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| Фото | Парт. № производителя | Наличие | Количество | Техническая документация | Серия | Упаковка | Состояние продукта | Тип | Состав | Диаметр | Точка плавления | Тип флюса | Сечение провода | Тип сетки | Процесс | Форма | Срок хранения | Начало срока годности | Температура хранения/охлаждения |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
|
WBNCSAC32LEAD FREE NO-CLEAN FLUX CORE SIL |
4,627 |
|
Техническая документация |
- | Spool | Active | Wire Solder | Sn96.5Ag3Cu0.5 (96.5/3/0.5) | 0.032" (0.81mm) | 430°F (221°C) | No-Clean | 20 AWG, 21 SWG | - | Lead Free | Spool, 1 lb (454 g) | - | - | - |
|
SMDSWLF.015 1LBLF SOLDER WIRE 96.5/3/0.5 TIN/SI |
2,111 |
|
Техническая документация |
- | Bulk | Active | Wire Solder | Sn96.5Ag3Cu0.5 (96.5/3/0.5) | 0.015" (0.38mm) | 423 ~ 428°F (217 ~ 220°C) | No-Clean, Water Soluble | 27 AWG, 28 SWG | - | Lead Free | Spool, 1 lb (454 g) | - | - | - |
|
RASWLF.015 1LBLF SOLDER WIRE 96.5/3/0.5 TIN/SI |
4,875 |
|
Техническая документация |
- | Bulk | Active | Wire Solder | Sn96.5Ag3Cu0.5 (96.5/3/0.5) | 0.015" (0.38mm) | 422 ~ 428°F (217 ~ 220°C) | Rosin Activated (RA) | 27 AWG, 28 SWG | - | Lead Free | Spool, 1 lb (454 g) | - | - | - |
|
SMD2170SOLDER SPHERES SN63/PB37 .014" ( |
2,734 |
|
Техническая документация |
SMD2 | Bulk | Active | Solder Sphere | Sn63Pb37 (63/37) | 0.014" (0.36mm) | 361°F (183°C) | - | - | - | Leaded | Jar | 24 Months | Date of Manufacture | - |
|
4900-227GSOLDER LF SN96 21GAUGE .5LBS |
3,613 |
|
Техническая документация |
4900 | Spool | Active | Wire Solder | Sn96.2Ag2.8Cu0.4 (96.2/2.8/0.4) | 0.032" (0.81mm) | 423 ~ 430°F (217 ~ 221°C) | No-Clean | 20 AWG, 21 SWG | - | Lead Free | Spool, 8 oz (227g), 1/2 lb | 60 Months | Date of Manufacture | 50°F ~ 86°F (10°C ~ 30°C) |
|
TS991SNL500T3SOLDER PASTE THERMALLY STABLE NC |
3,359 |
|
Техническая документация |
CHIPQUIK® | Bulk | Active | Solder Paste | Sn96.5Ag3Cu0.5 (96.5/3/0.5) | - | 423°F (217°C) | No-Clean | - | 3 | Lead Free | Jar, 17.64 oz (500g) | 12 Months | Date of Manufacture | - |
|
WS991AX500T4SOLDER PASTE THERMALLY STABLE WS |
1,170 |
|
Техническая документация |
CHIPQUIK® | Bulk | Active | Solder Paste | Sn63Pb37 (63/37) | - | 361°F (183°C) | Water Soluble | - | 4 | Leaded | Jar, 17.64 oz (500g) | 6 Months | Date of Manufacture | - |
|
SMD2150SOLDER SPHERES SN63/PB37 .010" ( |
3,721 |
|
Техническая документация |
SMD2 | Bulk | Active | Solder Sphere | Sn63Pb37 (63/37) | 0.010" (0.25mm) | 361°F (183°C) | - | - | - | Leaded | Jar | 24 Months | Date of Manufacture | - |
|
73299897SC C511 2% .064DIA 14AWG |
2,349 |
|
Техническая документация |
C511™ | Bulk | Active | Wire Solder | Sn96.5Ag3Cu0.5 (96.5/3/0.5) | 0.064" (1.63mm) | 423°F (217°C) | No-Clean | 14 AWG, 16 SWG | - | Lead Free | Spool, 1 lb (454 g) | - | - | - |
|
SMDSWLF.059 3.3 1LBSOLDER WIRE SN96.5/AG3.0/CU0.5 |
1,589 |
|
Техническая документация |
