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| Фото | Парт. № производителя | Наличие | Количество | Техническая документация | Серия | Упаковка | Состояние продукта | Тип | Состав | Диаметр | Точка плавления | Тип флюса | Сечение провода | Тип сетки | Процесс | Форма | Срок хранения | Начало срока годности | Температура хранения/охлаждения |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
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70-3213-0811SOLDER PASTE NXG1 NO CLEAN 600GM |
2,214 |
|
Техническая документация |
NXG1 | Bulk | Active | Solder Paste | Sn96.5Ag3Cu0.5 (96.5/3/0.5) | - | 423 ~ 424°F (217 ~ 218°C) | No-Clean | - | 3 | Lead Free | Cartridge, 21.16 oz (600g) | 8 Months | Date of Manufacture | 32°F ~ 50°F (0°C ~ 10°C) |
|
24-6337-8870SOLDER FLUX-CORED/245 63/37 .010 |
1,110 |
|
Техническая документация |
245 | Bulk | Active | Wire Solder | Sn63Pb37 (63/37) | 0.010" (0.25mm) | 361°F (183°C) | No-Clean | 30 AWG, 33 SWG | - | Leaded | Spool, 1 lb (454 g) | - | - | 50°F ~ 104°F (10°C ~ 40°C) |
|
|
70-5022-0911WP616 SN96.5AG3.0CU0.5 T4 88.8% |
1,908 |
|
Техническая документация |
- | Bulk | Active | Solder Paste | Sn96.5Ag3Cu0.5 (96.5/3/0.5) | - | - | Water Soluble | - | - | Lead Free | Cartridge, 21.16 oz (600g) | 6 Months | Date of Manufacture | 32°F ~ 50°F (0°C ~ 10°C) |
|
|
70-4003-2111NP505 LT SN42BI57AG1 T4 89.0% 60 |
1,209 |
|
Техническая документация |
- | Bulk | Active | - | - | - | - | - | - | - | - | - | - | - | - |
|
SMD291AX500T5CSOLDER PASTE 63/37 T5 500G |
3,322 |
|
Техническая документация |
- | Bulk | Active | Solder Paste | Sn63Pb37 (63/37) | - | 361°F (183°C) | No-Clean | - | 5 | Leaded | Cartridge, 17.64 oz (500g) | 12 Months | Date of Manufacture | 37°F ~ 46°F (3°C ~ 8°C) |
|
SMD4300AX500T5CSOLDER PASTE 63/37 T5 500G |
3,986 |
|
Техническая документация |
CHIPQUIK® SMD4300 | Bulk | Active | Solder Paste | Sn63Pb37 (63/37) | - | 361°F (183°C) | No-Clean, Water Soluble | - | 5 | Leaded | Cartridge, 17.64 oz (500g) | 12 Months | Date of Manufacture | 37°F ~ 46°F (3°C ~ 8°C) |
|
70-4105-0911SOLDER PASTE NO CLEAN 600GM |
4,962 |
|
Техническая документация |
NP545 | Bulk | Active | Solder Paste | Sn96.5Ag3Cu0.5 (96.5/3/0.5) | - | 423 ~ 424°F (217 ~ 218°C) | No-Clean | - | 4 | Lead Free | Cartridge, 21.16 oz (600g) | 12 Months | Date of Manufacture | 32°F ~ 50°F (0°C ~ 10°C) |
|
70-4021-1411SOLDER PASTE NO CLEAN 600GM |
3,853 |
|
Техническая документация |
NP505-HR | Bulk | Active | Solder Paste | Sn96.5Ag3Cu0.5 (96.5/3/0.5) | - | 423 ~ 424°F (217 ~ 218°C) | No-Clean | - | 4 | Lead Free | Cartridge, 21.16 oz (600g) | 12 Months | Date of Manufacture | 32°F ~ 50°F (0°C ~ 10°C) |
|
70-4006-2010SOLDER PASTE NO CLEAN 500GM |
3,380 |
|
Техническая документация |
NP505-HR | Bulk | Active | Solder Paste | Sn96.5Ag3Cu0.5 (96.5/3/0.5) | - | 423 ~ 424°F (217 ~ 218°C) | No-Clean | - | 5 | Lead Free | Jar, 17.64 oz (500g) | 6 Months | Date of Manufacture | 32°F ~ 50°F (0°C ~ 10°C) |
|
70-0605-0910SOLDER PASTE NO CLEAN 500GM |
4,342 |
|
Техническая документация |
