Фото | Парт. № производителя | Наличие | Количество | Техническая документация | Серия | Упаковка | Состояние продукта | Тип разъема | Тип контакта | Шаг - Сопряжение | Количество положений | Количество рядов | Расстояние между рядами - Сопряжение | Количество загруженных позиций | Стиль | Защита | Тип крепления | Оконечная нагрузка | Тип крепления | Длина контакта - Сопряжение | Длина контакта - Пост | Общая длина контакта | Высота изоляции | Форма контакта | Отделка контакта - Сопряжение | Толщина отделки контакта - Сопряжение | Отделка контакта - Пост | Материал контакта | Материал изоляции | Особенности | Рабочая температура | Номинальный ток (Ампер) |
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SL 22 214 24 ZTWO ROWS, 0.635 MM |
3,384 |
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![]() Техническая документация |
SL 22 214 | Bulk | Active | Header | Male Pin | 0.100" (2.54mm) | 24 | 2 | 0.100" (2.54mm) | All | Board to Board or Cable | Unshrouded | Through Hole | Solder | Push-Pull | 0.614" (15.60mm) | 0.118" (3.00mm) | 0.845" (21.40mm) | 0.110" (2.80mm) | Square | Tin | 157.5 ~ 236.2µin (4.00 ~ 6.00µm) | Tin | Copper Tin | Polyamide (PA46), Nylon 4/6, Glass Filled | - | -40°C ~ 163°C | 3A |
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SL 11 SMD 078 48 S0.635 MM... PACK |
2,076 |
|
![]() Техническая документация |
SL 11 SMD 078 | - | Active | Header | Male Pin | 0.100" (2.54mm) | 48 | 2 | 0.100" (2.54mm) | All | Board to Board or Cable | Unshrouded | Surface Mount | Solder | Push-Pull | 0.323" (8.20mm) | - | - | 0.110" (2.80mm) | Square | Gold | 7.87µin (0.200µm) | Tin | Copper Tin | Polyamide (PA46), Nylon 4/6, Glass Filled | - | -40°C ~ 163°C | 3A |
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SL 16 SMD 157 26 S0.635 MM FOR INTERCONNECTION |
3,228 |
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![]() Техническая документация |
SL 16 SMD 157 | - | Active | Header | Male Pin | 0.100" (2.54mm) | 26 | 2 | 0.100" (2.54mm) | All | Board to Board or Cable | Unshrouded | Surface Mount | Solder | Push-Pull | 0.236" (6.00mm) | - | - | 0.110" (2.80mm) | Square | Gold | 7.87µin (0.200µm) | Tin | Copper Tin | Polyamide (PA46), Nylon 4/6, Glass Filled | - | -40°C ~ 163°C | 3A |
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SL 22 124 38 ZTWO ROWS, 0.635 MM |
4,912 |
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![]() Техническая документация |
SL 22 124 | Bulk | Active | Header | Male Pin | 0.100" (2.54mm) | 38 | 2 | 0.100" (2.54mm) | All | Board to Board or Cable | Unshrouded | Through Hole | Solder | Push-Pull | 0.260" (6.60mm) | 0.118" (3.00mm) | 0.488" (12.40mm) | 0.110" (2.80mm) | Square | Tin | 157.5 ~ 236.2µin (4.00 ~ 6.00µm) | Tin | Copper Tin | Polyamide (PA46), Nylon 4/6, Glass Filled | - | -40°C ~ 163°C | 3A |
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SL 11 SMD 078 32 G B TR0.635 MM... PACK |
1,878 |
|
![]() Техническая документация |
SL 11 SMD 078 | Tape & Reel (TR) | Active | Header | Male Pin | 0.100" (2.54mm) | 32 | 2 | 0.100" (2.54mm) | All | Board to Board or Cable | Unshrouded | Surface Mount | Solder | Push-Pull | 0.323" (8.20mm) | - | - | 0.110" (2.80mm) | Square | Gold | 7.87µin (0.200µm) | Gold | Copper Tin | Polyamide (PA46), Nylon 4/6, Glass Filled | - | -40°C ~ 163°C | 3A |
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SL 15 SMD 107 12 S0.635 MM FOR INTERCONNECTION |
1,655 |
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![]() Техническая документация |
SL 15 SMD 107 | Bulk | Active | Header | Male Pin | 0.100" (2.54mm) | 12 | 1 | - | All | Board to Board or Cable | Unshrouded | Surface Mount | Solder | Push-Pull | 0.236" (6.00mm) | - | - | 0.110" (2.80mm) | Square | Gold | 7.87µin (0.200µm) | Tin | Copper Tin | Polyamide (PA46), Nylon 4/6, Glass Filled | - | -40°C ~ 163°C | 3A |