- | Bulk | Active | Wire Solder | Sn96.5Ag3Cu0.5 (96.5/3/0.5) | 0.059" (1.50mm) | 423 ~ 428°F (217 ~ 220°C) | No-Clean, Water Soluble | - | - | Lead Free | Spool, 1 lb (453.59g) | - | - | - |
|
WS991LT500T4SOLDER PASTE THERMALLY STABLE WS |
1,089 |
|
Техническая документация |
CHIPQUIK® | Bulk | Active | Solder Paste | Bi57.6Sn42Ag0.4 (57.6/42/0.4) | - | 281°F (138°C) | Water Soluble | - | 4 | Lead Free | Jar, 17.64 oz (500g) | 6 Months | Date of Manufacture | - |
|
67383197SC 400 2% .048DIA 16AWG |
1,623 |
|
Техническая документация |
C400 | Bulk | Active | Wire Solder | Sn96.5Ag3Cu0.5 (96.5/3/0.5) | 0.048" (1.22mm) | 423°F (217°C) | No-Clean | 16 AWG, 18 SWG | - | Lead Free | Spool, 1 lb (454 g) | - | - | 59°F ~ 86°F (15°C ~ 30°C) |
|
SMD4300LTLFP250T4SOLDER PASTE SN42/BI57.6/AG0.4 |
2,339 |
|
Техническая документация |
CHIPQUIK® SMD4300 | Bulk | Active | Solder Paste | Bi57.6Sn42Ag0.4 (57.6/42/0.4) | - | 280°F (138°C) | No-Clean, Water Soluble | - | - | Lead Free | Jar, 8.8 oz (250g) | 6 Months | Date of Manufacture | 32°F ~ 77°F (0°C ~ 25°C) |
|
SMD3SWLT.040 100GSN42/BI58 2.2% FLUX CORE SOLDER |
4,366 |
|
Техническая документация |
SMD3 | Bulk | Active | Wire Solder | Bi58Sn42 (58/42) | 0.040" (1.02mm) | 280°F (138°C) | No-Clean, Rosin Activated (RA) | - | - | Lead Free | Spool, 3.53 oz (100g) | - | - | - |
|
TS391SNL500CTHERMALLY STABLE SOLDER PASTE NO |
4,629 |
|
Техническая документация |
- | Bulk | Active | Solder Paste | Sn96.5Ag3Cu0.5 (96.5/3/0.5) | - | 423 ~ 428°F (217 ~ 220°C) | No-Clean | - | 4 | Lead Free | Cartridge, 17.64 oz (500g) | 12 Months | Date of Manufacture | 68°F ~ 77°F (20°C ~ 25°C) |
|
SMD2040SOLDER SPHERES SAC305 .020 DIAM |
1,046 |
|
Техническая документация |
SMD2 | Bulk | Active | Solder Sphere | Sn96.5Ag3Cu0.5 (96.5/3/0.5) | 0.020" (0.51mm) | 423 ~ 428°F (217 ~ 220°C) | - | - | - | Lead Free | Jar | 24 Months | Date of Manufacture | - |
|
SMD2SWLT.040 100GSN42/BI57.6/AG0.4 2.2% FLUX CORE |
3,683 |
|
Техническая документация |
SMD2 | Bulk | Active | Wire Solder | Bi57.6Sn42Ag0.4 (57.6/42/0.4) | 0.040" (1.02mm) | 280°F (138°C) | No-Clean, Rosin Activated (RA) | - | - | Lead Free | Spool, 3.53 oz (100g) | - | - | - |
|
SMD2032SOLDER SPHERES SN96.5/AG3.0/CU0. |
2,346 |
|
Техническая документация |
SMD2 | Bulk | Active | Solder Sphere | Sn96.5Ag3Cu0.5 (96.5/3/0.5) | 0.016" (0.40mm) | 423 ~ 428°F (217 ~ 220°C) | - | - | - | Lead Free | Jar | 24 Months | Date of Manufacture | - |
|
SMD2024SOLDER SPHERES SN96.5/AG3.0/CU0. |
3,592 |
|
Техническая документация |
SMD2 | Bulk | Active | Solder Sphere | Sn96.5Ag3Cu0.5 (96.5/3/0.5) | 0.012" (0.31mm) | 423 ~ 428°F (217 ~ 220°C) | - | - | - | Lead Free | Jar | 24 Months | Date of Manufacture | - |
|
SMD2016SOLDER SPHERES SN96.5/AG3.0/CU0. |
2,698 |
|
Техническая документация |
SMD2 | Bulk | Active | Solder Sphere | Sn96.5Ag3Cu0.5 (96.5/3/0.5) | 0.008" (0.20mm) | 423 ~ 428°F (217 ~ 220°C) | - | - | - | Lead Free | Jar | 24 Months | Date of Manufacture | - |
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