Фото | Парт. № производителя | Наличие | Количество | Техническая документация | Серия | Упаковка | Состояние продукта | Тип разъема | Тип контакта | Шаг - Сопряжение | Количество положений | Количество рядов | Расстояние между рядами - Сопряжение | Количество загруженных позиций | Стиль | Защита | Тип крепления | Оконечная нагрузка | Тип крепления | Длина контакта - Сопряжение | Длина контакта - Пост | Общая длина контакта | Высота изоляции | Форма контакта | Отделка контакта - Сопряжение | Толщина отделки контакта - Сопряжение | Отделка контакта - Пост | Материал контакта | Материал изоляции | Особенности | Рабочая температура | Номинальный ток (Ампер) |
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
|
SLV W 7 092 62 GTWO ROWS, 0.4 MM; PITCH 1. |
3,997 |
|
![]() Техническая документация |
SLV W 7 092 | Bulk | Active | Header | Male Pin | 0.050" (1.27mm) | 62 | 2 | 0.050" (1.27mm) | All | Board to Board or Cable | Unshrouded | Through Hole | Solder | Push-Pull | 0.118" (3.00mm) | 0.098" (2.50mm) | 0.579" (14.70mm) | 0.067" (1.70mm) | Square | Gold | 7.87µin (0.200µm) | Gold | Copper Zinc | Polyamide (PA46), Nylon 4/6, Glass Filled | Sandwich | -40°C ~ 163°C | 1.5A |
|
SLY 8 SMD 036 48 G SM0.5 MM |
3,992 |
|
![]() Техническая документация |
SLY 8 SMD 036 | Bulk | Active | Header | Male Pin | 0.079" (2.00mm) | 48 | 2 | 0.079" (2.00mm) | All | Board to Board or Cable | Unshrouded | Surface Mount | Solder | Push-Pull | 0.142" (3.60mm) | - | 0.220" (5.60mm) | 0.059" (1.50mm) | Circular | Gold | 7.87µin (0.200µm) | Gold | Copper Tin | Polyamide (PA46), Nylon 4/6, Glass Filled | - | -40°C ~ 163°C | 3A |
|
SLV W 7 092 64 ZTWO ROWS, 0.4 MM; PITCH 1. |
2,969 |
|
![]() Техническая документация |
SLV W 7 092 | Bulk | Active | Header | Male Pin | 0.050" (1.27mm) | 64 | 2 | 0.050" (1.27mm) | All | Board to Board or Cable | Unshrouded | Through Hole | Solder | Push-Pull | 0.118" (3.00mm) | 0.098" (2.50mm) | 0.579" (14.70mm) | 0.067" (1.70mm) | Square | Tin | 157.5 ~ 236.2µin (4.00 ~ 6.00µm) | Tin | Copper Zinc | Polyamide (PA46), Nylon 4/6, Glass Filled | Sandwich | -40°C ~ 163°C | 1.5A |
![]() |
SLY 8 SMD 036 66 S B SM0.5 MM |
1,870 |
|
![]() Техническая документация |
SLY 8 SMD 036 | Bulk | Active | Header | Male Pin | 0.079" (2.00mm) | 66 | 2 | 0.079" (2.00mm) | All | Board to Board or Cable | Unshrouded | Surface Mount | Solder | Push-Pull | 0.142" (3.60mm) | - | 0.220" (5.60mm) | 0.059" (1.50mm) | Circular | Gold | 7.87µin (0.200µm) | Tin | Copper Tin | Polyamide (PA46), Nylon 4/6, Glass Filled | - | -40°C ~ 163°C | 3A |
|
SLV W 8 092 22 GTWO ROWS, 0.4 MM; PITCH 1. |
3,443 |
|
![]() Техническая документация |
SLV W 8 092 | Bulk | Active | Header | Male Pin | 0.050" (1.27mm) | 22 | 2 | 0.100" (2.54mm) | All | Board to Board or Cable | Unshrouded | Through Hole | Solder | Push-Pull | 0.118" (3.00mm) | 0.098" (2.50mm) | 0.579" (14.70mm) | 0.067" (1.70mm) | Square | Gold | 7.87µin (0.200µm) | Gold | Copper Zinc | Polyamide (PA46), Nylon 4/6, Glass Filled | Sandwich | -40°C ~ 163°C | 1.5A |
![]() |
SL LP 6 SMD 051 22 Z SM PS0.635 MM, LOW PROFILE IN SMD-T |
2,607 |
|
![]() Техническая документация |
