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| Фото | Парт. № производителя | Наличие | Количество | Техническая документация | Серия | Упаковка | Состояние продукта | Тип | Состав | Диаметр | Точка плавления | Тип флюса | Сечение провода | Тип сетки | Процесс | Форма | Срок хранения | Начало срока годности | Температура хранения/охлаждения |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
|
NC191LTA250SMOOTH FLOW LOW TEMP SOLDER PAST |
4,808 |
|
Техническая документация |
Smooth Flow™ | Bulk | Active | Solder Paste | Bi57Sn42Ag1 (57/42/1) | - | 279°F (137°C) | No-Clean | - | 4 | - | Jar, 8.8 oz (250g) | 12 Months | Date of Manufacture | 37°F ~ 46°F (3°C ~ 8°C) |
|
NC2SWLF.020 1LBLF SOLDER WIRE 99.3/0.7 TIN/COPP |
3,145 |
|
Техническая документация |
- | Bulk | Active | Wire Solder | Sn99.3Cu0.7 (99.3/0.7) | 0.020" (0.51mm) | 441°F (227°C) | No-Clean | 24 AWG, 25 SWG | - | Lead Free | Spool, 1 lb (454 g) | - | - | - |
|
79606597SC 400 2% 0.38 DIA |
4,578 |
|
Техническая документация |
C400 | Bulk | Active | Wire Solder | Sn96.5Ag3Cu0.5 (96.5/3/0.5) | 0.015" (0.38mm) | 423°F (217°C) | No-Clean | 27 AWG, 28 SWG | - | Lead Free | Spool, 8.8 oz (250g) | - | - | - |
|
24-6337-9746SOLDER FLUX-CORED/285 63/37 .025 |
4,456 |
|
Техническая документация |
285 | Bulk | Obsolete | Wire Solder | Sn63Pb37 (63/37) | 0.025" (0.64mm) | 361°F (183°C) | Rosin Mildly Activated (RMA) | 22 AWG, 23 SWG | - | Leaded | Spool, 1 lb (454 g) | 36 Months | Date of Manufacture | 50°F ~ 104°F (10°C ~ 40°C) |
|
4885-454GSOLDER RA 63/37 .032" 1 LBS |
3,549 |
|
Техническая документация |
4880 | Spool | Active | Wire Solder | Sn63Pb37 (63/37) | 0.032" (0.81mm) | 361°F (183°C) | Rosin Activated (RA) | 20 AWG, 21 SWG | - | Leaded | Spool, 1 lb (454 g) | 60 Months | Date of Manufacture | 50°F ~ 86°F (10°C ~ 30°C) |
|
4901-227GSOLDER LF SN99 21GAUGE.5LBS |
3,376 |
|
Техническая документация |
4901 | Spool | Active | Wire Solder | Sn99.3Cu0.7 (99.3/0.7) | 0.032" (0.81mm) | 442°F (227°C) | No-Clean | 20 AWG, 21 SWG | - | Lead Free | Spool, 8 oz (227g), 1/2 lb | 60 Months | Date of Manufacture | 50°F ~ 86°F (10°C ~ 30°C) |
|
NC3SW.031 1LBSOLDER WIRE 62/36/2 TIN/LEAD/SIL |
2,090 |
|
Техническая документация |
- | Bulk | Active | Wire Solder | Sn62Pb36Ag2 (62/36/2) | 0.031" (0.79mm) | 354°F (179°C) | No-Clean | 20 AWG, 21 SWG | - | Leaded | Spool, 1 lb (454 g) | - | - | - |
|
NC191SNL250T5SMOOTH FLOW LEAD-FREE SOLDER PAS |
3,024 |
|
Техническая документация |
Smooth Flow™ | Bulk | Active | Solder Paste | Sn96.5Ag3Cu0.5 (96.5/3/0.5) | - | 422 ~ 428°F (217 ~ 220°C) | No-Clean | - | 5 | Lead Free | Jar, 8.8 oz (250g) | 6 Months | Date of Manufacture | 37°F ~ 46°F (3°C ~ 8°C) |
|
TS391AX500CTHERMALLY STABLE SOLDER PASTE NO |
1,232 |
|
Техническая документация |
- | Bulk | Active | Solder Paste | Sn63Pb37 (63/37) | - | 361°F (183°C) | No-Clean | - | 4 | Leaded | Cartridge, 17.64 oz (500g) | 12 Months | Date of Manufacture | 68°F ~ 77°F (20°C ~ 25°C) |
|