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SL 22 164 64 ZTWO ROWS, 0.635 MM |
1,642 |
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![]() Техническая документация |
SL 22 164 | - | Active | Header | Male Pin | 0.100" (2.54mm) | 64 | 2 | 0.100" (2.54mm) | All | Board to Board or Cable | Unshrouded | Through Hole | Solder | Push-Pull | 0.417" (10.60mm) | 0.118" (3.00mm) | 0.646" (16.40mm) | 0.110" (2.80mm) | Square | Tin | 157.5 ~ 236.2µin (4.00 ~ 6.00µm) | Tin | Copper Tin | Polyamide (PA46), Nylon 4/6, Glass Filled | - | -40°C ~ 163°C | 3A |
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SL 11 SMD 104 70 G B SM0.635 MM... PACK |
2,246 |
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![]() Техническая документация |
SL 11 SMD 104 | Tube | Active | Header | Male Pin | 0.100" (2.54mm) | 70 | 2 | 0.100" (2.54mm) | All | Board to Board or Cable | Unshrouded | Surface Mount | Solder | Push-Pull | 0.425" (10.80mm) | - | - | 0.110" (2.80mm) | Square | Gold | 7.87µin (0.200µm) | Gold | Copper Tin | Polyamide (PA46), Nylon 4/6, Glass Filled | - | -40°C ~ 163°C | 3A |
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SL 16 SMD 157 48 S0.635 MM FOR INTERCONNECTION |
1,302 |
|
![]() Техническая документация |
SL 16 SMD 157 | Tube | Active | Header | Male Pin | 0.100" (2.54mm) | 48 | 2 | 0.100" (2.54mm) | All | Board to Board or Cable | Unshrouded | Surface Mount | Solder | Push-Pull | 0.236" (6.00mm) | - | - | 0.110" (2.80mm) | Square | Gold | 7.87µin (0.200µm) | Tin | Copper Tin | Polyamide (PA46), Nylon 4/6, Glass Filled | - | -40°C ~ 163°C | 3A |
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SL 5 223 30 GONE ROW, 0.635 MM |
2,773 |
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![]() Техническая документация |
SL 5 223 | Bulk | Active | Header | Male Pin | 0.100" (2.54mm) | 30 | 1 | - | All | Board to Board or Cable | Unshrouded | Through Hole | Solder | Push-Pull | 0.236" (6.00mm) | 0.130" (3.30mm) | 1.244" (31.60mm) | 0.110" (2.80mm) | Square | Gold | 7.87µin (0.200µm) | Gold | Copper Tin | Polyamide (PA46), Nylon 4/6, Glass Filled | Sandwich | -40°C ~ 163°C | 3A |
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SL 16 SMD 107 34 Z P0.635 MM FOR INTERCONNECTION |
4,960 |
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![]() Техническая документация |
SL 16 SMD 107 | Bulk | Active | Header | Male Pin | 0.100" (2.54mm) | 34 | 2 | 0.100" (2.54mm) | All | Board to Board or Cable | Unshrouded | Surface Mount | Solder | Push-Pull | 0.236" (6.00mm) | - | - | 0.110" (2.80mm) | Square | Tin | 157.5 ~ 236.2µin (4.00 ~ 6.00µm) | Tin | Copper Tin | Polyamide (PA46), Nylon 4/6, Glass Filled | - | -40°C ~ 163°C | 3A |
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SLV W 4 KA 036 62 ZGRID 1.27 X1.27 MM; SUITABLE FO |
3,482 |
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![]() Техническая документация |
SLV W 4 KA 036 | Tube | Active | Header | Male Pin | 0.050" (1.27mm) | 62 | 2 | 0.050" (1.27mm) | All | Board to Board or Cable | Unshrouded | Through Hole | Solder | Push-Pull | 0.142" (3.60mm) | 0.098" (2.50mm) | - | 0.067" (1.70mm) | Square | Tin | 157.5 ~ 236.2µin (4.00 ~ 6.00µm) | Tin | Copper Zinc | Polyamide (PA46), Nylon 4/6, Glass Filled | - | -40°C ~ 163°C | 1.5A |
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SL 14 365 46 Z0.635 MM, SANDWICH |
1,529 |
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![]() Техническая документация |
SL 14 365 Z | Bulk | Active | Header | Male Pin | 0.100" (2.54mm) | 46 | 2 | 0.100" (2.54mm) | All | Board to Board or Cable | Unshrouded | Through Hole | Solder | Push-Pull | 0.433" (11.00mm) | 0.130" (3.30mm) | 2.000" (50.80mm) | 0.110" (2.80mm) | Square | Gold | 7.87µin (0.200µm) | Tin | Copper Tin | Polyamide (PA46), Nylon 4/6, Glass Filled | Sandwich | -40°C ~ 163°C | 3A |