SL LP 6 SMD 051 | Bulk | Active | Header | Male Pin | 0.100" (2.54mm) | 22 | 2 | 0.100" (2.54mm) | All | Board to Board or Cable | Unshrouded | Surface Mount | Solder | Push-Pull | 0.201" (5.10mm) | - | - | 0.067" (1.70mm) | Square | Tin | 157.5 ~ 236.2µin (4.00 ~ 6.00µm) | Tin | Copper Tin | Polyamide (PA46), Nylon 4/6, Glass Filled | - | -40°C ~ 163°C | 3A |
|
SLV W 8 117 68 GTWO ROWS, 0.4 MM; PITCH 1. |
1,707 |
|
![]() Техническая документация |
SLV W 8 117 | Bulk | Active | Header | Male Pin | 0.050" (1.27mm) | 68 | 2 | 0.100" (2.54mm) | All | Board to Board or Cable | Unshrouded | Through Hole | Solder | Push-Pull | 0.118" (3.00mm) | 0.098" (2.50mm) | 0.677" (17.20mm) | 0.067" (1.70mm) | Square | Gold | 7.87µin (0.200µm) | Gold | Copper Zinc | Polyamide (PA46), Nylon 4/6, Glass Filled | Sandwich | -40°C ~ 163°C | 1.5A |
![]() |
SL LP 6 SMD 051 30 Z B TR0.635 MM, LOW PROFILE IN SMD-T |
3,713 |
|
![]() Техническая документация |
SL LP 6 SMD 051 | Tape & Reel (TR) | Active | Header | Male Pin | 0.100" (2.54mm) | 30 | 2 | 0.100" (2.54mm) | All | Board to Board or Cable | Unshrouded | Surface Mount | Solder | Push-Pull | 0.201" (5.10mm) | - | - | 0.067" (1.70mm) | Square | Tin | 157.5 ~ 236.2µin (4.00 ~ 6.00µm) | Tin | Copper Tin | Polyamide (PA46), Nylon 4/6, Glass Filled | - | -40°C ~ 163°C | 3A |
![]() |
SL LP 6 SMD 051 32 G SM PS0.635 MM, LOW PROFILE IN SMD-T |
4,447 |
|
![]() Техническая документация |
SL LP 6 SMD 051 | Bulk | Active | Header | Male Pin | 0.100" (2.54mm) | 32 | 2 | 0.100" (2.54mm) | All | Board to Board or Cable | Unshrouded | Surface Mount | Solder | Push-Pull | 0.201" (5.10mm) | - | - | 0.067" (1.70mm) | Square | Gold | 7.87µin (0.200µm) | Gold | Copper Tin | Polyamide (PA46), Nylon 4/6, Glass Filled | - | -40°C ~ 163°C | 3A |
|
SLV W 7 092 56 ZTWO ROWS, 0.4 MM; PITCH 1. |
2,093 |
|
![]() Техническая документация |
SLV W 7 092 | Bulk | Active | Header | Male Pin | 0.050" (1.27mm) | 56 | 2 | 0.050" (1.27mm) | All | Board to Board or Cable | Unshrouded | Through Hole | Solder | Push-Pull | 0.118" (3.00mm) | 0.098" (2.50mm) | 0.579" (14.70mm) | 0.067" (1.70mm) | Square | Tin | 157.5 ~ 236.2µin (4.00 ~ 6.00µm) | Tin | Copper Zinc | Polyamide (PA46), Nylon 4/6, Glass Filled | Sandwich | -40°C ~ 163°C | 1.5A |
![]() |
SL LP 6 SMD 051 46 Z B SM PS0.635 MM, LOW PROFILE IN SMD-T |
4,128 |
|
![]() Техническая документация |
SL LP 6 SMD 051 | Bulk | Active | Header | Male Pin | 0.100" (2.54mm) | 46 | 2 | 0.100" (2.54mm) | All | Board to Board or Cable | Unshrouded | Surface Mount | Solder | Push-Pull | 0.201" (5.10mm) | - | - | 0.067" (1.70mm) | Square | Tin | 157.5 ~ 236.2µin (4.00 ~ 6.00µm) | Tin | Copper Tin | Polyamide (PA46), Nylon 4/6, Glass Filled | - | -40°C ~ 163°C | 3A |
|
SLY 1 081 19 S0.5 MM, STRAIGHT |
1,359 |
|
![]() Техническая документация |
SLY 1 081 | Bulk | Active | Header | Male Pin | 0.079" (2.00mm) | 19 | 1 | - | All | Board to Board or Cable | Unshrouded | Through Hole | Solder | Push-Pull | 0.142" (3.60mm) | 0.118" (3.00mm) | 0.319" (8.10mm) | 0.059" (1.50mm) | Square | Gold | 7.87µin (0.200µm) | Tin | Copper Tin | Polyamide (PA46), Nylon 4/6, Glass Filled | - | -40°C ~ 163°C | 3A |
|
SLY 8 SMD 045 66 S B TR0.5 MM |
1,411 |
|
![]() Техническая документация |
SLY 8 SMD 045 | Tape & Reel (TR) | Active | Header | Male Pin | 0.079" (2.00mm) | 66 | 2 | 0.079" (2.00mm) | All | Board to Board or Cable | Unshrouded | Surface Mount | Solder | Push-Pull | 0.177" (4.50mm) | - | 0.256" (6.50mm) | 0.059" (1.50mm) | Circular | Gold | 7.87µin (0.200µm) | Tin | Copper Tin | Polyamide (PA46), Nylon 4/6, Glass Filled | - | -40°C ~ 163°C | 3A |
