Фото | Парт. № производителя | Наличие | Количество | Техническая документация | Серия | Упаковка | Состояние продукта | Тип разъема | Тип контакта | Шаг - Сопряжение | Количество положений | Количество рядов | Расстояние между рядами - Сопряжение | Количество загруженных позиций | Стиль | Защита | Тип крепления | Оконечная нагрузка | Тип крепления | Длина контакта - Сопряжение | Длина контакта - Пост | Общая длина контакта | Высота изоляции | Форма контакта | Отделка контакта - Сопряжение | Толщина отделки контакта - Сопряжение | Отделка контакта - Пост | Материал контакта | Материал изоляции | Особенности | Рабочая температура | Номинальный ток (Ампер) |
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SL LP 7 SMD 040 11 Z0.635 MM, LOW PROFILE IN SMD-T |
1,610 |
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![]() Техническая документация |
SL LP 7 SMD 040 | Bulk | Active | Header | Male Pin | 0.100" (2.54mm) | 11 | 1 | - | All | Board to Board or Cable | Unshrouded | Surface Mount | Solder | Push-Pull | 0.157" (4.00mm) | 0.150" (3.80mm) | 0.374" (9.50mm) | 0.067" (1.70mm) | Square | Tin | 157.5 ~ 236.2µin (4.00 ~ 6.00µm) | Tin | Copper Tin | Polyamide (PA46), Nylon 4/6, Glass Filled | - | -40°C ~ 163°C | 3A |
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SL LP 6 SMD 038 66 Z PS0.635 MM, LOW PROFILE IN SMD-T |
2,113 |
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![]() Техническая документация |
SL LP 6 SMD 038 | Bulk | Active | Header | Male Pin | 0.100" (2.54mm) | 66 | 2 | 0.100" (2.54mm) | All | Board to Board or Cable | Unshrouded | Surface Mount | Solder | Push-Pull | 0.150" (3.80mm) | - | - | 0.067" (1.70mm) | Square | Tin | 157.5 ~ 236.2µin (4.00 ~ 6.00µm) | Tin | Copper Tin | Polyamide (PA46), Nylon 4/6, Glass Filled | - | -40°C ~ 163°C | 3A |
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SL 15 SMD 107 26 G0.635 MM FOR INTERCONNECTION |
4,736 |
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![]() Техническая документация |
SL 15 SMD 107 | Bulk | Active | Header | Male Pin | 0.100" (2.54mm) | 26 | 1 | - | All | Board to Board or Cable | Unshrouded | Surface Mount | Solder | Push-Pull | 0.236" (6.00mm) | - | - | 0.110" (2.80mm) | Square | Gold | 7.87µin (0.200µm) | Gold | Copper Tin | Polyamide (PA46), Nylon 4/6, Glass Filled | - | -40°C ~ 163°C | 3A |
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SL 21 THR 164 50 S0.635 MM, STANDARD |
4,343 |
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![]() Техническая документация |
SL 21 THR 164 | Bulk | Active | Header | Male Pin | 0.100" (2.54mm) | 50 | 2 | 0.100" (2.54mm) | All | Board to Board or Cable | Unshrouded | Through Hole | Solder | Push-Pull | 0.457" (11.60mm) | 0.079" (2.00mm) | 0.646" (16.40mm) | 0.110" (2.80mm) | Square | Gold | 7.87µin (0.200µm) | Tin | Copper Tin | Polyamide (PA46), Nylon 4/6, Glass Filled | - | -40°C ~ 163°C | 3A |
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SL LP 6 SMD 038 50 G B TR PS0.635 MM, LOW PROFILE IN SMD-T |
2,506 |
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![]() Техническая документация |
SL LP 6 SMD 038 | Tape & Reel (TR) | Active | Header | Male Pin | 0.100" (2.54mm) | 50 | 2 | 0.100" (2.54mm) | All | Board to Board or Cable | Unshrouded | Surface Mount | Solder | Push-Pull | 0.150" (3.80mm) | - | - | 0.067" (1.70mm) | Square | Gold | 7.87µin (0.200µm) | Gold | Copper Tin | Polyamide (PA46), Nylon 4/6, Glass Filled | - | -40°C ~ 163°C | 3A |
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SL LP 7 SMD 055 17 S0.635 MM, LOW PROFILE IN SMD-T |
2,499 |
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![]() Техническая документация |
SL LP 7 SMD 055 | Bulk | Active | Header | Male Pin | 0.100" (2.54mm) | 17 | 1 | - | All | Board to Board or Cable | Unshrouded | Surface Mount | Solder | Push-Pull | 0.217" (5.50mm) | 0.150" (3.80mm) | 0.433" (11.00mm) | 0.067" (1.70mm) | Square | Gold | 7.87µin (0.200µm) | Tin | Copper Tin | Polyamide (PA46), Nylon 4/6, Glass Filled | - | -40°C ~ 163°C | 3A |