SMD291SNL50T6SOLDER PASTE IN JAR 50G (T6) SAC |
3,851 |
|
Техническая документация |
SMD | Bulk | Active | Solder Paste | Sn96.5Ag3Cu0.5 (96.5/3/0.5) | - | 422 ~ 428°F (217 ~ 220°C) | No-Clean | - | 6 | Lead Free | Jar, 1.76 oz (50g) | 6 Months | Date of Manufacture | 37°F ~ 46°F (3°C ~ 8°C) |
|
SMD4300SNL250T5SOLDER PASTE SAC305 250G T5 |
3,033 |
|
Техническая документация |
CHIPQUIK® SMD4300 | Bulk | Active | Solder Paste | Sn96.5Ag3Cu0.5 (96.5/3/0.5) | - | 423 ~ 428°F (217 ~ 220°C) | No-Clean, Water Soluble | - | 5 | Lead Free | Jar, 8.8 oz (250g) | 6 Months | Date of Manufacture | 37°F ~ 46°F (3°C ~ 8°C) |
|
SMD2020SOLDER SPHERES SN96.5/AG3.0/CU0. |
1,183 |
|
Техническая документация |
SMD2 | Bulk | Active | Solder Sphere | Sn96.5Ag3Cu0.5 (96.5/3/0.5) | 0.010" (0.25mm) | 423 ~ 428°F (217 ~ 220°C) | - | - | - | Lead Free | Jar | 24 Months | Date of Manufacture | - |
|
SMDLTLFP250T5SOLDER PASTE SN42/BI57.6/AG0.4 L |
1,364 |
|
Техническая документация |
- | Bulk | Active | Solder Paste | Bi57.6Sn42Ag0.4 (57.6/42/0.4) | - | 281°F (138°C) | No-Clean | - | 5 | Lead Free | Jar, 8.8 oz (250g) | 6 Months | Date of Manufacture | 37°F ~ 46°F (3°C ~ 8°C) |
|
SMD291SNL40T7SOLDER PASTE IN JAR 40G (T7) SAC |
2,469 |
|
Техническая документация |
- | Bulk | Active | Solder Paste | Sn96.5Ag3Cu0.5 (96.5/3/0.5) | - | 423 ~ 428°F (217 ~ 220°C) | No-Clean | - | 7 | - | Jar, 1.41 oz (40g) | 6 Months | Date of Manufacture | 37°F ~ 46°F (3°C ~ 8°C) |
|
SMD2SW.031 .7OZSOLDER WIRE POCKET PACK 60/40 TI |
2,466 |
|
Техническая документация |
SMD2 | Bulk | Active | Wire Solder | Sn60Pb40 (60/40) | 0.031" (0.79mm) | 361 ~ 370°F (183 ~ 188°C) | No-Clean, Water Soluble | 20 AWG, 21 SWG | - | Leaded | Tube, 0.7 oz (19.85g) | - | - | - |
|
SMDSW.031 .7OZSOLDER WIRE POCKET PACK 63/37 TI |
2,545 |
|
Техническая документация |
SMD | Bulk | Active | Wire Solder | Sn63Pb37 (63/37) | 0.031" (0.79mm) | 361°F (183°C) | No-Clean, Water Soluble | 20 AWG, 21 SWG | - | Leaded | Tube, 0.7 oz (19.85g) | - | - | - |
|
SMD2SW.020 .4OZSOLDER WIRE POCKET PACK 60/40 TI |
4,963 |
|
Техническая документация |
SMD2 | Bulk | Active | Wire Solder | Sn60Pb40 (60/40) | 0.020" (0.51mm) | 361 ~ 370°F (183 ~ 188°C) | No-Clean, Water Soluble | 24 AWG, 25 SWG | - | Leaded | Tube, 0.4 oz (11.34g) | - | - | - |
|
SMDSW.020 .4OZSOLDER WIRE POCKET PACK 63/37 TI |
1,627 |
|
Техническая документация |
SMD | Bulk | Active | Wire Solder | Sn63Pb37 (63/37) | 0.020" (0.51mm) | 361°F (183°C) | No-Clean, Water Soluble | 24 AWG, 25 SWG | - | Leaded | Tube, 0.4 oz (11.34g) | - | - | - |
|
SMDPB100-S-1SOLDER SHOT PB100 1OZ 28G |
2,185 |
|
Техническая документация |
SMD | Bulk | Active | Solder Shot | Pb100(100) | - | 622°F (328°C) | - | - | - | Leaded | Bag, 1 oz (28g) | - | - | - |
|
SMDCU100-S-1SOLDER SHOT CU100 1OZ 28G |
1,237 |
|
Техническая документация |
SMD | Bulk | Active | Solder Shot | Cu100(100) | - | 1983°F (1084°C) | - | - | - | Lead Free | Bag, 1 oz (28g) | - | - | - |
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