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| Фото | Парт. № производителя | Наличие | Количество | Техническая документация | Серия | Упаковка | Состояние продукта | Тип | Состав | Диаметр | Точка плавления | Тип флюса | Сечение провода | Тип сетки | Процесс | Форма | Срок хранения | Начало срока годности | Температура хранения/охлаждения |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
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JET551LT30T5JET PRINTING SOLDER PASTE SN42/B |
2,556 |
|
Техническая документация |
CHIPQUIK® | Bulk | Active | Solder Paste | Sn42Bi57.6Ag0.4 (42/57.6/0.4) | - | 280°F (138°C) | No-Clean | - | - | - | Syringe, 3.53 oz (100g) | 12 Months | Date of Manufacture | - |
|
24-7068-7605SOLDER FLUX-CORED/275 .0240" 1LB |
4,067 |
|
Техническая документация |
275 | Bulk | Active | Wire Solder | Sn96.5Ag3Cu0.5 (96.5/3/0.5) | 0.040" (1.02mm) | 423 ~ 424°F (217 ~ 218°C) | No-Clean | 18 AWG, 19 SWG | - | Lead Free | Spool, 1 lb (454 g) | - | - | 50°F ~ 104°F (10°C ~ 40°C) |
|
14-7068-0040SOLDER SOLID WIRE .040" 1LB SPL |
3,667 |
|
Техническая документация |
Solid Core Wire | Bulk | Active | Wire Solder | Sn96.5Ag3Cu0.5 (96.5/3/0.5) | 0.040" (1.02mm) | 423 ~ 424°F (217 ~ 218°C) | - | 18 AWG, 19 SWG | - | Lead Free | Spool, 1 lb (454 g) | - | - | 50°F ~ 104°F (10°C ~ 40°C) |
|
|
24-7068-7600SOLDER FLUX-CORED/275 .031" 1LB |
1,137 |
|
Техническая документация |
275 | Bulk | Active | Wire Solder | Sn96.5Ag3Cu0.5 (96.5/3/0.5) | 0.031" (0.79mm) | 423 ~ 424°F (217 ~ 218°C) | No-Clean | 20 AWG, 22 SWG | - | Lead Free | Spool, 1 lb (454 g) | - | - | 50°F ~ 104°F (10°C ~ 40°C) |
|
24-6337-7420SOLDER FLUX-CORED/282 63/37.025" |
1,685 |
|
Техническая документация |
282 | Bulk | Active | Wire Solder | Sn63Pb37 (63/37) | 0.025" (0.64mm) | 361°F (183°C) | Rosin Mildly Activated (RMA) | 22 AWG, 23 SWG | - | Leaded | Spool, 1 lb (454 g) | - | - | - |
|
|
2080670LOCTITE HF 2W SN63T3 905V AU 500 |
4,012 |
|
Техническая документация |
HF2W | Bulk | Active | Solder Paste | Sn63Pb37 (63/37) | - | 361°F (183°C) | Water Soluble | - | - | Leaded | Jar, 17.64 oz (500g) | - | - | 32°F ~ 50°F (0°C ~ 10°C) |
|
|
24-7068-7619SOLDER FLUX-CORED/275 .025" 1LB |
2,005 |
|
Техническая документация |
275 | Bulk | Active | Wire Solder | Sn96.5Ag3Cu0.5 (96.5/3/0.5) | 0.025" (0.64mm) | 423 ~ 424°F (217 ~ 218°C) | No-Clean | 22 AWG, 23 SWG | - | Lead Free | Spool, 1 lb (454 g) | - | - | 50°F ~ 104°F (10°C ~ 40°C) |
|
92-7068-6402SOLDER FLUX-CORED/331 .031" 500G |
4,989 |
|
Техническая документация |
331 | Bulk | Active | Wire Solder | Sn96.5Ag3Cu0.5 (96.5/3/0.5) | 0.031" (0.79mm) | 423 ~ 424°F (217 ~ 218°C) | Water Soluble | 20 AWG, 22 SWG | - | Lead Free | Spool, 17.64 oz (500g) | - | - | 50°F ~ 104°F (10°C ~ 40°C) |
|
24-7050-0027SOLDER RA 9SN6.3/AG3.7 20AWG 1LB |
1,934 |
|
Техническая документация |
44 | Spool | Active | Wire Solder | Sn96.3Ag3.7 (96.3/3.7) | 0.031" (0.79mm) | 430 ~ 444°F (221 ~ 223°C) | Rosin Activated (RA) | 20 AWG, 22 SWG | - | Lead Free | Spool, 1 lb (454 g) | - | - | - |
|
24-7340-9713SOLDER FLUX-CORED/285 .031" 1LB |
1,700 |