|
SLV W 6 117 15 GONE ROW, 0.4 MMFOR INT |
1,979 |
|
![]() Техническая документация |
SLV W 6 117 | Bulk | Active | Header | Male Pin | 0.050" (1.27mm) | 15 | 1 | - | All | Board to Board or Cable | Unshrouded | Through Hole | Solder | Push-Pull | 0.118" (3.00mm) | 0.098" (2.50mm) | 0.677" (17.20mm) | 0.067" (1.70mm) | Square | Gold | 7.87µin (0.200µm) | Gold | Copper Zinc | Polyamide (PA46), Nylon 4/6, Glass Filled | Sandwich | -40°C ~ 163°C | 1.5A |
|
SLY 8 SMD 045 66 G B SM0.5 MM |
4,664 |
|
![]() Техническая документация |
SLY 8 SMD 045 | Bulk | Active | Header | Male Pin | 0.079" (2.00mm) | 66 | 2 | 0.079" (2.00mm) | All | Board to Board or Cable | Unshrouded | Surface Mount | Solder | Push-Pull | 0.177" (4.50mm) | - | 0.256" (6.50mm) | 0.059" (1.50mm) | Circular | Gold | 7.87µin (0.200µm) | Gold | Copper Tin | Polyamide (PA46), Nylon 4/6, Glass Filled | - | -40°C ~ 163°C | 3A |
![]() |
SL LP 6 SMD 051 52 S B TR PS0.635 MM, LOW PROFILE IN SMD-T |
4,384 |
|
![]() Техническая документация |
SL LP 6 SMD 051 | Tape & Reel (TR) | Active | Header | Male Pin | 0.100" (2.54mm) | 52 | 2 | 0.100" (2.54mm) | All | Board to Board or Cable | Unshrouded | Surface Mount | Solder | Push-Pull | 0.201" (5.10mm) | - | - | 0.067" (1.70mm) | Square | Gold | 7.87µin (0.200µm) | Tin | Copper Tin | Polyamide (PA46), Nylon 4/6, Glass Filled | - | -40°C ~ 163°C | 3A |
|
SLV W 6 092 31 ZONE ROW, 0.4 MMFOR INT |
2,929 |
|
![]() Техническая документация |
SLV W 6 092 | Tube | Active | Header | Male Pin | 0.050" (1.27mm) | 31 | 1 | - | All | Board to Board or Cable | Unshrouded | Through Hole | Solder | Push-Pull | 0.118" (3.00mm) | 0.098" (2.50mm) | 0.579" (14.70mm) | 0.067" (1.70mm) | Square | Tin | 157.5 ~ 236.2µin (4.00 ~ 6.00µm) | Tin | Copper Zinc | Polyamide (PA46), Nylon 4/6, Glass Filled | Sandwich | -40°C ~ 163°C | 1.5A |
|
SLY 8 SMD 045 6 Z SM0.5 MM |
4,491 |
|
![]() Техническая документация |
SLY 8 SMD 045 | Tube | Active | Header | Male Pin | 0.079" (2.00mm) | 6 | 2 | 0.079" (2.00mm) | All | Board to Board or Cable | Unshrouded | Surface Mount | Solder | Push-Pull | 0.177" (4.50mm) | - | 0.256" (6.50mm) | 0.059" (1.50mm) | Circular | Tin | 157.5 ~ 236.2µin (4.00 ~ 6.00µm) | Tin | Copper Tin | Polyamide (PA46), Nylon 4/6, Glass Filled | - | -40°C ~ 163°C | 3A |
|
SLY 12 SMD 092 8 STWO ROWS, 0.5 MM, SUITABLE FOR |
4,670 |
|
![]() Техническая документация |
SLY 12 SMD 092 | Bulk | Active | Header | Male Pin | 0.079" (2.00mm) | 8 | 2 | 0.079" (2.00mm) | All | Board to Board or Cable | Unshrouded | Surface Mount | Solder | Push-Pull | 0.142" (3.60mm) | - | - | 0.059" (1.50mm) | Square | Gold | 7.87µin (0.200µm) | Tin | Copper Tin | Polyamide (PA46), Nylon 4/6, Glass Filled | - | -40°C ~ 163°C | 3A |
|
SLY 11 SMD 133 15 GONE ROW, 0.5 MM, SUITABLE FOR |
4,877 |
|
![]() Техническая документация |
SLY 11 SMD 133 | Tube | Active | Header | Male Pin | 0.079" (2.00mm) | 15 | 1 | - | All | Board to Board or Cable | Unshrouded | Surface Mount | Solder | Push-Pull | 0.142" (3.60mm) | - | - | 0.059" (1.50mm) | Square | Gold | 7.87µin (0.200µm) | Gold | Copper Tin | Polyamide (PA46), Nylon 4/6, Glass Filled | - | -40°C ~ 163°C | 3A |