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Разъемы, штыревые контакты
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SL 14 122 4 Z0.635 MM, SANDWICH |
2,275 |
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Техническая документация |
SL 14 122 | Bulk | Active | Header | Male Pin | 0.100" (2.54mm) | 4 | 2 | 0.100" (2.54mm) | All | Board to Board or Cable | Unshrouded | Through Hole | Solder | Push-Pull | 0.433" (11.00mm) | 0.130" (3.30mm) | 1.043" (26.50mm) | 0.110" (2.80mm) | Square | Tin | 157.5 ~ 236.2µin (4.00 ~ 6.00µm) | Tin | Copper Tin | Polyamide (PA46), Nylon 4/6, Glass Filled | Sandwich | -40°C ~ 163°C | 3A |
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SL LP 5 SMD 038 28 G B TR0.635 MM, LOW PROFILE |
3,776 |
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Техническая документация |
SL LP 5 SMD 038 | Tape & Reel (TR) | Active | Header | Male Pin | 0.100" (2.54mm) | 28 | 1 | - | All | Board to Board or Cable | Unshrouded | Surface Mount | Solder | Push-Pull | 0.150" (3.80mm) | - | - | 0.067" (1.70mm) | Square | Gold | 7.87µin (0.200µm) | Gold | Copper Tin | Polyamide (PA46), Nylon 4/6, Glass Filled | - | -40°C ~ 163°C | 3A |
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SL LP 6 SMD 038 34 Z B TR PS0.635 MM, LOW PROFILE IN SMD-T |
3,056 |
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Техническая документация |
SL LP 6 SMD 038 | Tape & Reel (TR) | Active | Header | Male Pin | 0.100" (2.54mm) | 34 | 2 | 0.100" (2.54mm) | All | Board to Board or Cable | Unshrouded | Surface Mount | Solder | Push-Pull | 0.150" (3.80mm) | - | - | 0.067" (1.70mm) | Square | Tin | 157.5 ~ 236.2µin (4.00 ~ 6.00µm) | Tin | Copper Tin | Polyamide (PA46), Nylon 4/6, Glass Filled | - | -40°C ~ 163°C | 3A |
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SL 22 316 48 ZTWO ROWS, 0.635 MM |
2,955 |
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Техническая документация |
SL 22 316 | Bulk | Active | Header | Male Pin | 0.100" (2.54mm) | 48 | 2 | 0.100" (2.54mm) | All | Board to Board or Cable | Unshrouded | Through Hole | Solder | Push-Pull | 1.016" (25.80mm) | 0.118" (3.00mm) | 1.244" (31.60mm) | 0.110" (2.80mm) | Square | Tin | 157.5 ~ 236.2µin (4.00 ~ 6.00µm) | Tin | Copper Tin | Polyamide (PA46), Nylon 4/6, Glass Filled | - | -40°C ~ 163°C | 3A |
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SL LP 5 SMD 051 32 G0.635 MM, LOW PROFILE |
4,604 |
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Техническая документация |
SL LP 5 SMD 051 | Bulk | Active | Header | Male Pin | 0.100" (2.54mm) | 32 | 1 | - | All | Board to Board or Cable | Unshrouded | Surface Mount | Solder | Push-Pull | 0.201" (5.10mm) | - | - | 0.067" (1.70mm) | Square | Gold | 7.87µin (0.200µm) | Gold | Copper Tin | Polyamide (PA46), Nylon 4/6, Glass Filled | - | -40°C ~ 163°C | 3A |
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SL LP 6 SMD 038 40 Z B TR PS0.635 MM, LOW PROFILE IN SMD-T |
1,158 |
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Техническая документация |
SL LP 6 SMD 038 | Tape & Reel (TR) | Active | Header | Male Pin | 0.100" (2.54mm) | 40 | 2 | 0.100" (2.54mm) | All | Board to Board or Cable | Unshrouded | Surface Mount | Solder | Push-Pull | 0.150" (3.80mm) | - | - | 0.067" (1.70mm) | Square | Tin | 157.5 ~ 236.2µin (4.00 ~ 6.00µm) | Tin | Copper Tin | Polyamide (PA46), Nylon 4/6, Glass Filled | - | -40°C ~ 163°C | 3A |
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SL 13 265 18 Z0.635 MM, SANDWICH |
2,977 |
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Техническая документация |