|
Техническая документация |
285 | Bulk | Active | Wire Solder | Pb93.5Sn5Ag1.5 (93.5/5/1.5) | 0.031" (0.79mm) | 565 ~ 574°F (296 ~ 301°C) | Rosin Mildly Activated (RMA) | 20 AWG, 22 SWG | - | Leaded | Spool, 1 lb (454 g) | - | - | 50°F ~ 104°F (10°C ~ 40°C) |
|
|
24-7317-9700SOLDER FLUX-CORED/285 .020 1LB S |
1,701 |
|
Техническая документация |
285 | Bulk | Active | Wire Solder | Pb88Sn10Ag2 (88/10/2) | 0.020" (0.51mm) | 514 ~ 570°F (268 ~ 299°C) | Rosin Mildly Activated (RMA) | 24 AWG, 25 SWG | - | Leaded | Spool, 1 lb (454 g) | - | - | 50°F ~ 104°F (10°C ~ 40°C) |
|
TS991AX500T4SOLDER PASTE THERMALLY STABLE NC |
2,403 |
|
Техническая документация |
CHIPQUIK® | Bulk | Active | Solder Paste | Sn63Pb37 (63/37) | - | 361°F (183°C) | No-Clean | - | 4 | Leaded | Jar, 17.64 oz (500g) | 12 Months | Date of Manufacture | - |
|
24-7040-8846SOLDER FLUX-CORED/245 .0240" 1LB |
1,916 |
|
Техническая документация |
245 | Bulk | Active | Wire Solder | Sn96.5Ag3.5 (96.5/3.5) | 0.040" (1.02mm) | 430°F (221°C) | No-Clean | 18 AWG, 19 SWG | - | Lead Free | Spool, 1 lb (454 g) | - | - | 50°F ~ 104°F (10°C ~ 40°C) |
|
24-7150-0010SOLDER FLUX-CORED/44 .020" 1LB S |
1,368 |
|
Техническая документация |
44 | Bulk | Active | Wire Solder | Sn62Pb36Ag2 (62/36/2) | 0.020" (0.51mm) | 354°F (179°C) | Rosin Activated (RA) | 24 AWG, 25 SWG | - | Leaded | Spool, 1 lb (454 g) | - | - | 50°F ~ 104°F (10°C ~ 40°C) |
|
|
92-7068-7601SOLDER FLUX-CORED/275 .031" 500G |
4,096 |
|
Техническая документация |
275 | Bulk | Active | Wire Solder | Sn96.5Ag3Cu0.5 (96.5/3/0.5) | 0.031" (0.79mm) | 423 ~ 424°F (217 ~ 218°C) | No-Clean | 20 AWG, 22 SWG | - | Lead Free | Spool, 17.64 oz (500g) | - | - | 50°F ~ 104°F (10°C ~ 40°C) |
|
14-7050-0031SOLDER SOLID WIRE SN96 .031" |
3,374 |
|
Техническая документация |
* | Bulk | Active | - | - | - | - | - | - | - | - | - | - | - | - |
|
SMD291SNL500T3SOLDER PASTE SAC305 500G |
3,582 |
|
Техническая документация |
- | Bulk | Active | Solder Paste | Sn96.5Ag3Cu0.5 (96.5/3/0.5) | - | 423 ~ 428°F (217 ~ 220°C) | No-Clean | - | 3 | Lead Free | Jar, 17.64 oz (500g) | 6 Months | Date of Manufacture | 37°F ~ 46°F (3°C ~ 8°C) |
|
SMD291SNL500T3CSOLDER PASTE NO-CLEAN SAC305 T3 |
2,788 |
|
Техническая документация |
- | Bulk | Active | Solder Paste | Sn96.5Ag3Cu0.5 (96.5/3/0.5) | - | 423 ~ 428°F (217 ~ 220°C) | No-Clean | - | 3 | Lead Free | Cartridge, 17.64 oz (500g) | 6 Months | Date of Manufacture | 37°F ~ 46°F (3°C ~ 8°C) |
|
SMD4300SNL500T3CSOLDER PASTE SAC305 T3 500G |
2,196 |
|
Техническая документация |
CHIPQUIK® SMD4300 | Bulk | Active | Solder Paste | Sn96.5Ag3Cu0.5 (96.5/3/0.5) | - | 423 ~ 428°F (217 ~ 220°C) | No-Clean, Water Soluble | - | 3 | Lead Free | Cartridge, 17.64 oz (500g) | 6 Months | Date of Manufacture | 37°F ~ 46°F (3°C ~ 8°C) |
|
SMD2060SOLDER SPHERES SAC305 .030 DIAM |
1,617 |
|
Техническая документация |
SMD2 | Bulk | Active | Solder Sphere | Sn96.5Ag3Cu0.5 (96.5/3/0.5) | 0.030" (0.76mm) | 423 ~ 428°F (217 ~ 220°C) | - | - | - | Lead Free | Jar | 24 Months | Date of Manufacture | - |
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