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SL 15 SMD 182 10 Z P0.635 MM FOR INTERCONNECTION |
3,981 |
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![]() Техническая документация |
SL 15 SMD 182 | Bulk | Active | Header | Male Pin | 0.100" (2.54mm) | 10 | 1 | - | All | Board to Board or Cable | Unshrouded | Surface Mount | Solder | Push-Pull | 0.236" (6.00mm) | - | - | 0.110" (2.80mm) | Square | Tin | 157.5 ~ 236.2µin (4.00 ~ 6.00µm) | Tin | Copper Tin | Polyamide (PA46), Nylon 4/6, Glass Filled | - | -40°C ~ 163°C | 3A |
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SL LP 5 SMD 066 9 G B TR0.635 MM, LOW PROFILE |
3,409 |
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![]() Техническая документация |
SL LP 5 SMD 066 | Tape & Reel (TR) | Active | Header | Male Pin | 0.100" (2.54mm) | 9 | 1 | - | All | Board to Board or Cable | Unshrouded | Surface Mount | Solder | Push-Pull | 0.260" (6.60mm) | - | - | 0.067" (1.70mm) | Square | Gold | 7.87µin (0.200µm) | Gold | Copper Tin | Polyamide (PA46), Nylon 4/6, Glass Filled | - | -40°C ~ 163°C | 3A |
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SL 2 154 14 GTWO ROWS, 0.635 MM |
4,099 |
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![]() Техническая документация |
SL 2 154 | Bulk | Active | Header | Male Pin | 0.100" (2.54mm) | 14 | 2 | 0.100" (2.54mm) | All | Board to Board or Cable | Unshrouded | Through Hole | Solder | Push-Pull | 0.606" (15.40mm) | 0.228" (5.80mm) | 0.945" (24.00mm) | 0.110" (2.80mm) | Square | Gold | 7.87µin (0.200µm) | Gold | Copper Tin | Polyamide (PA46), Nylon 4/6, Glass Filled | - | -40°C ~ 163°C | 3A |
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SL 15 SMD 182 29 S0.635 MM FOR INTERCONNECTION |
1,272 |
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![]() Техническая документация |
SL 15 SMD 182 | Bulk | Active | Header | Male Pin | 0.100" (2.54mm) | 29 | 1 | - | All | Board to Board or Cable | Unshrouded | Surface Mount | Solder | Push-Pull | 0.236" (6.00mm) | - | - | 0.110" (2.80mm) | Square | Gold | 7.87µin (0.200µm) | Tin | Copper Tin | Polyamide (PA46), Nylon 4/6, Glass Filled | - | -40°C ~ 163°C | 3A |
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SL LP 6 SMD 038 32 G SM PS0.635 MM, LOW PROFILE IN SMD-T |
1,062 |
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![]() Техническая документация |
SL LP 6 SMD 038 | Tube | Active | Header | Male Pin | 0.100" (2.54mm) | 32 | 2 | 0.100" (2.54mm) | All | Board to Board or Cable | Unshrouded | Surface Mount | Solder | Push-Pull | 0.150" (3.80mm) | - | - | 0.067" (1.70mm) | Square | Gold | 7.87µin (0.200µm) | Gold | Copper Tin | Polyamide (PA46), Nylon 4/6, Glass Filled | - | -40°C ~ 163°C | 3A |
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SL LP 6 SMD 066 56 S PS0.635 MM, LOW PROFILE IN SMD-T |
4,493 |
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![]() Техническая документация |
SL LP 6 SMD 066 | Bulk | Active | Header | Male Pin | 0.100" (2.54mm) | 56 | 2 | 0.100" (2.54mm) | All | Board to Board or Cable | Unshrouded | Surface Mount | Solder | Push-Pull | 0.260" (6.60mm) | - | - | 0.067" (1.70mm) | Square | Gold | 7.87µin (0.200µm) | Tin | Copper Tin | Polyamide (PA46), Nylon 4/6, Glass Filled | - | -40°C ~ 163°C | 3A |
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SL 15 SMD 107 26 Z P0.635 MM FOR INTERCONNECTION |
2,280 |
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![]() Техническая документация |
SL 15 SMD 107 | Bulk | Active | Header | Male Pin | 0.100" (2.54mm) | 26 | 1 | - | All | Board to Board or Cable | Unshrouded | Surface Mount | Solder | Push-Pull | 0.236" (6.00mm) | - | - | 0.110" (2.80mm) | Square | Tin | 157.5 ~ 236.2µin (4.00 ~ 6.00µm) | Tin | Copper Tin | Polyamide (PA46), Nylon 4/6, Glass Filled | - | -40°C ~ 163°C | 3A |
