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Разъемы, штыревые контакты
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SL LP 6 SMD 051 50 S B SM PS0.635 MM, LOW PROFILE IN SMD-T |
2,555 |
|
Техническая документация |
SL LP 6 SMD 051 | Tube | Active | Header | Male Pin | 0.100" (2.54mm) | 50 | 2 | 0.100" (2.54mm) | All | Board to Board or Cable | Unshrouded | Surface Mount | Solder | Push-Pull | 0.201" (5.10mm) | - | - | 0.067" (1.70mm) | Square | Gold | 7.87µin (0.200µm) | Tin | Copper Tin | Polyamide (PA46), Nylon 4/6, Glass Filled | - | -40°C ~ 163°C | 3A |
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SL LP 5 SMD 051 21 G0.635 MM, LOW PROFILE |
1,138 |
|
Техническая документация |
SL LP 5 SMD 051 | Tube | Active | Header | Male Pin | 0.100" (2.54mm) | 21 | 1 | - | All | Board to Board or Cable | Unshrouded | Surface Mount | Solder | Push-Pull | 0.201" (5.10mm) | - | - | 0.067" (1.70mm) | Square | Gold | 7.87µin (0.200µm) | Gold | Copper Tin | Polyamide (PA46), Nylon 4/6, Glass Filled | - | -40°C ~ 163°C | 3A |
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SL LP 6 SMD 051 68 Z B SM PS0.635 MM, LOW PROFILE IN SMD-T |
1,027 |
|
Техническая документация |
SL LP 6 SMD 051 | - | Active | Header | Male Pin | 0.100" (2.54mm) | 68 | 2 | 0.100" (2.54mm) | All | Board to Board or Cable | Unshrouded | Surface Mount | Solder | Push-Pull | 0.201" (5.10mm) | - | - | 0.067" (1.70mm) | Square | Tin | 157.5 ~ 236.2µin (4.00 ~ 6.00µm) | Tin | Copper Tin | Polyamide (PA46), Nylon 4/6, Glass Filled | - | -40°C ~ 163°C | 3A |
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SL LP 5 SMD 051 5 Z B SM0.635 MM, LOW PROFILE |
4,723 |
|
Техническая документация |
SL LP 5 SMD 051 | Bulk | Active | Header | Male Pin | 0.100" (2.54mm) | 5 | 1 | - | All | Board to Board or Cable | Unshrouded | Surface Mount | Solder | Push-Pull | 0.201" (5.10mm) | - | - | 0.067" (1.70mm) | Square | Tin | 157.5 ~ 236.2µin (4.00 ~ 6.00µm) | Tin | Copper Tin | Polyamide (PA46), Nylon 4/6, Glass Filled | - | -40°C ~ 163°C | 3A |
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SLY 8 SMD 062 46 S0.5 MM |
3,531 |
|
Техническая документация |
SLY 8 SMD 062 | Bulk | Active | Header | Male Pin | 0.079" (2.00mm) | 46 | 2 | 0.079" (2.00mm) | All | Board to Board or Cable | Unshrouded | Surface Mount | Solder | Push-Pull | 0.244" (6.20mm) | - | 0.323" (8.20mm) | 0.059" (1.50mm) | Circular | Gold | 7.87µin (0.200µm) | Tin | Copper Tin | Polyamide (PA46), Nylon 4/6, Glass Filled | - | -40°C ~ 163°C | 3A |
|
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SL LP 5 SMD 051 33 S0.635 MM, LOW PROFILE |
2,489 |
|
Техническая документация |
SL LP 5 SMD 051 | Bulk | Active | Header | Male Pin | 0.100" (2.54mm) | 33 | 1 | - | All | Board to Board or Cable | Unshrouded | Surface Mount | Solder | Push-Pull | 0.201" (5.10mm) | - | - | 0.067" (1.70mm) | Square | Gold | 7.87µin (0.200µm) | Tin | Copper Tin | Polyamide (PA46), Nylon 4/6, Glass Filled | - | -40°C ~ 163°C | 3A |
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SLY 9 SMD 040 11 G0.5 MM |
4,851 |
|
Техническая документация |
SLY 9 SMD 040 | Bulk | Active | Header | Male Pin | 0.079" (2.00mm) | 11 | 1 | - | All | Board to Board or Cable | Unshrouded | Surface Mount | Solder | Push-Pull | 0.157" (4.00mm) | 0.130" (3.30mm) | 0.346" (8.80mm) | 0.059" (1.50mm) | Circular | Gold | 7.87µin (0.200µm) | Gold | Copper Tin | Polyamide (PA46), Nylon 4/6, Glass Filled | - | -40°C ~ 163°C | 3A |
