46), Nylon 4/6, Glass Filled | - | -40°C ~ 163°C | 3A |
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SL LP 6 SMD 066 8 S B SM PS0.635 MM, LOW PROFILE IN SMD-T |
1,406 |
|
Техническая документация |
SL LP 6 SMD 066 | Bulk | Active | Header | Male Pin | 0.100" (2.54mm) | 8 | 2 | 0.100" (2.54mm) | All | Board to Board or Cable | Unshrouded | Surface Mount | Solder | Push-Pull | 0.260" (6.60mm) | - | - | 0.067" (1.70mm) | Square | Gold | 7.87µin (0.200µm) | Tin | Copper Tin | Polyamide (PA46), Nylon 4/6, Glass Filled | - | -40°C ~ 163°C | 3A |
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SL 2 128 72 ZTWO ROWS, 0.635 MM |
4,458 |
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Техническая документация |
SL 2 128 | Bulk | Active | Header | Male Pin | 0.100" (2.54mm) | 72 | 2 | 0.100" (2.54mm) | All | Board to Board or Cable | Unshrouded | Through Hole | Solder | Push-Pull | 0.504" (12.80mm) | 0.228" (5.80mm) | 0.845" (21.40mm) | 0.110" (2.80mm) | Square | Tin | 157.5 ~ 236.2µin (4.00 ~ 6.00µm) | Tin | Copper Tin | Polyamide (PA46), Nylon 4/6, Glass Filled | - | -40°C ~ 163°C | 3A |
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SL LP 6 SMD 066 60 S B TR PS0.635 MM, LOW PROFILE IN SMD-T |
1,072 |
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Техническая документация |
SL LP 6 SMD 066 | Tape & Reel (TR) | Active | Header | Male Pin | 0.100" (2.54mm) | 60 | 2 | 0.100" (2.54mm) | All | Board to Board or Cable | Unshrouded | Surface Mount | Solder | Push-Pull | 0.260" (6.60mm) | - | - | 0.067" (1.70mm) | Square | Gold | 7.87µin (0.200µm) | Tin | Copper Tin | Polyamide (PA46), Nylon 4/6, Glass Filled | - | -40°C ~ 163°C | 3A |
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SL 20 THR 164 17 Z0.635 MM, THR SOLDERING TECHNI |
2,987 |
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Техническая документация |
SL 20 THR 164 | Bulk | Active | Header | Male Pin | 0.100" (2.54mm) | 17 | 1 | - | All | Board to Board or Cable | Unshrouded | Through Hole | Solder | Push-Pull | 0.457" (11.60mm) | 0.079" (2.00mm) | 0.646" (16.40mm) | 0.110" (2.80mm) | Square | Tin | 157.5 ~ 236.2µin (4.00 ~ 6.00µm) | Tin | Copper Tin | Polyamide (PA46), Nylon 4/6, Glass Filled | - | -40°C ~ 163°C | 3A |
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SL 16 SMD 207 24 G P0.635 MM FOR INTERCONNECTION |
2,719 |
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Техническая документация |
SL 16 SMD 207 | Bulk | Active | Header | Male Pin | 0.100" (2.54mm) | 24 | 2 | 0.100" (2.54mm) | All | Board to Board or Cable | Unshrouded | Surface Mount | Solder | Push-Pull | 0.236" (6.00mm) | - | - | 0.110" (2.80mm) | Square | Gold | 7.87µin (0.200µm) | Gold | Copper Tin | Polyamide (PA46), Nylon 4/6, Glass Filled | - | -40°C ~ 163°C | 3A |
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SL 5 197 13 GONE ROW, 0.635 MM |
3,636 |
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Техническая документация |
SL 5 197 | Bulk | Active | Header | Male Pin | 0.100" (2.54mm) | 13 | 1 | - | All | Board to Board or Cable | Unshrouded | Through Hole | Solder | Push-Pull | 0.236" (6.00mm) | 0.130" (3.30mm) | 1.142" (29.00mm) | 0.110" (2.80mm) | Square | Gold | 7.87µin (0.200µm) | Gold | Copper Tin | Polyamide (PA46), Nylon 4/6, Glass Filled | Sandwich | -40°C ~ 163°C | 3A |
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SL 5 147 33 ZONE ROW, 0.635 MM |
1,021 |
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Техническая документация |
SL 5 147 | Bulk | Active | Header | Male Pin | 0.100" (2.54mm) | 33 | 1 | - | All | Board to Board or Cable | Unshrouded | Through Hole | Solder | Push-Pull | 0.236" (6.00mm) | 0.130" (3.30mm) | 0.945" (24.00mm) | 0.110" (2.80mm) | Square | Tin | 157.5 ~ 236.2µin (4.00 ~ 6.00µm) | Tin | Copper Tin | Polyamide (PA46), Nylon 4/6, Glass Filled | Sandwich | -40°C ~ 163°C | 3A |
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SL 5 147 12 GONE ROW, 0.635 MM |
1,197 |
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Техническая документация |