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SL LP 6 SMD 038 10 G B TR PS0.635 MM, LOW PROFILE IN SMD-T |
4,923 |
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![]() Техническая документация |
SL LP 6 SMD 038 | Tape & Reel (TR) | Active | Header | Male Pin | 0.100" (2.54mm) | 10 | 2 | 0.100" (2.54mm) | All | Board to Board or Cable | Unshrouded | Surface Mount | Solder | Push-Pull | 0.150" (3.80mm) | - | - | 0.067" (1.70mm) | Square | Gold | 7.87µin (0.200µm) | Gold | Copper Tin | Polyamide (PA46), Nylon 4/6, Glass Filled | - | -40°C ~ 163°C | 3A |
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SL 21 THR 164 64 S0.635 MM, STANDARD |
4,775 |
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![]() Техническая документация |
SL 21 THR 164 | Bulk | Active | Header | Male Pin | 0.100" (2.54mm) | 64 | 2 | 0.100" (2.54mm) | All | Board to Board or Cable | Unshrouded | Through Hole | Solder | Push-Pull | 0.457" (11.60mm) | 0.079" (2.00mm) | 0.646" (16.40mm) | 0.110" (2.80mm) | Square | Gold | 7.87µin (0.200µm) | Tin | Copper Tin | Polyamide (PA46), Nylon 4/6, Glass Filled | - | -40°C ~ 163°C | 3A |
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SL LP 6 SMD 038 54 Z B TR0.635 MM, LOW PROFILE IN SMD-T |
4,107 |
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![]() Техническая документация |
SL LP 6 SMD 038 | Tape & Reel (TR) | Active | Header | Male Pin | 0.100" (2.54mm) | 54 | 2 | 0.100" (2.54mm) | All | Board to Board or Cable | Unshrouded | Surface Mount | Solder | Push-Pull | 0.150" (3.80mm) | - | - | 0.067" (1.70mm) | Square | Tin | 157.5 ~ 236.2µin (4.00 ~ 6.00µm) | Tin | Copper Tin | Polyamide (PA46), Nylon 4/6, Glass Filled | - | -40°C ~ 163°C | 3A |
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SL LP 5 SMD 066 8 Z0.635 MM, LOW PROFILE |
1,210 |
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![]() Техническая документация |
SL LP 5 SMD 066 | Tube | Active | Header | Male Pin | 0.100" (2.54mm) | 8 | 1 | - | All | Board to Board or Cable | Unshrouded | Surface Mount | Solder | Push-Pull | 0.260" (6.60mm) | - | - | 0.067" (1.70mm) | Square | Tin | 157.5 ~ 236.2µin (4.00 ~ 6.00µm) | Tin | Copper Tin | Polyamide (PA46), Nylon 4/6, Glass Filled | - | -40°C ~ 163°C | 3A |
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SL 22 139 48 GTWO ROWS, 0.635 MM |
4,728 |
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![]() Техническая документация |
SL 22 139 | Tube | Active | Header | Male Pin | 0.100" (2.54mm) | 48 | 2 | 0.100" (2.54mm) | All | Board to Board or Cable | Unshrouded | Through Hole | Solder | Push-Pull | 0.319" (8.10mm) | 0.118" (3.00mm) | 0.547" (13.90mm) | 0.110" (2.80mm) | Square | Gold | 7.87µin (0.200µm) | Gold | Copper Tin | Polyamide (PA46), Nylon 4/6, Glass Filled | - | -40°C ~ 163°C | 3A |
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SL LP 6 SMD 038 60 G0.635 MM, LOW PROFILE IN SMD-T |
3,012 |
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![]() Техническая документация |
SL LP 6 SMD 038 | Bulk | Active | Header | Male Pin | 0.100" (2.54mm) | 60 | 2 | 0.100" (2.54mm) | All | Board to Board or Cable | Unshrouded | Surface Mount | Solder | Push-Pull | 0.150" (3.80mm) | - | - | 0.067" (1.70mm) | Square | Gold | 7.87µin (0.200µm) | Gold | Copper Tin | Polyamide (PA46), Nylon 4/6, Glass Filled | - | -40°C ~ 163°C | 3A |
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SL LP 2 097 62 GLOW PROFILE, STRAIGHT, 0.635 M |
3,875 |
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![]() Техническая документация |
SL LP 2 097 | Bulk | Active | Header | Male Pin | 0.100" (2.54mm) | 62 | 2 | 0.100" (2.54mm) | All | Board to Board or Cable | Unshrouded | Through Hole | Solder | Push-Pull | 0.197" (5.00mm) | 0.118" (3.00mm) | 0.382" (9.70mm) | 0.055" (1.40mm) | Square | Gold | 7.87µin (0.200µm) | Gold | Copper Tin | Polyamide (PA46), Nylon 4/6, Glass Filled | Low Profile | -40°C ~ 163°C | 3A |