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SL LP 5 SMD 051 23 S B SM0.635 MM, LOW PROFILE |
3,791 |
|
Техническая документация |
SL LP 5 SMD 051 | Bulk | Active | Header | Male Pin | 0.100" (2.54mm) | 23 | 1 | - | All | Board to Board or Cable | Unshrouded | Surface Mount | Solder | Push-Pull | 0.201" (5.10mm) | - | - | 0.067" (1.70mm) | Square | Gold | 7.87µin (0.200µm) | Tin | Copper Tin | Polyamide (PA46), Nylon 4/6, Glass Filled | - | -40°C ~ 163°C | 3A |
|
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SL LP 6 SMD 066 14 S B SM0.635 MM, LOW PROFILE IN SMD-T |
3,400 |
|
Техническая документация |
SL LP 6 SMD 066 | Tube | Active | Header | Male Pin | 0.100" (2.54mm) | 14 | 2 | 0.100" (2.54mm) | All | Board to Board or Cable | Unshrouded | Surface Mount | Solder | Push-Pull | 0.260" (6.60mm) | - | - | 0.067" (1.70mm) | Square | Gold | 7.87µin (0.200µm) | Tin | Copper Tin | Polyamide (PA46), Nylon 4/6, Glass Filled | - | -40°C ~ 163°C | 3A |
|
|
SL LP 5 SMD 051 28 Z0.635 MM, LOW PROFILE |
4,629 |
|
Техническая документация |
SL LP 5 SMD 051 | Bulk | Active | Header | Male Pin | 0.100" (2.54mm) | 28 | 1 | - | All | Board to Board or Cable | Unshrouded | Surface Mount | Solder | Push-Pull | 0.201" (5.10mm) | - | - | 0.067" (1.70mm) | Square | Tin | 157.5 ~ 236.2µin (4.00 ~ 6.00µm) | Tin | Copper Tin | Polyamide (PA46), Nylon 4/6, Glass Filled | - | -40°C ~ 163°C | 3A |
|
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SLY 8 SMD 062 48 G B SM0.5 MM |
3,946 |
|
Техническая документация |
SLY 8 SMD 062 | Tube | Active | Header | Male Pin | 0.079" (2.00mm) | 48 | 2 | 0.079" (2.00mm) | All | Board to Board or Cable | Unshrouded | Surface Mount | Solder | Push-Pull | 0.244" (6.20mm) | - | 0.323" (8.20mm) | 0.059" (1.50mm) | Circular | Gold | 7.87µin (0.200µm) | Gold | Copper Tin | Polyamide (PA46), Nylon 4/6, Glass Filled | - | -40°C ~ 163°C | 3A |
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SL 28 SMD THR 109 66 G0.635 MM |
4,844 |
|
Техническая документация |
SL 28 SMD THR 109 | Bulk | Active | Header | Male Pin | 0.100" (2.54mm) | 66 | 2 | 0.100" (2.54mm) | All | Board to Board or Cable | Unshrouded | Surface Mount and Through Hole | Solder | Push-Pull | 0.429" (10.90mm) | - | - | 0.110" (2.80mm) | Square | Gold | 7.87µin (0.200µm) | Gold | Copper Tin | Polyamide (PA46), Nylon 4/6, Glass Filled | - | -40°C ~ 163°C | 3A |
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SL LP 6 SMD 051 60 Z SM PS0.635 MM, LOW PROFILE IN SMD-T |
3,382 |
|
Техническая документация |
SL LP 6 SMD 051 | - | Active | Header | Male Pin | 0.100" (2.54mm) | 60 | 2 | 0.100" (2.54mm) | All | Board to Board or Cable | Unshrouded | Surface Mount | Solder | Push-Pull | 0.201" (5.10mm) | - | - | 0.067" (1.70mm) | Square | Tin | 157.5 ~ 236.2µin (4.00 ~ 6.00µm) | Tin | Copper Tin | Polyamide (PA46), Nylon 4/6, Glass Filled | - | -40°C ~ 163°C | 3A |
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|
SL 14 122 20 G0.635 MM, SANDWICH |
1,380 |
|
Техническая документация |