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SL 16 SMD 107 34 G P0.635 MM FOR INTERCONNECTION |
4,200 |
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![]() Техническая документация |
SL 16 SMD 107 | Bulk | Active | Header | Male Pin | 0.100" (2.54mm) | 34 | 2 | 0.100" (2.54mm) | All | Board to Board or Cable | Unshrouded | Surface Mount | Solder | Push-Pull | 0.236" (6.00mm) | - | - | 0.110" (2.80mm) | Square | Gold | 7.87µin (0.200µm) | Gold | Copper Tin | Polyamide (PA46), Nylon 4/6, Glass Filled | - | -40°C ~ 163°C | 3A |
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SL 5 223 10 SONE ROW, 0.635 MM |
3,412 |
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![]() Техническая документация |
SL 5 223 | Bulk | Active | Header | Male Pin | 0.100" (2.54mm) | 10 | 1 | - | All | Board to Board or Cable | Unshrouded | Through Hole | Solder | Push-Pull | 0.236" (6.00mm) | 0.130" (3.30mm) | 1.244" (31.60mm) | 0.110" (2.80mm) | Square | Gold | 7.87µin (0.200µm) | Tin | Copper Tin | Polyamide (PA46), Nylon 4/6, Glass Filled | Sandwich | -40°C ~ 163°C | 3A |
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SL 5 147 27 GONE ROW, 0.635 MM |
3,462 |
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![]() Техническая документация |
SL 5 147 | Bulk | Active | Header | Male Pin | 0.100" (2.54mm) | 27 | 1 | - | All | Board to Board or Cable | Unshrouded | Through Hole | Solder | Push-Pull | 0.236" (6.00mm) | 0.130" (3.30mm) | 0.945" (24.00mm) | 0.110" (2.80mm) | Square | Gold | 7.87µin (0.200µm) | Gold | Copper Tin | Polyamide (PA46), Nylon 4/6, Glass Filled | Sandwich | -40°C ~ 163°C | 3A |
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SL 16 SMD 107 30 G0.635 MM FOR INTERCONNECTION |
2,072 |
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![]() Техническая документация |
SL 16 SMD 107 | Bulk | Active | Header | Male Pin | 0.100" (2.54mm) | 30 | 2 | 0.100" (2.54mm) | All | Board to Board or Cable | Unshrouded | Surface Mount | Solder | Push-Pull | 0.236" (6.00mm) | - | - | 0.110" (2.80mm) | Square | Gold | 7.87µin (0.200µm) | Gold | Copper Tin | Polyamide (PA46), Nylon 4/6, Glass Filled | - | -40°C ~ 163°C | 3A |
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SLV W 4 KA 036 48 ZGRID 1.27 X1.27 MM; SUITABLE FO |
2,977 |
|
![]() Техническая документация |
SLV W 4 KA 036 | Bulk | Active | Header | Male Pin | 0.050" (1.27mm) | 48 | 2 | 0.050" (1.27mm) | All | Board to Board or Cable | Unshrouded | Through Hole | Solder | Push-Pull | 0.142" (3.60mm) | 0.098" (2.50mm) | - | 0.067" (1.70mm) | Square | Tin | 157.5 ~ 236.2µin (4.00 ~ 6.00µm) | Tin | Copper Zinc | Polyamide (PA46), Nylon 4/6, Glass Filled | - | -40°C ~ 163°C | 1.5A |
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SL 13 122 30 G0.635 MM, SANDWICH |
3,668 |
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![]() Техническая документация |
SL 13 122 | Bulk | Active | Header | Male Pin | 0.100" (2.54mm) | 30 | 1 | - | All | Board to Board or Cable | Unshrouded | Through Hole | Solder | Push-Pull | 0.433" (11.00mm) | 0.130" (3.30mm) | 1.043" (26.50mm) | 0.110" (2.80mm) | Square | Gold | 7.87µin (0.200µm) | Gold | Copper Tin | Polyamide (PA46), Nylon 4/6, Glass Filled | Sandwich | -40°C ~ 163°C | 3A |
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SL 14 365 8 G0.635 MM, SANDWICH |
4,410 |
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![]() Техническая документация |
SL 14 365 G | Bulk | Active | Header | Male Pin | 0.100" (2.54mm) | 8 | 2 | 0.100" (2.54mm) | All | Board to Board or Cable | Unshrouded | Through Hole | Solder | Push-Pull | 0.433" (11.00mm) | 0.130" (3.30mm) | 2.000" (50.80mm) | 0.110" (2.80mm) | Square | Gold | 7.87µin (0.200µm) | Tin | Copper Tin | Polyamide (PA46), Nylon 4/6, Glass Filled | Sandwich | -40°C ~ 163°C | 3A |