SL 13 265 | Bulk | Active | Header | Male Pin | 0.100" (2.54mm) | 18 | 1 | - | All | Board to Board or Cable | Unshrouded | Through Hole | Solder | Push-Pull | 0.433" (11.00mm) | 0.130" (3.30mm) | 1.606" (40.80mm) | 0.110" (2.80mm) | Square | Gold | 7.87µin (0.200µm) | Tin | Copper Tin | Polyamide (PA46), Nylon 4/6, Glass Filled | Sandwich | -40°C ~ 163°C | 3A |
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SL LP 5 SMD 038 33 G B TR0.635 MM, LOW PROFILE |
2,413 |
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Техническая документация |
SL LP 5 SMD 038 | Tape & Reel (TR) | Active | Header | Male Pin | 0.100" (2.54mm) | 33 | 1 | - | All | Board to Board or Cable | Unshrouded | Surface Mount | Solder | Push-Pull | 0.150" (3.80mm) | - | - | 0.067" (1.70mm) | Square | Gold | 7.87µin (0.200µm) | Gold | Copper Tin | Polyamide (PA46), Nylon 4/6, Glass Filled | - | -40°C ~ 163°C | 3A |
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SL LP 6 SMD 038 48 S PS0.635 MM, LOW PROFILE IN SMD-T |
2,132 |
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Техническая документация |
SL LP 6 SMD 038 | Tube | Active | Header | Male Pin | 0.100" (2.54mm) | 48 | 2 | 0.100" (2.54mm) | All | Board to Board or Cable | Unshrouded | Surface Mount | Solder | Push-Pull | 0.150" (3.80mm) | - | - | 0.067" (1.70mm) | Square | Gold | 7.87µin (0.200µm) | Tin | Copper Tin | Polyamide (PA46), Nylon 4/6, Glass Filled | - | -40°C ~ 163°C | 3A |
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SL 2 053 36 ZTWO ROWS, 0.635 MM |
2,422 |
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Техническая документация |
SL 2 053 | Bulk | Active | Header | Male Pin | 0.100" (2.54mm) | 36 | 2 | 0.100" (2.54mm) | All | Board to Board or Cable | Unshrouded | Through Hole | Solder | Push-Pull | 0.209" (5.30mm) | 0.228" (5.80mm) | 0.547" (13.90mm) | 0.110" (2.80mm) | Square | Tin | 157.5 ~ 236.2µin (4.00 ~ 6.00µm) | Tin | Copper Tin | Polyamide (PA46), Nylon 4/6, Glass Filled | - | -40°C ~ 163°C | 3A |
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SL 22 265 28 ZTWO ROWS, 0.635 MM |
4,717 |
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Техническая документация |
SL 22 265 | Bulk | Active | Header | Male Pin | 0.100" (2.54mm) | 28 | 2 | 0.100" (2.54mm) | All | Board to Board or Cable | Unshrouded | Through Hole | Solder | Push-Pull | 0.815" (20.70mm) | 0.118" (3.00mm) | 1.043" (26.50mm) | 0.110" (2.80mm) | Square | Tin | 157.5 ~ 236.2µin (4.00 ~ 6.00µm) | Tin | Copper Tin | Polyamide (PA46), Nylon 4/6, Glass Filled | - | -40°C ~ 163°C | 3A |
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SL LP 5 SMD 066 12 G B SM0.635 MM, LOW PROFILE |
3,317 |
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Техническая документация |
SL LP 5 SMD 066 | Bulk | Active | Header | Male Pin | 0.100" (2.54mm) | 12 | 1 | - | All | Board to Board or Cable | Unshrouded | Surface Mount | Solder | Push-Pull | 0.260" (6.60mm) | - | - | 0.067" (1.70mm) | Square | Gold | 7.87µin (0.200µm) | Gold | Copper Tin | Polyamide (PA46), Nylon 4/6, Glass Filled | - | -40°C ~ 163°C | 3A |
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SL 17 SMD 109 46 G0.635 MM |
1,437 |
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Техническая документация |
SL 17 SMD 109 | Bulk | Active | Header | Male Pin | 0.100" (2.54mm) | 46 | 2 | 0.100" (2.54mm) | All | Board to Board or Cable | Unshrouded | Surface Mount | Solder | Push-Pull | 0.429" (10.90mm) | - | - | 0.110" (2.80mm) | Square | Gold | 7.87µin (0.200µm) | Gold | Copper Tin | Polyamide (PA46), Nylon 4/6, Glass Filled | - | -40°C ~ 163°C | 3A |
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SL 13 235 27 Z0.635 MM, SANDWICH |
4,234 |
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Техническая документация |