EM907 | Bulk | Active | Solder Paste | Sn96.5Ag3Cu0.5 (96.5/3/0.5) | - | 423 ~ 424°F (217 ~ 218°C) | No-Clean | - | 4 | Lead Free | Jar, 17.64 oz (500g) | 4 Months | Date of Manufacture | 32°F ~ 50°F (0°C ~ 10°C) |
|
70-1002-0311SOLDER PASTE WATER SOLUBLE 600GM |
2,569 |
|
Техническая документация |
HydroMark 531 | Bulk | Active | Solder Paste | Sn62Pb36Ag2 (62/36/2) | - | 354°F (179°C) | Water Soluble | - | 3 | Leaded | Cartridge, 21.16 oz (600g) | 6 Months | Date of Manufacture | 32°F ~ 50°F (0°C ~ 10°C) |
|
|
MMF0066301240-FPA SILVER SOLDER PASTE -- |
2,820 |
|
Техническая документация |
- | Bulk | Active | Solder Paste | Ag40Cu30Zn28Ni2 (40/30/28/2) | - | 1220 ~ 1435°F (660 ~ 780°C) | - | - | - | Lead Free | Jar, 1 oz (28g) | 9 Months | Date of Manufacture | 41°F ~ 77°F (5°C ~ 25°C) |
|
|
70-2102-0311SOLDER PASTE WATER SOLUBLE 600GM |
1,392 |
|
Техническая документация |
R562 | Bulk | Active | Solder Paste | Sn62Pb36Ag2 (62/36/2) | - | 354°F (179°C) | Water Soluble | - | 3 | Leaded | Cartridge, 21.16 oz (600g) | 6 Months | Date of Manufacture | 32°F ~ 50°F (0°C ~ 10°C) |
|
16-6040-0125SOLDER 60/40 8AWG 5LB |
1,502 |
|
Техническая документация |
Solid Core Wire | Spool | Active | Wire Solder | Sn60Pb40 (60/40) | 0.125" (3.18mm) | 361 ~ 374°F (183 ~ 190°C) | - | 8 AWG, 10 SWG | - | Leaded | Spool, 5 lbs (2.27kg) | - | - | 50°F ~ 104°F (10°C ~ 40°C) |
|
70-0605-0811SOLDER PASTE NO CLEAN 600GM |
2,335 |
|
Техническая документация |
EM907 | Bulk | Active | Solder Paste | Sn96.5Ag3Cu0.5 (96.5/3/0.5) | - | 423 ~ 424°F (217 ~ 218°C) | No-Clean | - | 3 | Lead Free | Cartridge, 21.16 oz (600g) | 4 Months | Date of Manufacture | 32°F ~ 50°F (0°C ~ 10°C) |
|
70-0102-0311SOLDER PASTE NO CLEAN 600GM |
2,169 |
|
Техническая документация |
EP256 | Bulk | Active | Solder Paste | Sn62Pb36Ag2 (62/36/2) | - | 354°F (179°C) | No-Clean | - | 3 | Leaded | Cartridge, 21.16 oz (600g) | 6 Months | Date of Manufacture | 32°F ~ 50°F (0°C ~ 10°C) |
|
70-0102-0519SOLDER PASTE NO CLEAN 750GM |
2,839 |
|
Техническая документация |
EP256 | Bulk | Active | Solder Paste | Sn63Pb37 (63/37) | - | 361°F (183°C) | No-Clean | - | 3 | Leaded | Cartridge, 24.69 oz (700g) | 6 Months | Date of Manufacture | 32°F ~ 50°F (0°C ~ 10°C) |
|
15-7000-0050SOLDER SOLID WIRE .050" 4LB SPL |
2,689 |
|
Техническая документация |
Solid Core Wire | Bulk | Active | Wire Solder | Sn99 (99) | 0.050" (1.27mm) | - | - | 16 AWG, 18 SWG | - | Lead Free | Spool, 4 lbs (1.81kg) | - | - | 50°F ~ 104°F (10°C ~ 40°C) |
|
70-0202-0311SOLDER PASTE NO CLEAN 600GM |
3,928 |
|
Техническая документация |
EP256HA | Bulk | Active | Solder Paste | Sn62Pb36Ag2 (62/36/2) | - | 354°F (179°C) | No-Clean | - | 3 | Leaded | Cartridge, 21.16 oz (600g) | 6 Months | Date of Manufacture | 32°F ~ 50°F (0°C ~ 10°C) |
|
70-2002-0511SOLDER PASTE WATER SOLUBLE 600GM |
2,574 |
|
Техническая документация |
R560 | Bulk | Active | Solder Paste | Sn63Pb37 (63/37) | - | 361°F (183°C) | Water Soluble | - | 3 | Leaded | Cartridge, 21.16 oz (600g) | 6 Months | Date of Manufacture | 32°F ~ 50°F (0°C ~ 10°C) |
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