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Разъемы, штыревые контакты
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SL LP 6 SMD 066 26 S0.635 MM, LOW PROFILE IN SMD-T |
2,059 |
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Техническая документация |
SL LP 6 SMD 066 | - | Active | Header | Male Pin | 0.100" (2.54mm) | 26 | 2 | 0.100" (2.54mm) | All | Board to Board or Cable | Unshrouded | Surface Mount | Solder | Push-Pull | 0.260" (6.60mm) | - | - | 0.067" (1.70mm) | Square | Gold | 7.87µin (0.200µm) | Tin | Copper Tin | Polyamide (PA46), Nylon 4/6, Glass Filled | - | -40°C ~ 163°C | 3A |
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SL 6 360 8 Z0.635 MM"S" SE |
3,637 |
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Техническая документация |
SL 6 360 | - | Active | Header | Male Pin | 0.100" (2.54mm) | 8 | 2 | 0.100" (2.54mm) | All | Board to Board or Cable | Unshrouded | Through Hole | Solder | Push-Pull | 0.236" (6.00mm) | 0.130" (3.30mm) | 1.783" (45.30mm) | 0.110" (2.80mm) | Square | Gold | 7.87µin (0.200µm) | Tin | Copper Tin | Polyamide (PA46), Nylon 4/6, Glass Filled | Sandwich | -40°C ~ 163°C | 3A |
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SL LP 6 SMD 066 20 S SM0.635 MM, LOW PROFILE IN SMD-T |
3,012 |
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Техническая документация |
SL LP 6 SMD 066 | - | Active | Header | Male Pin | 0.100" (2.54mm) | 20 | 2 | 0.100" (2.54mm) | All | Board to Board or Cable | Unshrouded | Surface Mount | Solder | Push-Pull | 0.260" (6.60mm) | - | - | 0.067" (1.70mm) | Square | Gold | 7.87µin (0.200µm) | Tin | Copper Tin | Polyamide (PA46), Nylon 4/6, Glass Filled | - | -40°C ~ 163°C | 3A |
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SL 6 315 50 G0.635 MM"S" SE |
3,147 |
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Техническая документация |
SL 6 315 | - | Active | Header | Male Pin | 0.100" (2.54mm) | 50 | 2 | 0.100" (2.54mm) | All | Board to Board or Cable | Unshrouded | Through Hole | Solder | Push-Pull | 0.236" (6.00mm) | 0.130" (3.30mm) | 1.606" (40.80mm) | 0.110" (2.80mm) | Square | Gold | 7.87µin (0.200µm) | Tin | Copper Tin | Polyamide (PA46), Nylon 4/6, Glass Filled | Sandwich | -40°C ~ 163°C | 3A |
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SLY 9 SMD 055 14 S0.5 MM |
1,702 |
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Техническая документация |
SLY 9 SMD 055 | Bulk | Active | Header | Male Pin | 0.079" (2.00mm) | 14 | 1 | - | All | Board to Board or Cable | Unshrouded | Surface Mount | Solder | Push-Pull | 0.217" (5.50mm) | 0.130" (3.30mm) | 0.406" (10.30mm) | 0.059" (1.50mm) | Circular | Gold | 7.87µin (0.200µm) | Tin | Copper Tin | Polyamide (PA46), Nylon 4/6, Glass Filled | - | -40°C ~ 163°C | 3A |
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SL 6 525 4 G0.635 MM"S" SE |
2,069 |
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Техническая документация |
SL 6 525 | - | Active | Header | Male Pin | 0.100" (2.54mm) | 4 | 2 | 0.100" (2.54mm) | All | Board to Board or Cable | Unshrouded | Through Hole | Solder | Push-Pull | 0.236" (6.00mm) | 0.130" (3.30mm) | 2.421" (61.50mm) | 0.110" (2.80mm) | Square | Gold | 7.87µin (0.200µm) | Tin | Copper Tin | Polyamide (PA46), Nylon 4/6, Glass Filled | Sandwich | -40°C ~ 163°C | 3A |
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SL LP 6 SMD 066 20 G B SM0.635 MM, LOW PROFILE IN SMD-T |
4,238 |
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Техническая документация |
SL LP 6 SMD 066 | - | Active | Header | Male Pin | 0.100" (2.54mm) | 20 | 2 | 0.100" (2.54mm) | All | Board to Board or Cable | Unshrouded | Surface Mount | Solder | Push-Pull | 0.260" (6.60mm) | - | - | 0.067" (1.70mm) | Square | Gold | 7.87µin (0.200µm) | Gold | Copper Tin | Polyamide (PA46), Nylon 4/6, Glass Filled | - | -40°C ~ 163°C | 3A |