SL 13 235 | Bulk | Active | Header | Male Pin | 0.100" (2.54mm) | 27 | 1 | - | All | Board to Board or Cable | Unshrouded | Through Hole | Solder | Push-Pull | 0.433" (11.00mm) | 0.130" (3.30mm) | 1.488" (37.80mm) | 0.110" (2.80mm) | Square | Tin | 157.5 ~ 236.2µin (4.00 ~ 6.00µm) | Tin | Copper Tin | Polyamide (PA46), Nylon 4/6, Glass Filled | Sandwich | -40°C ~ 163°C | 3A |
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SL LP 5 SMD 051 5 S B SM0.635 MM, LOW PROFILE |
3,858 |
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Техническая документация |
SL LP 5 SMD 051 | Tube | Active | Header | Male Pin | 0.100" (2.54mm) | 5 | 1 | - | All | Board to Board or Cable | Unshrouded | Surface Mount | Solder | Push-Pull | 0.201" (5.10mm) | - | - | 0.067" (1.70mm) | Square | Gold | 7.87µin (0.200µm) | Tin | Copper Tin | Polyamide (PA46), Nylon 4/6, Glass Filled | - | -40°C ~ 163°C | 3A |
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SL 17 SMD 109 44 G0.635 MM |
1,590 |
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Техническая документация |
SL 17 SMD 109 | Bulk | Active | Header | Male Pin | 0.100" (2.54mm) | 44 | 2 | 0.100" (2.54mm) | All | Board to Board or Cable | Unshrouded | Surface Mount | Solder | Push-Pull | 0.429" (10.90mm) | - | - | 0.110" (2.80mm) | Square | Gold | 7.87µin (0.200µm) | Gold | Copper Tin | Polyamide (PA46), Nylon 4/6, Glass Filled | - | -40°C ~ 163°C | 3A |
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SL 14 097 38 G0.635 MM, SANDWICH |
3,374 |
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Техническая документация |
SL 14 097 | Bulk | Active | Header | Male Pin | 0.100" (2.54mm) | 38 | 2 | 0.100" (2.54mm) | All | Board to Board or Cable | Unshrouded | Through Hole | Solder | Push-Pull | 0.433" (11.00mm) | 0.130" (3.30mm) | 0.945" (24.00mm) | 0.110" (2.80mm) | Square | Gold | 7.87µin (0.200µm) | Gold | Copper Tin | Polyamide (PA46), Nylon 4/6, Glass Filled | Sandwich | -40°C ~ 163°C | 3A |
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SL LP 5 SMD 051 19 S B TR0.635 MM, LOW PROFILE |
3,104 |
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Техническая документация |
SL LP 5 SMD 051 | Tape & Reel (TR) | Active | Header | Male Pin | 0.100" (2.54mm) | 19 | 1 | - | All | Board to Board or Cable | Unshrouded | Surface Mount | Solder | Push-Pull | 0.201" (5.10mm) | - | - | 0.067" (1.70mm) | Square | Gold | 7.87µin (0.200µm) | Tin | Copper Tin | Polyamide (PA46), Nylon 4/6, Glass Filled | - | -40°C ~ 163°C | 3A |
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SL LP 6 SMD 038 44 G SM0.635 MM, LOW PROFILE IN SMD-T |
4,396 |
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Техническая документация |
SL LP 6 SMD 038 | Bulk | Active | Header | Male Pin | 0.100" (2.54mm) | 44 | 2 | 0.100" (2.54mm) | All | Board to Board or Cable | Unshrouded | Surface Mount | Solder | Push-Pull | 0.150" (3.80mm) | - | - | 0.067" (1.70mm) | Square | Gold | 7.87µin (0.200µm) | Gold | Copper Tin | Polyamide (PA46), Nylon 4/6, Glass Filled | - | -40°C ~ 163°C | 3A |
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SL 22 265 12 STWO ROWS, 0.635 MM |
3,670 |
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Техническая документация |
SL 22 265 | Bulk | Active | Header | Male Pin | 0.100" (2.54mm) | 12 | 2 | 0.100" (2.54mm) | All | Board to Board or Cable | Unshrouded | Through Hole | Solder | Push-Pull | 0.815" (20.70mm) | 0.118" (3.00mm) | 1.043" (26.50mm) | 0.110" (2.80mm) | Square | Gold | 7.87µin (0.200µm) | Tin | Copper Tin | Polyamide (PA46), Nylon 4/6, Glass Filled | - | -40°C ~ 163°C | 3A |
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