SL 14 122 | Bulk | Active | Header | Male Pin | 0.100" (2.54mm) | 20 | 2 | 0.100" (2.54mm) | All | Board to Board or Cable | Unshrouded | Through Hole | Solder | Push-Pull | 0.433" (11.00mm) | 0.130" (3.30mm) | 1.043" (26.50mm) | 0.110" (2.80mm) | Square | Gold | 7.87µin (0.200µm) | Gold | Copper Tin | Polyamide (PA46), Nylon 4/6, Glass Filled | Sandwich | -40°C ~ 163°C | 3A |
|
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SL LP 7 SMD 055 24 Z0.635 MM, LOW PROFILE IN SMD-T |
3,753 |
|
Техническая документация |
SL LP 7 SMD 055 | - | Active | Header | Male Pin | 0.100" (2.54mm) | 24 | 1 | - | All | Board to Board or Cable | Unshrouded | Surface Mount | Solder | Push-Pull | 0.217" (5.50mm) | 0.150" (3.80mm) | 0.433" (11.00mm) | 0.067" (1.70mm) | Square | Tin | 157.5 ~ 236.2µin (4.00 ~ 6.00µm) | Tin | Copper Tin | Polyamide (PA46), Nylon 4/6, Glass Filled | - | -40°C ~ 163°C | 3A |
|
|
SL LP 7 SMD 055 34 Z0.635 MM, LOW PROFILE IN SMD-T |
1,626 |
|
Техническая документация |
SL LP 7 SMD 055 | Bulk | Active | Header | Male Pin | 0.100" (2.54mm) | 34 | 1 | - | All | Board to Board or Cable | Unshrouded | Surface Mount | Solder | Push-Pull | 0.217" (5.50mm) | 0.150" (3.80mm) | 0.433" (11.00mm) | 0.067" (1.70mm) | Square | Tin | 157.5 ~ 236.2µin (4.00 ~ 6.00µm) | Tin | Copper Tin | Polyamide (PA46), Nylon 4/6, Glass Filled | - | -40°C ~ 163°C | 3A |
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SL 4 025 22 ZMALE HEADER 0.635 MM, DIMENSIO |
3,871 |
|
Техническая документация |
SL 4 025 | Bulk | Active | Header | Male Pin | 0.100" (2.54mm) | 22 | 2 | 0.100" (2.54mm) | All | Board to Board or Cable | Unshrouded | Through Hole | Solder | Push-Pull | 0.228" (5.80mm) | 0.118" (3.00mm) | - | 0.110" (2.80mm) | Square | Tin | 157.5 ~ 236.2µin (4.00 ~ 6.00µm) | Tin | Copper Tin | Polyamide (PA46), Nylon 4/6, Glass Filled | - | -40°C ~ 163°C | 3A |
|
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SL LP 6 SMD 066 32 S SM0.635 MM, LOW PROFILE IN SMD-T |
1,479 |
|
Техническая документация |
SL LP 6 SMD 066 | Tube | Active | Header | Male Pin | 0.100" (2.54mm) | 32 | 2 | 0.100" (2.54mm) | All | Board to Board or Cable | Unshrouded | Surface Mount | Solder | Push-Pull | 0.260" (6.60mm) | - | - | 0.067" (1.70mm) | Square | Gold | 7.87µin (0.200µm) | Tin | Copper Tin | Polyamide (PA46), Nylon 4/6, Glass Filled | - | -40°C ~ 163°C | 3A |
|
|
SL 14 147 62 Z0.635 MM, SANDWICH |
2,781 |
|
Техническая документация |
SL 14 147 | - | Active | Header | Male Pin | 0.100" (2.54mm) | 62 | 2 | 0.100" (2.54mm) | All | Board to Board or Cable | Unshrouded | Through Hole | Solder | Push-Pull | 0.433" (11.00mm) | 0.130" (3.30mm) | 1.142" (29.00mm) | 0.110" (2.80mm) | Square | Tin | 157.5 ~ 236.2µin (4.00 ~ 6.00µm) | Tin | Copper Tin | Polyamide (PA46), Nylon 4/6, Glass Filled | Sandwich | -40°C ~ 163°C | 3A |
|
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SL LP 7 SMD 040 3 Z0.635 MM, LOW PROFILE IN SMD-T |
4,469 |
|
Техническая документация |
SL LP 7 SMD 040 | Bulk | Active | Header | Male Pin | 0.100" (2.54mm) | 3 | 1 | - | All | Board to Board or Cable | Unshrouded | Surface Mount | Solder | Push-Pull | 0.157" (4.00mm) | 0.150" (3.80mm) | 0.374" (9.50mm) | 0.067" (1.70mm) | Square | Tin | 157.5 ~ 236.2µin (4.00 ~ 6.00µm) | Tin | Copper Tin | Polyamide (PA46), Nylon 4/6, Glass Filled | - | -40°C ~ 163°C | 3A |
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