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SL 16 SMD 182 10 S0.635 MM FOR INTERCONNECTION |
1,986 |
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Техническая документация |
SL 16 SMD 182 | Bulk | Active | Header | Male Pin | 0.100" (2.54mm) | 10 | 2 | 0.100" (2.54mm) | All | Board to Board or Cable | Unshrouded | Surface Mount | Solder | Push-Pull | 0.236" (6.00mm) | - | - | 0.110" (2.80mm) | Square | Gold | 7.87µin (0.200µm) | Tin | Copper Tin | Polyamide (PA46), Nylon 4/6, Glass Filled | - | -40°C ~ 163°C | 3A |
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SL LP 6 SMD 066 20 G PS0.635 MM, LOW PROFILE IN SMD-T |
4,213 |
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Техническая документация |
SL LP 6 SMD 066 | - | Active | Header | Male Pin | 0.100" (2.54mm) | 20 | 2 | 0.100" (2.54mm) | All | Board to Board or Cable | Unshrouded | Surface Mount | Solder | Push-Pull | 0.260" (6.60mm) | - | - | 0.067" (1.70mm) | Square | Gold | 7.87µin (0.200µm) | Gold | Copper Tin | Polyamide (PA46), Nylon 4/6, Glass Filled | - | -40°C ~ 163°C | 3A |
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SL 16 SMD 182 50 S0.635 MM FOR INTERCONNECTION |
2,111 |
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Техническая документация |
SL 16 SMD 182 | Bulk | Active | Header | Male Pin | 0.100" (2.54mm) | 50 | 2 | 0.100" (2.54mm) | All | Board to Board or Cable | Unshrouded | Surface Mount | Solder | Push-Pull | 0.236" (6.00mm) | - | - | 0.110" (2.80mm) | Square | Gold | 7.87µin (0.200µm) | Tin | Copper Tin | Polyamide (PA46), Nylon 4/6, Glass Filled | - | -40°C ~ 163°C | 3A |
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SLV W 8 117 8 GTWO ROWS, 0.4 MM; PITCH 1. |
4,915 |
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Техническая документация |
SLV W 8 117 | Bulk | Active | Header | Male Pin | 0.050" (1.27mm) | 8 | 2 | 0.100" (2.54mm) | All | Board to Board or Cable | Unshrouded | Through Hole | Solder | Push-Pull | 0.118" (3.00mm) | 0.098" (2.50mm) | 0.677" (17.20mm) | 0.067" (1.70mm) | Square | Gold | 7.87µin (0.200µm) | Gold | Copper Zinc | Polyamide (PA46), Nylon 4/6, Glass Filled | Sandwich | -40°C ~ 163°C | 1.5A |
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SL 20 THR 112 21 G0.635 MM, THR SOLDERING TECHNI |
1,243 |
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Техническая документация |
SL 20 THR 112 | Bulk | Active | Header | Male Pin | 0.100" (2.54mm) | 21 | 1 | - | All | Board to Board or Cable | Unshrouded | Through Hole | Solder | Push-Pull | 0.252" (6.40mm) | 0.079" (2.00mm) | 0.441" (11.20mm) | 0.110" (2.80mm) | Square | Gold | 7.87µin (0.200µm) | Gold | Copper Tin | Polyamide (PA46), Nylon 4/6, Glass Filled | - | -40°C ~ 163°C | 3A |
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SLV W 8 092 46 ZTWO ROWS, 0.4 MM; PITCH 1. |
2,470 |
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Техническая документация |
SLV W 8 092 | Bulk | Active | Header | Male Pin | 0.050" (1.27mm) | 46 | 2 | 0.100" (2.54mm) | All | Board to Board or Cable | Unshrouded | Through Hole | Solder | Push-Pull | 0.118" (3.00mm) | 0.098" (2.50mm) | 0.579" (14.70mm) | 0.067" (1.70mm) | Square | Tin | 157.5 ~ 236.2µin (4.00 ~ 6.00µm) | Tin | Copper Zinc | Polyamide (PA46), Nylon 4/6, Glass Filled | Sandwich | -40°C ~ 163°C | 1.5A |
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SL 2 025 64 GTWO ROWS, 0.635 MM |
3,620 |
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Техническая документация |