SL 5 147 | Bulk | Active | Header | Male Pin | 0.100" (2.54mm) | 12 | 1 | - | All | Board to Board or Cable | Unshrouded | Through Hole | Solder | Push-Pull | 0.236" (6.00mm) | 0.130" (3.30mm) | 0.945" (24.00mm) | 0.110" (2.80mm) | Square | Gold | 7.87µin (0.200µm) | Gold | Copper Tin | Polyamide (PA46), Nylon 4/6, Glass Filled | Sandwich | -40°C ~ 163°C | 3A |
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SL 5 197 22 SONE ROW, 0.635 MM |
1,925 |
|
Техническая документация |
SL 5 197 | Bulk | Active | Header | Male Pin | 0.100" (2.54mm) | 22 | 1 | - | All | Board to Board or Cable | Unshrouded | Through Hole | Solder | Push-Pull | 0.236" (6.00mm) | 0.130" (3.30mm) | 1.142" (29.00mm) | 0.110" (2.80mm) | Square | Gold | 7.87µin (0.200µm) | Tin | Copper Tin | Polyamide (PA46), Nylon 4/6, Glass Filled | Sandwich | -40°C ~ 163°C | 3A |
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SL 5 172 16 ZONE ROW, 0.635 MM |
1,035 |
|
Техническая документация |
SL 5 172 | Bulk | Active | Header | Male Pin | 0.100" (2.54mm) | 16 | 1 | - | All | Board to Board or Cable | Unshrouded | Through Hole | Solder | Push-Pull | 0.236" (6.00mm) | 0.130" (3.30mm) | 1.043" (26.50mm) | 0.110" (2.80mm) | Square | Tin | 157.5 ~ 236.2µin (4.00 ~ 6.00µm) | Tin | Copper Tin | Polyamide (PA46), Nylon 4/6, Glass Filled | Sandwich | -40°C ~ 163°C | 3A |
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SLV W 6 117 30 ZONE ROW, 0.4 MMFOR INT |
2,397 |
|
Техническая документация |
SLV W 6 117 | Bulk | Active | Header | Male Pin | 0.050" (1.27mm) | 30 | 1 | - | All | Board to Board or Cable | Unshrouded | Through Hole | Solder | Push-Pull | 0.118" (3.00mm) | 0.098" (2.50mm) | 0.677" (17.20mm) | 0.067" (1.70mm) | Square | Tin | 157.5 ~ 236.2µin (4.00 ~ 6.00µm) | Tin | Copper Zinc | Polyamide (PA46), Nylon 4/6, Glass Filled | Sandwich | -40°C ~ 163°C | 1.5A |
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SL 5 223 27 ZONE ROW, 0.635 MM |
3,884 |
|
Техническая документация |
SL 5 223 | Bulk | Active | Header | Male Pin | 0.100" (2.54mm) | 27 | 1 | - | All | Board to Board or Cable | Unshrouded | Through Hole | Solder | Push-Pull | 0.236" (6.00mm) | 0.130" (3.30mm) | 1.244" (31.60mm) | 0.110" (2.80mm) | Square | Tin | 157.5 ~ 236.2µin (4.00 ~ 6.00µm) | Tin | Copper Tin | Polyamide (PA46), Nylon 4/6, Glass Filled | Sandwich | -40°C ~ 163°C | 3A |
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SL 3 101 26 ZMALE HEADER 0.635 MM, DIMENSIO |
3,228 |
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Техническая документация |
SL 3 101 | Bulk | Active | Header | Male Pin | 0.100" (2.54mm) | 26 | 1 | - | All | Board to Board or Cable | Unshrouded | Through Hole | Solder | Push-Pull | 0.228" (5.80mm) | 0.398" (10.10mm) | - | 0.110" (2.80mm) | Square | Tin | 157.5 ~ 236.2µin (4.00 ~ 6.00µm) | Tin | Copper Tin | Polyamide (PA46), Nylon 4/6, Glass Filled | - | -40°C ~ 163°C | 3A |
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SL 4 152 68 SMALE HEADER 0.635 MM, DIMENSIO |
3,490 |
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Техническая документация |
SL 4 152 | Bulk | Active | Header | Male Pin | 0.100" (2.54mm) | 68 | 2 | 0.100" (2.54mm) | All | Board to Board or Cable | Unshrouded | Through Hole | Solder | Push-Pull | 0.228" (5.80mm) | 0.598" (15.20mm) | - | 0.110" (2.80mm) | Square | Gold | 7.87µin (0.200µm) | Tin | Copper Tin | Polyamide (PA46), Nylon 4/6, Glass Filled | - | -40°C ~ 163°C | 3A |
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SL 3 182 2 SMALE HEADER 0.635 MM, DIMENSIO |
2,767 |
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Техническая документация |
SL 3 182 | Bulk | Active | Header | Male Pin | 0.100" (2.54mm) | 2 | 1 | - | All | Board to Board or Cable | Unshrouded | Through Hole | Solder | Push-Pull | 0.228" (5.80mm) | 0.717" (18.20mm) | - | 0.110" (2.80mm) | Square | Gold | 7.87µin (0.200µm) | Tin | Copper Tin | Polyamide (PA46), Nylon 4/6, Glass Filled | - | -40°C ~ 163°C | 3A |
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