SL 2 025 | Bulk | Active | Header | Male Pin | 0.100" (2.54mm) | 64 | 2 | 0.100" (2.54mm) | All | Board to Board or Cable | Unshrouded | Through Hole | Solder | Push-Pull | 0.228" (5.80mm) | 0.102" (2.60mm) | 0.441" (11.20mm) | 0.110" (2.80mm) | Square | Gold | 7.87µin (0.200µm) | Gold | Copper Tin | Polyamide (PA46), Nylon 4/6, Glass Filled | - | -40°C ~ 163°C | 3A |
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SLV W 8 117 12 GTWO ROWS, 0.4 MM; PITCH 1. |
1,693 |
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Техническая документация |
SLV W 8 117 | Bulk | Active | Header | Male Pin | 0.050" (1.27mm) | 12 | 2 | 0.100" (2.54mm) | All | Board to Board or Cable | Unshrouded | Through Hole | Solder | Push-Pull | 0.118" (3.00mm) | 0.098" (2.50mm) | 0.677" (17.20mm) | 0.067" (1.70mm) | Square | Gold | 7.87µin (0.200µm) | Gold | Copper Zinc | Polyamide (PA46), Nylon 4/6, Glass Filled | Sandwich | -40°C ~ 163°C | 1.5A |
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SLY 1 081 22 Z0.5 MM, STRAIGHT |
4,603 |
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Техническая документация |
SLY 1 081 | Bulk | Active | Header | Male Pin | 0.079" (2.00mm) | 22 | 1 | - | All | Board to Board or Cable | Unshrouded | Through Hole | Solder | Push-Pull | 0.142" (3.60mm) | 0.118" (3.00mm) | 0.319" (8.10mm) | 0.059" (1.50mm) | Square | Tin | 157.5 ~ 236.2µin (4.00 ~ 6.00µm) | Tin | Copper Tin | Polyamide (PA46), Nylon 4/6, Glass Filled | - | -40°C ~ 163°C | 3A |
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SL 2 053 58 STWO ROWS, 0.635 MM |
4,937 |
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Техническая документация |
SL 2 053 | Bulk | Active | Header | Male Pin | 0.100" (2.54mm) | 58 | 2 | 0.100" (2.54mm) | All | Board to Board or Cable | Unshrouded | Through Hole | Solder | Push-Pull | 0.209" (5.30mm) | 0.228" (5.80mm) | 0.547" (13.90mm) | 0.110" (2.80mm) | Square | Gold | 7.87µin (0.200µm) | Tin | Copper Tin | Polyamide (PA46), Nylon 4/6, Glass Filled | - | -40°C ~ 163°C | 3A |
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SLV W 7 117 18 GTWO ROWS, 0.4 MM; PITCH 1. |
1,878 |
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Техническая документация |
SLV W 7 117 | Bulk | Active | Header | Male Pin | 0.050" (1.27mm) | 18 | 2 | 0.050" (1.27mm) | All | Board to Board or Cable | Unshrouded | Through Hole | Solder | Push-Pull | 0.118" (3.00mm) | 0.098" (2.50mm) | 0.677" (17.20mm) | 0.067" (1.70mm) | Square | Gold | 7.87µin (0.200µm) | Gold | Copper Zinc | Polyamide (PA46), Nylon 4/6, Glass Filled | Sandwich | -40°C ~ 163°C | 1.5A |
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SL 2 078 36 STWO ROWS, 0.635 MM |
1,579 |
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Техническая документация |
SL 2 078 | Bulk | Active | Header | Male Pin | 0.100" (2.54mm) | 36 | 2 | 0.100" (2.54mm) | All | Board to Board or Cable | Unshrouded | Through Hole | Solder | Push-Pull | 0.307" (7.80mm) | 0.228" (5.80mm) | 0.646" (16.40mm) | 0.110" (2.80mm) | Square | Gold | 7.87µin (0.200µm) | Tin | Copper Tin | Polyamide (PA46), Nylon 4/6, Glass Filled | - | -40°C ~ 163°C | 3A |
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SLV W 7 117 64 ZTWO ROWS, 0.4 MM; PITCH 1. |
1,260 |
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Техническая документация |
SLV W 7 117 | Bulk | Active | Header | Male Pin | 0.050" (1.27mm) | 64 | 2 | 0.050" (1.27mm) | All | Board to Board or Cable | Unshrouded | Through Hole | Solder | Push-Pull | 0.118" (3.00mm) | 0.098" (2.50mm) | 0.677" (17.20mm) | 0.067" (1.70mm) | Square | Tin | 157.5 ~ 236.2µin (4.00 ~ 6.00µm) | Tin | Copper Zinc | Polyamide (PA46), Nylon 4/6, Glass Filled | Sandwich | -40°C ~ 163°C | 1.5A |
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